JPS5665021A - Curable resin composition - Google Patents

Curable resin composition

Info

Publication number
JPS5665021A
JPS5665021A JP14074679A JP14074679A JPS5665021A JP S5665021 A JPS5665021 A JP S5665021A JP 14074679 A JP14074679 A JP 14074679A JP 14074679 A JP14074679 A JP 14074679A JP S5665021 A JPS5665021 A JP S5665021A
Authority
JP
Japan
Prior art keywords
group
groups
cleavage
bond
represented
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14074679A
Other languages
Japanese (ja)
Other versions
JPS6320256B2 (en
Inventor
Akio Nishihara
Hiroshi Tsuchiya
Jinichi Omi
Yoshikazu Shoji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeka Corp
Original Assignee
Asahi Denka Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Denka Kogyo KK filed Critical Asahi Denka Kogyo KK
Priority to JP14074679A priority Critical patent/JPS5665021A/en
Publication of JPS5665021A publication Critical patent/JPS5665021A/en
Publication of JPS6320256B2 publication Critical patent/JPS6320256B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: Titled composition which has excellent curability and provides cured products having excellent hardness, mechanical strength, elongation, flexibility, etc., comprising a polythiol compound and a specified polyene compound.
CONSTITUTION: (a) A polythiol compound, MW80W10,000, viscosity at 50°C 0W 10,000 poises, represented by the formula: A-(SH)q, wherein A is a q-valent organic residue free from unsaturated bonds reactive with SH groups and q≥2, is mixed with (b) a polyene compound having, in the molecule, at least two C-C double bonds, represented by the formula, wherein R is H, phenyl or a 1W10C alkyl and Y is a group consisting of a homogeneous, blocked or random arrangement of groups derived by ring opening by the cleavage of the C-O bond of the epoxy group of epoxy compounds such as ethylene oxide, propylene oxide, butylene oxide, etc., provided that Y contains at least one group derived by ring opening by the cleavage of the C-O bond of the epoxy group of alloy glycidyl ether, so that the eq. ratio of the C-C double bonds to the thiol groups is 0.75W1.0/1.
COPYRIGHT: (C)1981,JPO&Japio
JP14074679A 1979-10-31 1979-10-31 Curable resin composition Granted JPS5665021A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14074679A JPS5665021A (en) 1979-10-31 1979-10-31 Curable resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14074679A JPS5665021A (en) 1979-10-31 1979-10-31 Curable resin composition

Publications (2)

Publication Number Publication Date
JPS5665021A true JPS5665021A (en) 1981-06-02
JPS6320256B2 JPS6320256B2 (en) 1988-04-27

Family

ID=15275756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14074679A Granted JPS5665021A (en) 1979-10-31 1979-10-31 Curable resin composition

Country Status (1)

Country Link
JP (1) JPS5665021A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60106834A (en) * 1983-11-14 1985-06-12 Showa Highpolymer Co Ltd Room temperature-curable composition
JPS60108430A (en) * 1983-11-18 1985-06-13 Showa Highpolymer Co Ltd Composition curable at ordinary temperature
JPS60110725A (en) * 1983-11-22 1985-06-17 Showa Highpolymer Co Ltd Room temperature-curable composition

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS647267A (en) * 1987-06-30 1989-01-11 Takara Co Ltd Image processing device for drawing image

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60106834A (en) * 1983-11-14 1985-06-12 Showa Highpolymer Co Ltd Room temperature-curable composition
JPH0333178B2 (en) * 1983-11-14 1991-05-16 Showa Highpolymer
JPS60108430A (en) * 1983-11-18 1985-06-13 Showa Highpolymer Co Ltd Composition curable at ordinary temperature
JPH0333179B2 (en) * 1983-11-18 1991-05-16 Showa Highpolymer
JPS60110725A (en) * 1983-11-22 1985-06-17 Showa Highpolymer Co Ltd Room temperature-curable composition
JPH0333180B2 (en) * 1983-11-22 1991-05-16 Showa Highpolymer

Also Published As

Publication number Publication date
JPS6320256B2 (en) 1988-04-27

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