JPS5670022A - Epoxy resin, its preparation, and its composition - Google Patents
Epoxy resin, its preparation, and its compositionInfo
- Publication number
- JPS5670022A JPS5670022A JP14536179A JP14536179A JPS5670022A JP S5670022 A JPS5670022 A JP S5670022A JP 14536179 A JP14536179 A JP 14536179A JP 14536179 A JP14536179 A JP 14536179A JP S5670022 A JPS5670022 A JP S5670022A
- Authority
- JP
- Japan
- Prior art keywords
- formula
- product
- epoxy resin
- epihalohydrin
- pref
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
Abstract
PURPOSE: To prepare the titled novel composition having specific structural formula, physical properties, low viscosity, and high heat resistance, etc., and useful as a solventless paint, by reacting bis(hydroxyphenyl)ethane with an epihalohydrin, etc.
CONSTITUTION: The objective liquid epoxy resin having the structure of formula II (X is bivalent residue obtained by eliminating H from OH of the compound of formula I; n is number of recurring units) is prepared by reacting (1mol of) 1,1- bis(hydroxyphenyl)ethane of formula I with (pref. 45W40mol of) an epihalohydrin and/or a dihalohydrin. The value of the formula A×B/(A+B) of the product is 170W190, pref. 171W185, wherein A is epoxy equivalent and B is hydrolyzable halogen equivalent of the product.
EFFECT: The viscosity of the product is extremely low, i.e. 2,500W7,000cps at 25°C.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14536179A JPS5670022A (en) | 1979-11-12 | 1979-11-12 | Epoxy resin, its preparation, and its composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14536179A JPS5670022A (en) | 1979-11-12 | 1979-11-12 | Epoxy resin, its preparation, and its composition |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6408287A Division JPS62253669A (en) | 1987-03-20 | 1987-03-20 | Coating epoxy resin composition |
| JP6408387A Division JPS62253612A (en) | 1987-03-20 | 1987-03-20 | Epoxy resin composition for electrical insulating material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5670022A true JPS5670022A (en) | 1981-06-11 |
| JPS6239606B2 JPS6239606B2 (en) | 1987-08-24 |
Family
ID=15383416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14536179A Granted JPS5670022A (en) | 1979-11-12 | 1979-11-12 | Epoxy resin, its preparation, and its composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5670022A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6069125A (en) * | 1983-09-27 | 1985-04-19 | Hitachi Chem Co Ltd | Epoxy resin composition |
| JPS60106825A (en) * | 1983-11-14 | 1985-06-12 | Toshiba Chem Corp | Impregnating epoxy resin composition |
| JP2013087124A (en) * | 2011-10-13 | 2013-05-13 | Mitsubishi Rayon Co Ltd | Epoxy resin composition |
| WO2019098053A1 (en) * | 2017-11-14 | 2019-05-23 | 株式会社弘輝 | Resin composition for reinforcement and electronic component device |
-
1979
- 1979-11-12 JP JP14536179A patent/JPS5670022A/en active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6069125A (en) * | 1983-09-27 | 1985-04-19 | Hitachi Chem Co Ltd | Epoxy resin composition |
| JPS60106825A (en) * | 1983-11-14 | 1985-06-12 | Toshiba Chem Corp | Impregnating epoxy resin composition |
| JP2013087124A (en) * | 2011-10-13 | 2013-05-13 | Mitsubishi Rayon Co Ltd | Epoxy resin composition |
| WO2019098053A1 (en) * | 2017-11-14 | 2019-05-23 | 株式会社弘輝 | Resin composition for reinforcement and electronic component device |
| JPWO2019098053A1 (en) * | 2017-11-14 | 2020-11-19 | 株式会社弘輝 | Reinforcing resin composition and electronic component equipment |
| US11447626B2 (en) | 2017-11-14 | 2022-09-20 | Koki Company Limited | Resin composition for reinforcement and electronic component device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6239606B2 (en) | 1987-08-24 |
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