JPS6452768A - Epoxy compound and epoxy polymer composition containing said compound as essential component - Google Patents

Epoxy compound and epoxy polymer composition containing said compound as essential component

Info

Publication number
JPS6452768A
JPS6452768A JP63127350A JP12735088A JPS6452768A JP S6452768 A JPS6452768 A JP S6452768A JP 63127350 A JP63127350 A JP 63127350A JP 12735088 A JP12735088 A JP 12735088A JP S6452768 A JPS6452768 A JP S6452768A
Authority
JP
Japan
Prior art keywords
compound
epoxy
formula
composition containing
polymer composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63127350A
Other languages
Japanese (ja)
Other versions
JP2509673B2 (en
Inventor
Toshimasa Takada
Hideo Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Petrochemical Industries Ltd
Original Assignee
Mitsui Petrochemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Petrochemical Industries Ltd filed Critical Mitsui Petrochemical Industries Ltd
Priority to JP63127350A priority Critical patent/JP2509673B2/en
Publication of JPS6452768A publication Critical patent/JPS6452768A/en
Application granted granted Critical
Publication of JP2509673B2 publication Critical patent/JP2509673B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Epoxy Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

NEW MATERIAL:An epoxy compound expressed by formula I (n is 0-30; R<1>-R<3> are H or 1-6C alkyl; R<4> is tertiary alkyl). EXAMPLE:1,1-Bis(2-methyl-4-hydroxy-5-tert-butylphenyl)butane. USE:A constituent component of epoxy polymers capable of providing cured epoxy polymers having high heat resistance, excellent mechanical characteristics and low dielectric constant. PREPARATION:Bisphenols expressed by formula II are reacted with epichlorohydrin at 1:3-30 molar ratio to afford the aimed compound expressed by formula I.
JP63127350A 1987-05-29 1988-05-25 Epoxy compound and epoxy resin composition containing this as an essential component Expired - Fee Related JP2509673B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63127350A JP2509673B2 (en) 1987-05-29 1988-05-25 Epoxy compound and epoxy resin composition containing this as an essential component

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62-134393 1987-05-29
JP13439387 1987-05-29
JP63127350A JP2509673B2 (en) 1987-05-29 1988-05-25 Epoxy compound and epoxy resin composition containing this as an essential component

Publications (2)

Publication Number Publication Date
JPS6452768A true JPS6452768A (en) 1989-02-28
JP2509673B2 JP2509673B2 (en) 1996-06-26

Family

ID=26463321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63127350A Expired - Fee Related JP2509673B2 (en) 1987-05-29 1988-05-25 Epoxy compound and epoxy resin composition containing this as an essential component

Country Status (1)

Country Link
JP (1) JP2509673B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4970952A (en) * 1989-02-14 1990-11-20 Shachihata Industrial Co., Ltd. Date-stamping apparatus
JPH0967553A (en) * 1995-08-31 1997-03-11 Sumitomo Bakelite Co Ltd Resin paste for die bonding
JP2017048337A (en) * 2015-09-03 2017-03-09 三菱化学株式会社 Epoxy resin, epoxy resin composition, cured product, and electric/electronic component
JP2018100320A (en) * 2016-12-19 2018-06-28 Dic株式会社 Epoxy resin, curable resin composition and cured product thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5218180A (en) * 1975-08-01 1977-02-10 Mitsubishi Electric Corp Constant voltage diode

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5218180A (en) * 1975-08-01 1977-02-10 Mitsubishi Electric Corp Constant voltage diode

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4970952A (en) * 1989-02-14 1990-11-20 Shachihata Industrial Co., Ltd. Date-stamping apparatus
JPH0967553A (en) * 1995-08-31 1997-03-11 Sumitomo Bakelite Co Ltd Resin paste for die bonding
JP2017048337A (en) * 2015-09-03 2017-03-09 三菱化学株式会社 Epoxy resin, epoxy resin composition, cured product, and electric/electronic component
JP2018100320A (en) * 2016-12-19 2018-06-28 Dic株式会社 Epoxy resin, curable resin composition and cured product thereof

Also Published As

Publication number Publication date
JP2509673B2 (en) 1996-06-26

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees