JPS6452768A - Epoxy compound and epoxy polymer composition containing said compound as essential component - Google Patents
Epoxy compound and epoxy polymer composition containing said compound as essential componentInfo
- Publication number
- JPS6452768A JPS6452768A JP63127350A JP12735088A JPS6452768A JP S6452768 A JPS6452768 A JP S6452768A JP 63127350 A JP63127350 A JP 63127350A JP 12735088 A JP12735088 A JP 12735088A JP S6452768 A JPS6452768 A JP S6452768A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- epoxy
- formula
- composition containing
- polymer composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
NEW MATERIAL:An epoxy compound expressed by formula I (n is 0-30; R<1>-R<3> are H or 1-6C alkyl; R<4> is tertiary alkyl). EXAMPLE:1,1-Bis(2-methyl-4-hydroxy-5-tert-butylphenyl)butane. USE:A constituent component of epoxy polymers capable of providing cured epoxy polymers having high heat resistance, excellent mechanical characteristics and low dielectric constant. PREPARATION:Bisphenols expressed by formula II are reacted with epichlorohydrin at 1:3-30 molar ratio to afford the aimed compound expressed by formula I.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63127350A JP2509673B2 (en) | 1987-05-29 | 1988-05-25 | Epoxy compound and epoxy resin composition containing this as an essential component |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62-134393 | 1987-05-29 | ||
JP13439387 | 1987-05-29 | ||
JP63127350A JP2509673B2 (en) | 1987-05-29 | 1988-05-25 | Epoxy compound and epoxy resin composition containing this as an essential component |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6452768A true JPS6452768A (en) | 1989-02-28 |
JP2509673B2 JP2509673B2 (en) | 1996-06-26 |
Family
ID=26463321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63127350A Expired - Fee Related JP2509673B2 (en) | 1987-05-29 | 1988-05-25 | Epoxy compound and epoxy resin composition containing this as an essential component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2509673B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4970952A (en) * | 1989-02-14 | 1990-11-20 | Shachihata Industrial Co., Ltd. | Date-stamping apparatus |
JPH0967553A (en) * | 1995-08-31 | 1997-03-11 | Sumitomo Bakelite Co Ltd | Resin paste for die bonding |
JP2017048337A (en) * | 2015-09-03 | 2017-03-09 | 三菱化学株式会社 | Epoxy resin, epoxy resin composition, cured product, and electric/electronic component |
JP2018100320A (en) * | 2016-12-19 | 2018-06-28 | Dic株式会社 | Epoxy resin, curable resin composition and cured product thereof |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5218180A (en) * | 1975-08-01 | 1977-02-10 | Mitsubishi Electric Corp | Constant voltage diode |
-
1988
- 1988-05-25 JP JP63127350A patent/JP2509673B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5218180A (en) * | 1975-08-01 | 1977-02-10 | Mitsubishi Electric Corp | Constant voltage diode |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4970952A (en) * | 1989-02-14 | 1990-11-20 | Shachihata Industrial Co., Ltd. | Date-stamping apparatus |
JPH0967553A (en) * | 1995-08-31 | 1997-03-11 | Sumitomo Bakelite Co Ltd | Resin paste for die bonding |
JP2017048337A (en) * | 2015-09-03 | 2017-03-09 | 三菱化学株式会社 | Epoxy resin, epoxy resin composition, cured product, and electric/electronic component |
JP2018100320A (en) * | 2016-12-19 | 2018-06-28 | Dic株式会社 | Epoxy resin, curable resin composition and cured product thereof |
Also Published As
Publication number | Publication date |
---|---|
JP2509673B2 (en) | 1996-06-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |