JPS5734118A - One-component epoxy resin composition - Google Patents

One-component epoxy resin composition

Info

Publication number
JPS5734118A
JPS5734118A JP10774380A JP10774380A JPS5734118A JP S5734118 A JPS5734118 A JP S5734118A JP 10774380 A JP10774380 A JP 10774380A JP 10774380 A JP10774380 A JP 10774380A JP S5734118 A JPS5734118 A JP S5734118A
Authority
JP
Japan
Prior art keywords
epoxy resin
metal
dicyandiamide
type epoxy
diglycidyl ether
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10774380A
Other languages
Japanese (ja)
Inventor
Hikoji Yoshimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Jiyushi Kenkyusho Kk
DAINIPPON JUSHI KENKYUSHO KK
Original Assignee
Dainippon Jiyushi Kenkyusho Kk
DAINIPPON JUSHI KENKYUSHO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Jiyushi Kenkyusho Kk, DAINIPPON JUSHI KENKYUSHO KK filed Critical Dainippon Jiyushi Kenkyusho Kk
Priority to JP10774380A priority Critical patent/JPS5734118A/en
Publication of JPS5734118A publication Critical patent/JPS5734118A/en
Pending legal-status Critical Current

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  • Epoxy Resins (AREA)

Abstract

PURPOSE: Titled composition having a long pot life and excellent curability, prepared by dispersing dicyandiamide and an imidazole compound in the form of solid powder in a liquid diglycidyl ether bisphenol A type epoxy resin.
CONSTITUTION: One hundred (100) pts.wt. liquid diglycidyl ether bisphenol A type epoxy resin (A) is mixed and kneaded with 2W15pts.wt. dicyandiamide (B), 0.2W 5pts.wt. imidazole compound (C), m.p. ≥140°C, e.g., 2-methylimidazole, as a curing acelerator and 0.2W5pts.wt. reaction product (D) of 1mol of a metal alcoholate, a metal acetylacetonate in which the metal is tetravalent, or boric acid, e.g., isopropyltrimethacryl titanate with 0.5W2.0mol of triethanolamine, so as to disperse components B and C in the form of solid powder in component A at room temperature.
COPYRIGHT: (C)1982,JPO&Japio
JP10774380A 1980-08-07 1980-08-07 One-component epoxy resin composition Pending JPS5734118A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10774380A JPS5734118A (en) 1980-08-07 1980-08-07 One-component epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10774380A JPS5734118A (en) 1980-08-07 1980-08-07 One-component epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS5734118A true JPS5734118A (en) 1982-02-24

Family

ID=14466827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10774380A Pending JPS5734118A (en) 1980-08-07 1980-08-07 One-component epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5734118A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01113423A (en) * 1987-10-27 1989-05-02 Mitsubishi Electric Corp Thermostetting insulating resin paste
EP0662488A1 (en) * 1994-01-07 1995-07-12 Ajinomoto Co., Inc. Epoxy-resin composition
US5439952A (en) * 1993-12-21 1995-08-08 The Thompson Minwax Company Self-curing coating composition exhibiting reduced discoloration upon storage
US5620789A (en) * 1990-05-21 1997-04-15 The Dow Chemical Company Cure inhibited epoxy resin compositions and laminates prepared from the compositions
EP0807516A1 (en) * 1996-05-17 1997-11-19 Elf Atochem S.A. Material comprising of a film coated with a silicon oxide layer and a polyolefin film
US5721323A (en) * 1990-05-21 1998-02-24 The Dow Chemical Company Cure inhibited epoxy resin compositions and laminates prepared from the compositions
EP1700874A1 (en) * 2003-12-16 2006-09-13 Toyo Boseki Kabushiki Kaisha Curable composition

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01113423A (en) * 1987-10-27 1989-05-02 Mitsubishi Electric Corp Thermostetting insulating resin paste
US5620789A (en) * 1990-05-21 1997-04-15 The Dow Chemical Company Cure inhibited epoxy resin compositions and laminates prepared from the compositions
US5721323A (en) * 1990-05-21 1998-02-24 The Dow Chemical Company Cure inhibited epoxy resin compositions and laminates prepared from the compositions
US5439952A (en) * 1993-12-21 1995-08-08 The Thompson Minwax Company Self-curing coating composition exhibiting reduced discoloration upon storage
EP0662488A1 (en) * 1994-01-07 1995-07-12 Ajinomoto Co., Inc. Epoxy-resin composition
EP0807516A1 (en) * 1996-05-17 1997-11-19 Elf Atochem S.A. Material comprising of a film coated with a silicon oxide layer and a polyolefin film
FR2748686A1 (en) * 1996-05-17 1997-11-21 Atochem Elf Sa MATERIAL COMPRISING A FILM COATED WITH A SILICON OXIDE LAYER AND A POLYOLEFIN FILM
AU691442B2 (en) * 1996-05-17 1998-05-14 Elf Atochem S.A. Material comprising a film carrying a layer of silicone oxide and a polyolefin film
US6017638A (en) * 1996-05-17 2000-01-25 Elf Atochem S.A. Multilayer material comprising a film carrying layer of silicon oxide and a polyolefin film
EP1700874A1 (en) * 2003-12-16 2006-09-13 Toyo Boseki Kabushiki Kaisha Curable composition
EP1700874B1 (en) * 2003-12-16 2011-05-25 Toyo Boseki Kabushiki Kaisha Curable composition

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