JPS5454199A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS5454199A
JPS5454199A JP12006577A JP12006577A JPS5454199A JP S5454199 A JPS5454199 A JP S5454199A JP 12006577 A JP12006577 A JP 12006577A JP 12006577 A JP12006577 A JP 12006577A JP S5454199 A JPS5454199 A JP S5454199A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin
phenol
curing agent
pulverized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12006577A
Other languages
Japanese (ja)
Other versions
JPS6045212B2 (en
Inventor
Masahiro Kitamura
Hiroshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12006577A priority Critical patent/JPS6045212B2/en
Publication of JPS5454199A publication Critical patent/JPS5454199A/en
Publication of JPS6045212B2 publication Critical patent/JPS6045212B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: The title composition capable of giving transparent cured critcles having improved moisture resistance, with excellent quick curability and storage stability, comprising an epoxy resin, a phenol novolak resin curing agent as principal ingredients, a specific latent curing accelerator, and a compatibility improver.
CONSTITUTION: (A) A phenol-novolak resin, obtained by reacting phenol or bisphenol with formaldehyde, is melt incorporated with (B) triethylammonium tetraphenylborate which is an excellent latent curing accelerator and (C) an imidazole compounds, e.g. 2-ethylimidazole, 2-undecylimidazole, etc. at about 100W 130°C for about 5W10 min. then cooled to room trmperature and pulverized to form a pulverized substance, which is then mixed with an epoxy resin. The amount of the curing agent, the phenolnovolak resin, is preferably about 0.5W1.5 equivalents per equivalent of the epoxy resin
COPYRIGHT: (C)1979,JPO&Japio
JP12006577A 1977-10-07 1977-10-07 epoxy resin composition Expired JPS6045212B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12006577A JPS6045212B2 (en) 1977-10-07 1977-10-07 epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12006577A JPS6045212B2 (en) 1977-10-07 1977-10-07 epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS5454199A true JPS5454199A (en) 1979-04-28
JPS6045212B2 JPS6045212B2 (en) 1985-10-08

Family

ID=14777011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12006577A Expired JPS6045212B2 (en) 1977-10-07 1977-10-07 epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS6045212B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58198525A (en) * 1982-05-14 1983-11-18 Sanyurejin Kk Epoxy resin composition
EP0266306A2 (en) * 1986-09-24 1988-05-04 Ciba-Geigy Ag Latent epoxide composition
DE4110219A1 (en) * 1991-03-28 1992-10-01 Huels Troisdorf METHOD FOR PRODUCING PREPREGS WITH SOLVENT-FREE EPOXY RESIN
JP2007031498A (en) * 2005-07-25 2007-02-08 Meidensha Corp Insulating polymeric material composition

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58198525A (en) * 1982-05-14 1983-11-18 Sanyurejin Kk Epoxy resin composition
JPS6230215B2 (en) * 1982-05-14 1987-07-01 Sanyurejin Kk
EP0266306A2 (en) * 1986-09-24 1988-05-04 Ciba-Geigy Ag Latent epoxide composition
DE4110219A1 (en) * 1991-03-28 1992-10-01 Huels Troisdorf METHOD FOR PRODUCING PREPREGS WITH SOLVENT-FREE EPOXY RESIN
JP2007031498A (en) * 2005-07-25 2007-02-08 Meidensha Corp Insulating polymeric material composition

Also Published As

Publication number Publication date
JPS6045212B2 (en) 1985-10-08

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