JPS5454199A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS5454199A JPS5454199A JP12006577A JP12006577A JPS5454199A JP S5454199 A JPS5454199 A JP S5454199A JP 12006577 A JP12006577 A JP 12006577A JP 12006577 A JP12006577 A JP 12006577A JP S5454199 A JPS5454199 A JP S5454199A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- phenol
- curing agent
- pulverized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: The title composition capable of giving transparent cured critcles having improved moisture resistance, with excellent quick curability and storage stability, comprising an epoxy resin, a phenol novolak resin curing agent as principal ingredients, a specific latent curing accelerator, and a compatibility improver.
CONSTITUTION: (A) A phenol-novolak resin, obtained by reacting phenol or bisphenol with formaldehyde, is melt incorporated with (B) triethylammonium tetraphenylborate which is an excellent latent curing accelerator and (C) an imidazole compounds, e.g. 2-ethylimidazole, 2-undecylimidazole, etc. at about 100W 130°C for about 5W10 min. then cooled to room trmperature and pulverized to form a pulverized substance, which is then mixed with an epoxy resin. The amount of the curing agent, the phenolnovolak resin, is preferably about 0.5W1.5 equivalents per equivalent of the epoxy resin
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12006577A JPS6045212B2 (en) | 1977-10-07 | 1977-10-07 | epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12006577A JPS6045212B2 (en) | 1977-10-07 | 1977-10-07 | epoxy resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5454199A true JPS5454199A (en) | 1979-04-28 |
JPS6045212B2 JPS6045212B2 (en) | 1985-10-08 |
Family
ID=14777011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12006577A Expired JPS6045212B2 (en) | 1977-10-07 | 1977-10-07 | epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6045212B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58198525A (en) * | 1982-05-14 | 1983-11-18 | Sanyurejin Kk | Epoxy resin composition |
EP0266306A2 (en) * | 1986-09-24 | 1988-05-04 | Ciba-Geigy Ag | Latent epoxide composition |
DE4110219A1 (en) * | 1991-03-28 | 1992-10-01 | Huels Troisdorf | METHOD FOR PRODUCING PREPREGS WITH SOLVENT-FREE EPOXY RESIN |
JP2007031498A (en) * | 2005-07-25 | 2007-02-08 | Meidensha Corp | Insulating polymeric material composition |
-
1977
- 1977-10-07 JP JP12006577A patent/JPS6045212B2/en not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58198525A (en) * | 1982-05-14 | 1983-11-18 | Sanyurejin Kk | Epoxy resin composition |
JPS6230215B2 (en) * | 1982-05-14 | 1987-07-01 | Sanyurejin Kk | |
EP0266306A2 (en) * | 1986-09-24 | 1988-05-04 | Ciba-Geigy Ag | Latent epoxide composition |
DE4110219A1 (en) * | 1991-03-28 | 1992-10-01 | Huels Troisdorf | METHOD FOR PRODUCING PREPREGS WITH SOLVENT-FREE EPOXY RESIN |
JP2007031498A (en) * | 2005-07-25 | 2007-02-08 | Meidensha Corp | Insulating polymeric material composition |
Also Published As
Publication number | Publication date |
---|---|
JPS6045212B2 (en) | 1985-10-08 |
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