JPS55165916A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS55165916A JPS55165916A JP7385979A JP7385979A JPS55165916A JP S55165916 A JPS55165916 A JP S55165916A JP 7385979 A JP7385979 A JP 7385979A JP 7385979 A JP7385979 A JP 7385979A JP S55165916 A JPS55165916 A JP S55165916A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- dicyandiamide
- methylimidazole
- fused silica
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: Titled composition, excellent in thermal rigidity and heat resistance, and suitable for the insulation of electrical parts, which comprises a specified epoxy resin, fused silica, an imidazole compound, and dicyandiamide.
CONSTITUTION: (A) 100pts.wt. an epoxy resin, composed of at least 70wt% a polyhydric phenol polyglycidyl ether and not more than 30wt% a polyepoxy compound, is compounded with (B) 50W1,000pts.wt. fused silica of particle size ≤80 mesh, (C) 0.01W0.1mol, per equivalent of (A), of an imidazole compound as a curing agent [e.g.; 2-methylimidazole, 2,4-diamino-6-[2-methylimidazole-(1)]- ethyl-S-triazine], and (D) 0.5W5pts.wt. dicyandiamide as a cocuring agent. The composition cures at 100W300°C, and gives a cured product, having coefficient of thermal expansion of 2.5×10-5/deg.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7385979A JPS55165916A (en) | 1979-06-11 | 1979-06-11 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7385979A JPS55165916A (en) | 1979-06-11 | 1979-06-11 | Epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55165916A true JPS55165916A (en) | 1980-12-24 |
Family
ID=13530302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7385979A Pending JPS55165916A (en) | 1979-06-11 | 1979-06-11 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55165916A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57212225A (en) * | 1981-06-24 | 1982-12-27 | Nitto Electric Ind Co Ltd | Epoxy resin composition for encapsulation of semiconductor |
| EP0138209A2 (en) * | 1983-10-14 | 1985-04-24 | Hitachi, Ltd. | Epoxy resin composition |
| JPS6136318A (en) * | 1984-07-30 | 1986-02-21 | Hitachi Chem Co Ltd | Epoxy resin composition |
| JPS61166825A (en) * | 1985-01-18 | 1986-07-28 | Matsushita Electric Ind Co Ltd | Epoxy resin composition |
| JPS61243853A (en) * | 1985-04-19 | 1986-10-30 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
| JPS62105450A (en) * | 1985-10-31 | 1987-05-15 | Kyocera Corp | Semiconductor package |
| JPS63159428A (en) * | 1986-12-23 | 1988-07-02 | Sumitomo Bakelite Co Ltd | Insulating resin paste |
| JPS63264624A (en) * | 1986-09-16 | 1988-11-01 | Sumitomo Bakelite Co Ltd | Liquid epoxy resin composition |
| US4942190A (en) * | 1987-10-27 | 1990-07-17 | Mitsubishi Denki Kabushiki Kaisha | Thermosetting insulating resin paste |
| JPH03126550A (en) * | 1989-10-12 | 1991-05-29 | Nippon Steel Corp | Polyolefin-coated steel material |
| WO2009110345A1 (en) * | 2008-03-07 | 2009-09-11 | オムロン株式会社 | One-pack type epoxy resin composition and use thereof |
| US20160115283A1 (en) * | 2013-05-13 | 2016-04-28 | Basf Se | Epoxy-resin composition for fiber-matrix semifinished products |
-
1979
- 1979-06-11 JP JP7385979A patent/JPS55165916A/en active Pending
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS627211B2 (en) * | 1981-06-24 | 1987-02-16 | Nitto Electric Ind Co | |
| JPS57212225A (en) * | 1981-06-24 | 1982-12-27 | Nitto Electric Ind Co Ltd | Epoxy resin composition for encapsulation of semiconductor |
| EP0138209A2 (en) * | 1983-10-14 | 1985-04-24 | Hitachi, Ltd. | Epoxy resin composition |
| JPS6136318A (en) * | 1984-07-30 | 1986-02-21 | Hitachi Chem Co Ltd | Epoxy resin composition |
| JPS6316412B2 (en) * | 1984-07-30 | 1988-04-08 | Hitachi Chemical Co Ltd | |
| JPS61166825A (en) * | 1985-01-18 | 1986-07-28 | Matsushita Electric Ind Co Ltd | Epoxy resin composition |
| JPS61243853A (en) * | 1985-04-19 | 1986-10-30 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
| JPS6337127B2 (en) * | 1985-04-19 | 1988-07-22 | Shinetsu Chem Ind Co | |
| JPS62105450A (en) * | 1985-10-31 | 1987-05-15 | Kyocera Corp | Semiconductor package |
| JPS63264624A (en) * | 1986-09-16 | 1988-11-01 | Sumitomo Bakelite Co Ltd | Liquid epoxy resin composition |
| JPS63159428A (en) * | 1986-12-23 | 1988-07-02 | Sumitomo Bakelite Co Ltd | Insulating resin paste |
| US4942190A (en) * | 1987-10-27 | 1990-07-17 | Mitsubishi Denki Kabushiki Kaisha | Thermosetting insulating resin paste |
| JPH03126550A (en) * | 1989-10-12 | 1991-05-29 | Nippon Steel Corp | Polyolefin-coated steel material |
| WO2009110345A1 (en) * | 2008-03-07 | 2009-09-11 | オムロン株式会社 | One-pack type epoxy resin composition and use thereof |
| JP2009215368A (en) * | 2008-03-07 | 2009-09-24 | Omron Corp | One-pack epoxy resin composition and its use |
| JP4706709B2 (en) * | 2008-03-07 | 2011-06-22 | オムロン株式会社 | One-part epoxy resin composition and use thereof |
| US20160115283A1 (en) * | 2013-05-13 | 2016-04-28 | Basf Se | Epoxy-resin composition for fiber-matrix semifinished products |
| US10017614B2 (en) * | 2013-05-13 | 2018-07-10 | Reichhold As | Epoxy-resin composition for fiber-matrix semifinished products |
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