JPS5778417A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS5778417A JPS5778417A JP15561480A JP15561480A JPS5778417A JP S5778417 A JPS5778417 A JP S5778417A JP 15561480 A JP15561480 A JP 15561480A JP 15561480 A JP15561480 A JP 15561480A JP S5778417 A JPS5778417 A JP S5778417A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- particle size
- mixing
- zirconium oxide
- average particle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 3
- 229920000647 polyepoxide Polymers 0.000 title abstract 3
- 239000000203 mixture Substances 0.000 title abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 5
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract 4
- -1 imidazole compound Chemical class 0.000 abstract 3
- 239000002245 particle Substances 0.000 abstract 3
- 150000008065 acid anhydrides Chemical class 0.000 abstract 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 2
- 239000000945 filler Substances 0.000 abstract 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 229910001928 zirconium oxide Inorganic materials 0.000 abstract 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 abstract 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 abstract 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 abstract 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 abstract 1
- 238000005266 casting Methods 0.000 abstract 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 abstract 1
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 239000010453 quartz Substances 0.000 abstract 1
- 230000035939 shock Effects 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: A compoistion capable of forming cured products having excellent adhesion and cohesion to metals and excellent thermal shock resistance, prepared by mixing an epoxy resin with a silica filler, zirconium oxide, an organic dibasic acid anhydride and an imidazole compound.
CONSTITUTION: The titled composition is obtained by mixing an epoxy resin having at least one epoxy group in the molecule, e.g., diglycidyl ether derived from bisphenol A and epichlorohydrin, with a silica filler, particle size 1W100μ, average particle size 15W35μ, e.g., quartz powder, zirconium oxide, average particle size 10W40μ, an organic dibasic acid anhydride, e.g., phthalic anhydride, and an imidazole compound, e.g., 2-methylimidazole.
USE: Casting and molding of electric or electronic parts.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15561480A JPS5778417A (en) | 1980-11-04 | 1980-11-04 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15561480A JPS5778417A (en) | 1980-11-04 | 1980-11-04 | Epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5778417A true JPS5778417A (en) | 1982-05-17 |
| JPS6144886B2 JPS6144886B2 (en) | 1986-10-04 |
Family
ID=15609864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15561480A Granted JPS5778417A (en) | 1980-11-04 | 1980-11-04 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5778417A (en) |
-
1980
- 1980-11-04 JP JP15561480A patent/JPS5778417A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6144886B2 (en) | 1986-10-04 |
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