JPS5626967A - Production of one-pack type epoxy conductive adhesive - Google Patents
Production of one-pack type epoxy conductive adhesiveInfo
- Publication number
- JPS5626967A JPS5626967A JP10237679A JP10237679A JPS5626967A JP S5626967 A JPS5626967 A JP S5626967A JP 10237679 A JP10237679 A JP 10237679A JP 10237679 A JP10237679 A JP 10237679A JP S5626967 A JPS5626967 A JP S5626967A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- resin composition
- type epoxy
- epoxy resin
- predetermined viscosity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: To obtain titled adhesive having a predetermined viscosity and being suitable for bonding various electronic parts, by allowing a resin composition prepared by mixing an epoxy resin with a curing agent, etc., to stand until the composition reaches a predetermined viscosity, and then adding conductive silver powders to the composition.
CONSTITUTION: A resin composition is prepared by mixing (a) an epoxy resin such as a bisphenol A type epoxy resin, (b) a curing agent such as dicyandiamide, (c) a reaction accelerator such as dimethylbenzylamine and (d) an organic solvent such as diethylene glycol monoethyl ether. Then, titled adhesive is obtained by allowing the resin composition to stand until the composition reaches a predetermined viscosity, and then adding conductive silver powders, flake or spherical form, having an average particle diameter of about 0.2W15μm, to the resin composition, so as to provide a weight ratio: (a+b+c):d:e, of 12W34:6W8:60W80.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10237679A JPS5626967A (en) | 1979-08-10 | 1979-08-10 | Production of one-pack type epoxy conductive adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10237679A JPS5626967A (en) | 1979-08-10 | 1979-08-10 | Production of one-pack type epoxy conductive adhesive |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5626967A true JPS5626967A (en) | 1981-03-16 |
JPS5733317B2 JPS5733317B2 (en) | 1982-07-16 |
Family
ID=14325734
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10237679A Granted JPS5626967A (en) | 1979-08-10 | 1979-08-10 | Production of one-pack type epoxy conductive adhesive |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5626967A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS601222A (en) * | 1983-06-17 | 1985-01-07 | Sumitomo Bakelite Co Ltd | Electroconductive resin paste |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5080331A (en) * | 1973-11-20 | 1975-06-30 |
-
1979
- 1979-08-10 JP JP10237679A patent/JPS5626967A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5080331A (en) * | 1973-11-20 | 1975-06-30 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS601222A (en) * | 1983-06-17 | 1985-01-07 | Sumitomo Bakelite Co Ltd | Electroconductive resin paste |
JPS6329886B2 (en) * | 1983-06-17 | 1988-06-15 | Sumitomo Bakelite Co |
Also Published As
Publication number | Publication date |
---|---|
JPS5733317B2 (en) | 1982-07-16 |
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