JPS5790072A - Resist ink composition for chemical plating - Google Patents

Resist ink composition for chemical plating

Info

Publication number
JPS5790072A
JPS5790072A JP55164598A JP16459880A JPS5790072A JP S5790072 A JPS5790072 A JP S5790072A JP 55164598 A JP55164598 A JP 55164598A JP 16459880 A JP16459880 A JP 16459880A JP S5790072 A JPS5790072 A JP S5790072A
Authority
JP
Japan
Prior art keywords
epoxy resin
resist ink
hardener
chemical plating
arom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55164598A
Other languages
Japanese (ja)
Other versions
JPH0125790B2 (en
Inventor
Isamu Tanaka
Akira Matsuo
Hitoshi Oka
Hiroshi Kikuchi
Osamu Miyazawa
Ataru Yokono
Tokio Isogai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP55164598A priority Critical patent/JPS5790072A/en
Publication of JPS5790072A publication Critical patent/JPS5790072A/en
Publication of JPH0125790B2 publication Critical patent/JPH0125790B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)

Abstract

PURPOSE: To provide the titled compsn. which has excellent printability and gives a cured film having excellent adhesiveness, resistance to electroless copper plating solution and heat, etc., by blending an arom. amine hardener and an imidazole hardener in combination with an epoxy resin.
CONSTITUTION: 100pts.wt. epoxy resin, 0.1W1.5 equivalents (per one epoxy equivalent of the epoxy resin) of an arom. amine hardener for the epoxy resin such as m-phenylene-diamine, 5W30pts.wt. imidazole hardener for the epoxy resin such as 1-methylimidazole, a filler such as talc, a thixotropic agent such as ultrafine SiO2 powder, and an org. solvent such as cyclohexanol, are mixed together to produce the desired resist ink compsn. for chemical plating. Said org. solvent is used in such a proportion that the thixotropy index of the resulting resist ink becomes 20W40 and the viscosity of the ink becomes 3,000W 10,000P at 20°C.
COPYRIGHT: (C)1982,JPO&Japio
JP55164598A 1980-11-25 1980-11-25 Resist ink composition for chemical plating Granted JPS5790072A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55164598A JPS5790072A (en) 1980-11-25 1980-11-25 Resist ink composition for chemical plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55164598A JPS5790072A (en) 1980-11-25 1980-11-25 Resist ink composition for chemical plating

Publications (2)

Publication Number Publication Date
JPS5790072A true JPS5790072A (en) 1982-06-04
JPH0125790B2 JPH0125790B2 (en) 1989-05-19

Family

ID=15796214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55164598A Granted JPS5790072A (en) 1980-11-25 1980-11-25 Resist ink composition for chemical plating

Country Status (1)

Country Link
JP (1) JPS5790072A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59155994A (en) * 1983-02-25 1984-09-05 株式会社日立製作所 Method of producing printed circuit board
JPS6026669A (en) * 1983-07-25 1985-02-09 Hitachi Condenser Co Ltd Resist ink for electroless plating
JPS6082673A (en) * 1983-10-14 1985-05-10 Hitachi Ltd Solder resist ink composition having plating resistance
JPS6123666A (en) * 1984-07-13 1986-02-01 Hitachi Ltd Plating-resistant solder resist ink composition
JPH05188593A (en) * 1991-07-15 1993-07-30 Internatl Business Mach Corp <Ibm> Inproved composition for photoimaging
JPH06317905A (en) * 1993-11-15 1994-11-15 Ibiden Co Ltd Photosensitive resin composition and printed circuit board
US6010823A (en) * 1996-03-13 2000-01-04 Ibiden Co., Ltd. Resist compositions for plating
US6217987B1 (en) 1996-11-20 2001-04-17 Ibiden Co. Ltd. Solder resist composition and printed circuit boards

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59155994A (en) * 1983-02-25 1984-09-05 株式会社日立製作所 Method of producing printed circuit board
JPH049399B2 (en) * 1983-02-25 1992-02-20
JPS6026669A (en) * 1983-07-25 1985-02-09 Hitachi Condenser Co Ltd Resist ink for electroless plating
JPS6352112B2 (en) * 1983-07-25 1988-10-18 Hitachi Condenser
JPS6082673A (en) * 1983-10-14 1985-05-10 Hitachi Ltd Solder resist ink composition having plating resistance
JPH0216935B2 (en) * 1983-10-14 1990-04-18 Hitachi Ltd
JPS6123666A (en) * 1984-07-13 1986-02-01 Hitachi Ltd Plating-resistant solder resist ink composition
JPH0437867B2 (en) * 1984-07-13 1992-06-22 Hitachi Ltd
JPH05188593A (en) * 1991-07-15 1993-07-30 Internatl Business Mach Corp <Ibm> Inproved composition for photoimaging
JPH06317905A (en) * 1993-11-15 1994-11-15 Ibiden Co Ltd Photosensitive resin composition and printed circuit board
US6010823A (en) * 1996-03-13 2000-01-04 Ibiden Co., Ltd. Resist compositions for plating
US6217987B1 (en) 1996-11-20 2001-04-17 Ibiden Co. Ltd. Solder resist composition and printed circuit boards

Also Published As

Publication number Publication date
JPH0125790B2 (en) 1989-05-19

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