JPS56157471A - Resist ink composition for chemical plating - Google Patents

Resist ink composition for chemical plating

Info

Publication number
JPS56157471A
JPS56157471A JP6063380A JP6063380A JPS56157471A JP S56157471 A JPS56157471 A JP S56157471A JP 6063380 A JP6063380 A JP 6063380A JP 6063380 A JP6063380 A JP 6063380A JP S56157471 A JPS56157471 A JP S56157471A
Authority
JP
Japan
Prior art keywords
chemical plating
epoxy resin
resin
compsn
chemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6063380A
Other languages
Japanese (ja)
Inventor
Isamu Tanaka
Hitoshi Oka
Ataru Yokono
Osamu Miyazawa
Akira Matsuo
Hiroshi Kikuchi
Tokio Isogai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6063380A priority Critical patent/JPS56157471A/en
Publication of JPS56157471A publication Critical patent/JPS56157471A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Chemically Coating (AREA)

Abstract

PURPOSE: To provide the titled compsn. which has good printing properties and produces a cured film having excellent adhesiveness and chemical resistance, by a method wherein an epoxy resin in combination with a phenoxy resin is used as a resin component, and a chemical plating inhibitor is added thereto.
CONSTITUTION: 100pts.wt. Epoxy resin (A) (e.g. DEN 431, a product of the Dow Chemical Co.), 5W100pts.wt. phenoxy resin (B) (e.g. OL-53-B-40, a product of Shell Intern. Res. Maat.), 0.5W30wt% hardener (C) for the epoxy resin (e.g. indazole), a filler (D) (e.g. talc), a thixotropic agent (E) (e.g. SiO2, in such an amount that the resulting compsn. will have a thixotropy index of 20W40), an org. solvent (F) (e.g. t-butylalcohol, in such an amount that the resulting compsn. will have a viscosity of 3,000W10,000 poises) and 0.1W5wt% chemical plating inhibitor (G) (e.g. triazole) are blende together.
COPYRIGHT: (C)1981,JPO&Japio
JP6063380A 1980-05-09 1980-05-09 Resist ink composition for chemical plating Pending JPS56157471A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6063380A JPS56157471A (en) 1980-05-09 1980-05-09 Resist ink composition for chemical plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6063380A JPS56157471A (en) 1980-05-09 1980-05-09 Resist ink composition for chemical plating

Publications (1)

Publication Number Publication Date
JPS56157471A true JPS56157471A (en) 1981-12-04

Family

ID=13147904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6063380A Pending JPS56157471A (en) 1980-05-09 1980-05-09 Resist ink composition for chemical plating

Country Status (1)

Country Link
JP (1) JPS56157471A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59213779A (en) * 1983-04-22 1984-12-03 Meidensha Electric Mfg Co Ltd Ultraviolet-curing solder resist ink
JPS6082673A (en) * 1983-10-14 1985-05-10 Hitachi Ltd Solder resist ink composition having plating resistance
JPS6123666A (en) * 1984-07-13 1986-02-01 Hitachi Ltd Plating-resistant solder resist ink composition
US4597793A (en) * 1982-03-05 1986-07-01 Sicpa Holding S.A. Desensitizing ink for wet offset printing
JPH0439604A (en) * 1990-06-05 1992-02-10 Matsushita Electric Ind Co Ltd Ink composition and color filter pattern forming method
CN102643573A (en) * 2012-04-21 2012-08-22 江门市阪桥电子材料有限公司 Thermocuring character ink and preparation method thereof

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4597793A (en) * 1982-03-05 1986-07-01 Sicpa Holding S.A. Desensitizing ink for wet offset printing
JPS59213779A (en) * 1983-04-22 1984-12-03 Meidensha Electric Mfg Co Ltd Ultraviolet-curing solder resist ink
JPS6082673A (en) * 1983-10-14 1985-05-10 Hitachi Ltd Solder resist ink composition having plating resistance
JPH0216935B2 (en) * 1983-10-14 1990-04-18 Hitachi Ltd
JPS6123666A (en) * 1984-07-13 1986-02-01 Hitachi Ltd Plating-resistant solder resist ink composition
JPH0437867B2 (en) * 1984-07-13 1992-06-22 Hitachi Ltd
JPH0439604A (en) * 1990-06-05 1992-02-10 Matsushita Electric Ind Co Ltd Ink composition and color filter pattern forming method
CN102643573A (en) * 2012-04-21 2012-08-22 江门市阪桥电子材料有限公司 Thermocuring character ink and preparation method thereof

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