JPS6352112B2 - - Google Patents
Info
- Publication number
- JPS6352112B2 JPS6352112B2 JP13545883A JP13545883A JPS6352112B2 JP S6352112 B2 JPS6352112 B2 JP S6352112B2 JP 13545883 A JP13545883 A JP 13545883A JP 13545883 A JP13545883 A JP 13545883A JP S6352112 B2 JPS6352112 B2 JP S6352112B2
- Authority
- JP
- Japan
- Prior art keywords
- parts
- weight
- electroless plating
- resist ink
- solid solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 19
- 238000007772 electroless plating Methods 0.000 claims description 17
- 239000006104 solid solution Substances 0.000 claims description 10
- 239000000377 silicon dioxide Substances 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 8
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910000410 antimony oxide Inorganic materials 0.000 claims description 4
- 229910000480 nickel oxide Inorganic materials 0.000 claims description 4
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 claims description 4
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 12
- 239000010949 copper Substances 0.000 description 12
- 239000000976 ink Substances 0.000 description 9
- 238000007747 plating Methods 0.000 description 9
- 239000003054 catalyst Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010019 resist printing Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- -1 After that Substances 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000011882 ultra-fine particle Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
Description
本発明は無電解めつき用インクに関するもので
ある。
印刷配線板は、それが組み込まれる装置が小型
化するに従つて高密度実装可能なものが要求され
るようになつてきており、ライン間の間隔がより
狭くなつてきた。
ところで、必要な回路部分のみに無電解めつき
法により金属めつきして回路を設けたフルアデイ
テイブ型の印刷配線板は、例えば、めつき触媒入
り基板にめつき触媒入り接着剤を塗布し、めつき
レジスト印刷、化学粗化、洗浄、無電解めつき、
半田レジスト印刷の各処理を順次行ない製造され
ている。そして無電解めつき処理をした際、従来
のメツキレジストでは金属が付着し易く、その金
属が成長することがライン間を短絡する原因とな
つている。これは一般に銅ふりと言われ、印刷配
線板の高密度化が進むに従つてこの銅ふりによる
不良が増加する欠点がある。そのために、無電解
めつき処理後にバフ研摩等による銅ふり除去処理
を行なつているが、このような作業によつても銅
ふりを完全に無くすことが出来ず、作業が困難で
ある欠点があつた。
本発明は、以上の欠点を改良し、銅ふりを防止
して信頼性の高い、かつ製造の容易な印刷配線板
を製造しうる無電解めつき用レジストインクの提
供を目的とするものである。
本発明は、上記の目的を達成するために、粒径
が15μ以下の珪酸アルミニウム並びに酸化チタ
ン、酸化ニツケル及び酸化アンチモンの固溶体並
びに超微粒子シリカを混合した充填剤を含むエポ
キシ樹脂系組成物からなることを特徴とする無電
解めつき用レジストインクを提供するものであ
る。
すなわち、印刷配線板を製造する場合、Pd等
のめつき触媒入りの紙フエノール樹脂積層板や紙
エポキシ樹脂積層板等の基板に、Pd等のめつき
触媒入り接着剤を塗布した後に本発明による無電
解めつき用レジストインクを印刷する。この無電
解めつき用レジストインクは、エポキシ樹脂系組
成物からなり、充填剤が粒径が15μ以下の珪酸ア
ルミニウムとこれよりも粒径の小さい固溶体や超
微粒子シリカであり、粒子が細かいので、印刷し
た表面の凹凸が小さい。それ故、その後に無電解
めつき処理を行なつた場合、銅がレジストインク
表面に付着し難く、特に固溶体と超微粒子シリカ
とは付着した銅粒子を成長し難くする作用を有し
ており、銅ふりの発生及びそれによる短絡不良を
抑制しうるものである。このような効果は、特
に、固溶体と超微粒子シリカの合計量がレジン
100重量部に対して３重量部以上の範囲において
顕著である。ただし、合計量が15重量部より多く
なると無電解銅めつき液に溶け易くなり、かつ該
めつき液を汚染するので好ましくない。
なお、エポキシ樹脂系組成物中の充填剤の含有
量は10〜30重量部が好ましく、10重量部未満ある
いは30重量部より多いと印刷性が低くなり、所定
の厚さが得られなかつたりあるいは所定幅よりも
はみ出し易い性質がある。
例えば、無電解めつき用レジストインクとし
て、エポキシ樹脂100重量部、流れ調整剤として
のモダフロー３重量部、硬化剤としてのエピフオ
ーム17重量部及びブチルカルビトール30重量部に
対して、最大粒径15μ以下の珪酸アルミニウム18
重量部、酸化チタンTiO2、酸化ニツケルNiO及
び酸化アンチモンSb2O3（TiO2：NiO：Sb2O3＝
17.9：16.8：65.3重量％）からなる固溶体８重量
部、超微粒子シリカ４重量部からなる充填剤を混
合して本発明実施例１とする。また上記組成にお
いて珪酸アルミニウムを23重量部、固溶体を３重
量部、超微粒子シリカを４重量部として本発明実
施例２とする。さらに、実施例１において珪酸ア
ルミニウムを14重量部、固溶体を８重量部、超微
粒子シリカを６重量部として本発明実施例３とす
る。なお、実施例１において最大粒径が15μより
大きい珪酸アルミニウムを28重量部、固溶体を０
重量部、超微粒子シリカを２重量部として従来例
とする。そしてこれ等のインクを基板に印刷し、
その後、化学粗化、無電解めつき処理を行ない銅
めつきを設けた印刷配線板について、印刷性や耐
化学粗化液性、銅めつきの成長性、銅ふり量（20
倍顕微鏡で見える銅粒子数）を測定したところ表
の通りの結果が得られた。すなわち、本発明によ
れば従来例に比べて銅ふり量が0.75％以下となり
また印刷性も優れている。
The present invention relates to an ink for electroless plating. As the devices into which printed wiring boards are incorporated become smaller, printed wiring boards are required to be able to be mounted in high density, and the spacing between lines has become narrower. By the way, a fully additive printed wiring board in which a circuit is provided by plating only the necessary circuit parts with metal using an electroless plating method is made by applying an adhesive containing a plating catalyst to a substrate containing a plating catalyst. resist printing, chemical roughening, cleaning, electroless plating,
It is manufactured by sequentially performing each process of solder resist printing. When electroless plating is performed, metal tends to adhere to conventional plating resists, and the growth of the metal causes short circuits between lines. This is generally referred to as copper flaking, and as the density of printed wiring boards becomes higher, the number of defects due to copper flaking increases. For this purpose, after the electroless plating process, copper flakes are removed by buffing, etc. However, even with such work, copper flakes cannot be completely removed and the work is difficult. It was hot. The object of the present invention is to provide a resist ink for electroless plating that can improve the above-mentioned drawbacks, prevent copper splatter, and produce printed wiring boards that are highly reliable and easy to manufacture. . In order to achieve the above object, the present invention consists of an epoxy resin composition containing a filler mixed with aluminum silicate having a particle size of 15μ or less, a solid solution of titanium oxide, nickel oxide, and antimony oxide, and ultrafine silica. The present invention provides a resist ink for electroless plating characterized by the following. That is, when manufacturing a printed wiring board, after applying an adhesive containing a plating catalyst such as Pd to a substrate such as a paper phenolic resin laminate or a paper epoxy resin laminate containing a plating catalyst such as Pd, the adhesive according to the present invention is applied. Print resist ink for electroless plating. This resist ink for electroless plating is made of an epoxy resin composition, and the filler is aluminum silicate with a particle size of 15μ or less and a solid solution or ultrafine silica with a smaller particle size. The printed surface has small irregularities. Therefore, when electroless plating is performed afterwards, copper is difficult to adhere to the surface of the resist ink, and in particular, the solid solution and ultrafine silica have the effect of making it difficult for the adhered copper particles to grow. This makes it possible to suppress the occurrence of copper splatter and the resulting short circuit failure. This effect is particularly important when the total amount of solid solution and ultrafine silica is
It is noticeable in the range of 3 parts by weight or more per 100 parts by weight. However, if the total amount exceeds 15 parts by weight, it is not preferable because it will easily dissolve in the electroless copper plating solution and will contaminate the plating solution. The content of the filler in the epoxy resin composition is preferably 10 to 30 parts by weight, and if it is less than 10 parts by weight or more than 30 parts by weight, printability will be poor and the desired thickness may not be obtained. It has a property that it tends to protrude beyond a predetermined width. For example, as a resist ink for electroless plating, 100 parts by weight of epoxy resin, 3 parts by weight of Modaflow as a flow control agent, 17 parts by weight of Epiform as a hardening agent, and 30 parts by weight of butyl carbitol have a maximum particle size of 15 μm. Aluminum silicate below 18
Parts by weight, titanium oxide TiO 2 , nickel oxide NiO and antimony oxide Sb 2 O 3 (TiO 2 :NiO:Sb 2 O 3 =
Example 1 of the present invention was prepared by mixing 8 parts by weight of a solid solution consisting of 17.9:16.8:65.3% by weight) and a filler consisting of 4 parts by weight of ultrafine silica. Further, in the above composition, 23 parts by weight of aluminum silicate, 3 parts by weight of solid solution, and 4 parts by weight of ultrafine silica were used as Example 2 of the present invention. Furthermore, in Example 1, 14 parts by weight of aluminum silicate, 8 parts by weight of solid solution, and 6 parts by weight of ultrafine silica were used to obtain Example 3 of the present invention. In addition, in Example 1, 28 parts by weight of aluminum silicate with a maximum particle size of more than 15μ and 0 parts of solid solution were used.
Parts by weight and ultrafine particle silica are set to 2 parts by weight as a conventional example. Then, print these inks on the substrate,
After that, chemical roughening and electroless plating were performed on printed wiring boards with copper plating.
When the number of copper particles visible under a magnifying microscope was measured, the results shown in the table were obtained. That is, according to the present invention, the amount of copper dust is 0.75% or less compared to the conventional example, and printability is also excellent.
【表】
以上の通り、本発明によれば、印刷配線板の製
造時に発生する銅ふり量を著しく軽減でき、印刷
配線板の信頼性を向上でき、かつその製造を容易
にしうる無電解めつき用レジストインクが得られ
る。[Table] As described above, according to the present invention, electroless plating can significantly reduce the amount of copper splatter generated during the manufacturing of printed wiring boards, improve the reliability of printed wiring boards, and facilitate the manufacturing thereof. A resist ink is obtained.
Claims (1)
径が15μ以下の珪酸アルミニウム並びに酸化チタ
ン、酸化ニツケル及び酸化アンチモンの固溶体並
びに超微粒子シリカを混合した充填剤を含むエポ
キシ樹脂系組成物からなることを特徴とする無電
解めつき用レジストインク。 ２ 酸化チタン、酸化ニツケル及び酸化アンチモ
ンの固溶体と超微粒子シリカの合計量がレジン
100重量部に対して３〜15重量部である特許請求
の範囲第１項記載の無電解めつき用レジストイン
ク。 ３ 充填剤の含有量がレジン100重量部に対して
10〜30重量部である特許請求の範囲第１項又は第
２項記載の無電解めつき用レジストインク。[Scope of Claims] 1. A resist ink for electroless plating containing an epoxy resin composition containing a filler mixed with aluminum silicate having a particle size of 15 μm or less, a solid solution of titanium oxide, nickel oxide, and antimony oxide, and ultrafine silica particles. A resist ink for electroless plating characterized by consisting of: 2 The total amount of solid solution of titanium oxide, nickel oxide, and antimony oxide and ultrafine silica is the resin.
The resist ink for electroless plating according to claim 1, wherein the amount is 3 to 15 parts by weight per 100 parts by weight. 3 Filler content per 100 parts by weight of resin
The resist ink for electroless plating according to claim 1 or 2, wherein the amount is 10 to 30 parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58135458A JPS6026669A (en) | 1983-07-25 | 1983-07-25 | Resist ink for electroless plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58135458A JPS6026669A (en) | 1983-07-25 | 1983-07-25 | Resist ink for electroless plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6026669A JPS6026669A (en) | 1985-02-09 |
| JPS6352112B2 true JPS6352112B2 (en) | 1988-10-18 |
Family
ID=15152179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58135458A Granted JPS6026669A (en) | 1983-07-25 | 1983-07-25 | Resist ink for electroless plating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6026669A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999020090A1 (en) * | 1997-10-14 | 1999-04-22 | Ibiden Co., Ltd. | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5790072A (en) * | 1980-11-25 | 1982-06-04 | Hitachi Ltd | Resist ink composition for chemical plating |
-
1983
- 1983-07-25 JP JP58135458A patent/JPS6026669A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5790072A (en) * | 1980-11-25 | 1982-06-04 | Hitachi Ltd | Resist ink composition for chemical plating |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999020090A1 (en) * | 1997-10-14 | 1999-04-22 | Ibiden Co., Ltd. | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6026669A (en) | 1985-02-09 |
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