JPH0439812A - Conductor composition - Google Patents
Conductor compositionInfo
- Publication number
- JPH0439812A JPH0439812A JP14467690A JP14467690A JPH0439812A JP H0439812 A JPH0439812 A JP H0439812A JP 14467690 A JP14467690 A JP 14467690A JP 14467690 A JP14467690 A JP 14467690A JP H0439812 A JPH0439812 A JP H0439812A
- Authority
- JP
- Japan
- Prior art keywords
- conductor composition
- compound
- oxide
- ruthenium
- inorganic binder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 46
- 239000000203 mixture Substances 0.000 title claims description 39
- 239000000843 powder Substances 0.000 claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 23
- 239000011521 glass Substances 0.000 claims abstract description 20
- 239000011230 binding agent Substances 0.000 claims abstract description 18
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 claims abstract description 14
- 150000003304 ruthenium compounds Chemical class 0.000 claims abstract description 11
- 150000001622 bismuth compounds Chemical class 0.000 claims abstract description 9
- 239000000654 additive Substances 0.000 claims abstract description 8
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000005751 Copper oxide Substances 0.000 claims abstract description 7
- 229910000431 copper oxide Inorganic materials 0.000 claims abstract description 7
- 229910000480 nickel oxide Inorganic materials 0.000 claims abstract description 6
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910001925 ruthenium oxide Inorganic materials 0.000 claims abstract description 5
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 claims abstract description 5
- 230000000996 additive effect Effects 0.000 claims abstract description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 abstract description 17
- 239000011159 matrix material Substances 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 4
- 230000006866 deterioration Effects 0.000 abstract description 3
- 238000003878 thermal aging Methods 0.000 abstract description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 abstract description 2
- 229910000416 bismuth oxide Inorganic materials 0.000 abstract description 2
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052707 ruthenium Inorganic materials 0.000 abstract description 2
- 239000000344 soap Substances 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- LYJWZYKKQPKWPK-UHFFFAOYSA-N bismuth;1-octoxyoctane Chemical compound [Bi].CCCCCCCCOCCCCCCCC LYJWZYKKQPKWPK-UHFFFAOYSA-N 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 12
- 238000005245 sintering Methods 0.000 description 7
- 239000002245 particle Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 239000005407 aluminoborosilicate glass Substances 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- -1 disogel oxide Chemical compound 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、絶縁基板上に印刷し焼成して該基板上に電気
回路を形成するための導体組成物に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a conductor composition for printing and firing on an insulating substrate to form an electric circuit on the substrate.
（従来技術とその問題点）
従来の厚膜配線板においては、絶縁基板として９６％ア
ルミナ基板が一般的に使用されているが。(Prior art and its problems) In conventional thick film wiring boards, a 96% alumina substrate is generally used as an insulating substrate.
近年厚膜配線板の小型化、高密度化の要請が高まり２該
要請に応えるために絶縁グレーズペーストを用いて多層
化し、その上に導体ペーストで配線して厚膜回路を形成
することがしばしば行なわれる様になった。一方、厚膜
導体ペーストの種々の特性のうち、ハンダ濡れ性を十分
満足した上で熱エージング後の導体と絶縁基板との密着
強度劣下を極力抑える要望は多く、その改良の試みはこ
れまでアルミナ基板上に関する限り数多く成されてきた
。しかしなから、昨今前述した様にアルミナ基板上のみ
ならず多層ブレース上の導体においても良好なハンダ濡
れ性と強密着性が要求される様になって来たが、市販の
導体ペーストを使用すると多層クレーズ上では該導体表
面にガラス皮膜が形成される結果、ハンダ濡れ性を著し
く阻害すると同時に熱エージング後の密着強度も十分に
得られなかった。In recent years, there has been an increasing demand for smaller and higher density thick film circuit boards.2 In order to meet these demands, thick film circuits are often formed by multilayering using insulating glaze paste and wiring with conductive paste on top. It started to be done. On the other hand, among the various properties of thick film conductor paste, there are many requests to suppress the deterioration of the adhesion strength between the conductor and the insulating substrate after heat aging while fully satisfying solder wettability, and attempts to improve this have so far been made. Much work has been done on alumina substrates. However, recently, as mentioned above, good solder wettability and strong adhesion have become required not only for conductors on alumina substrates but also on multilayer braces, but when using commercially available conductor pastes, As a result of the formation of a glass film on the surface of the conductor on the multilayer craze, the solder wettability was significantly inhibited, and at the same time, sufficient adhesion strength could not be obtained after thermal aging.
（発明の目的）
本発明は、アルミナ基板上のみならず、多層グレーズ上
に形成されても良好なハンダ濡れ性を示し、熱エージン
グ後の密着強度劣下が極めて少ない導体組成物を提供す
ることを目的とする。(Object of the invention) The present invention provides a conductor composition that exhibits good solder wettability not only on an alumina substrate but also when formed on a multilayer glaze, and exhibits extremely little deterioration in adhesion strength after thermal aging. With the goal.
（問題点を解決するための手段）
本発明は、少なくとも銀を含む金属粉と、無機結合剤粉
末とがビヒクル中に分散されて成る導体組成物において
、前記無機結合剤がカラスフリット、ヒスマス化合物及
びルテニウム化合物を含み、必要に応じて酸化銅、酸化
ニッケル及び二酸化マンガンを含むことを特徴とする導
体組成物である。(Means for Solving the Problems) The present invention provides a conductor composition comprising a metal powder containing at least silver and an inorganic binder powder dispersed in a vehicle, wherein the inorganic binder is a glass frit, a hismuth compound, etc. and a ruthenium compound, and optionally copper oxide, nickel oxide, and manganese dioxide.
以下本発明の詳細な説明する。The present invention will be explained in detail below.
本発明における導体組成物の金属粉は、微細に分割され
た銀粉を必須成分として含み、該金属粉は銀粉の他にパ
ラジウム粉や白金粉を含有していてもよい。これらの金
属成分の組成は、通常銀１００〜４０重量％、パラジウ
ム０〜３５％重駁％、白金０〜３５重量％である。又使
用される銀の平均粒径はＣＬ ５〜７μでその表面積は
Ｏ−５〜３ｍ２／ｇ、パラジウムの平均粒径は０．１〜
１ノ１てその表面積は５〜２０ｍ２／ｇ、白金の平均粒
径は０．１〜１μでその表面積は１０〜４０ｍ ２７
ｇである。The metal powder of the conductor composition in the present invention contains finely divided silver powder as an essential component, and the metal powder may contain palladium powder or platinum powder in addition to silver powder. The composition of these metal components is usually 100 to 40% by weight of silver, 0 to 35% by weight of palladium, and 0 to 35% by weight of platinum. The average particle size of the silver used is CL 5~7μ, its surface area is O-5~3m2/g, and the average particle size of palladium is 0.1~7μ.
The surface area of 1-no-1 iron is 5-20m2/g, the average particle size of platinum is 0.1-1μ, and the surface area is 10-40m27
It is g.
該金属粉とともに本発明に係わる導体組成物を構成する
無機結合剤の粉末は、ガラスフリットとヒスマス化合物
から成り、該ガラスフリットか特定の組成であること。The inorganic binder powder that constitutes the conductor composition according to the present invention together with the metal powder is composed of a glass frit and a hismuth compound, and the glass frit has a specific composition.
また同時に添加物としてルテニウム化合物を導体組成物
中に含有することが本発明の最大の特徴である。更には
必要に応して酸化銅、酸化ニッケル及び二酸化マンガン
が添加物として含まれることか特徴である。前記無機結
合剤及び添加物の使用量は用途に応じて適宜選定するこ
とかできるか、通常該金属粉に対して１〜３０重量％重
量上程該金属粉、無機結合剤及び添加物を分散させるビ
ヒクルは導体組成物全体に対して１０〜３０％程度とす
る。Furthermore, the greatest feature of the present invention is that the conductor composition contains a ruthenium compound as an additive. A further feature is that copper oxide, nickel oxide, and manganese dioxide are included as additives as necessary. The amount of the inorganic binder and additives used can be selected as appropriate depending on the application, but usually the metal powder, inorganic binder and additives are dispersed in an amount of 1 to 30% by weight based on the metal powder. The amount of vehicle is about 10 to 30% of the entire conductor composition.
本発明で使用されるガラスフリットは、７５０〜９００
°Ｃに軟化点かある非晶質カラスで、その組成か重量％
てＳ １Ｏ２４０〜６０．ＡＩ、０３１０〜２０．Ｂ２
０’ｌ ３〜１０．Ｍｇ００．５〜５、Ｃａ０１８〜２
５てあり、更に好ましくは重ｒ％て５ｉ０２５０＼６０
．Ａ ｌ ２０ｙ １２〜１５、Ｂ２０ｉ ５〜８．
Ｍｇ０１〜３．Ｃａ０１８〜２５のもので８００〜８５
０’Ｃの軟化点を有するものである。またガラス７１月
ノドの導体組成物中の含有量は０．１〜１２重量％であ
り、更に好ましくは３〜８％であるか、金属粉の配合割
合や多層ブレースの質によってその最適量が変化する故
適宜選択する必要がある。The glass frit used in the present invention has a 750 to 900
Amorphous glass with a softening point at °C, its composition or weight percentage
teS 1O240~60. AI, 0310-20. B2
0'l 3-10. Mg00.5~5, Ca018~2
5, more preferably weight r% 5i0250\60
．． Al 20y 12-15, B20i 5-8.
Mg01-3. 800-85 for Ca018-25
It has a softening point of 0'C. In addition, the content of glass 71-groove in the conductor composition is 0.1 to 12% by weight, more preferably 3 to 8%, or the optimum amount may be determined depending on the blending ratio of metal powder and the quality of the multilayer brace. Since it changes, it is necessary to select it appropriately.
又ビスマス化合物としては、酸化ヒスマス粉が−ａ的で
あるが、オクチル酸ビスマス等の液状金属石鹸を含む有
機ビスマス化合物でも、本発明の目的を達成することが
可能である。また導体組成物中の含有量は酸化ビスマス
として通常５〜１５重量％である。Although hismuth oxide powder is preferred as a bismuth compound, the object of the present invention can also be achieved with organic bismuth compounds containing liquid metal soaps such as bismuth octylate. Moreover, the content in the conductor composition is usually 5 to 15% by weight as bismuth oxide.
本発明で用いられるルテニウム化合物としては酸化ルテ
ニウムが一般的であるが、ルテニウムレジネートでも、
本発明の目的を達成することができる。The ruthenium compound used in the present invention is generally ruthenium oxide, but ruthenium resinate can also be used.
The purpose of the present invention can be achieved.
本発明で使用される酸化ルテニウムは平均粒径０．１μ
以下、表面積５０−２００ｍ”７ｇを有する微粉末が特
徴であり、また導体組成物中の含有量は酸化ルテニウム
に換算して０．０５〜３重量％であり、更に好ましくは
０．１〜１重量％である。The average particle size of the ruthenium oxide used in the present invention is 0.1μ.
The following is characterized by a fine powder having a surface area of 50-200m"7g, and the content in the conductor composition is 0.05-3% by weight in terms of ruthenium oxide, more preferably 0.1-1% by weight. Weight%.
また必要に応じて本発明で使用される酸化銅、酸化ニッ
ケル及び二酸化マンガンは平均粒径０．１〜３μの粉末
で導体組成物中の含有量は総量でＯ〜３重量％である。Copper oxide, nickel oxide, and manganese dioxide used in the present invention as required are powders with an average particle size of 0.1 to 3 μm, and the total content in the conductor composition is 0 to 3% by weight.
このような構成から成る本発明の導体組成物をアルミナ
セラミック基板上、ないし多層グレーズ上へ印刷し、乾
燥の後、８００〜９００’Ｃで約５〜３０分焼成して導
体組成物か被覆された回路基板が作製される。なお該焼
成は複数回繰り返してもよい。The conductor composition of the present invention having such a configuration is printed on an alumina ceramic substrate or a multilayer glaze, and after drying, it is baked at 800 to 900'C for about 5 to 30 minutes to coat the conductor composition. A circuit board is produced. Note that the firing may be repeated multiple times.
このように作製された本発明の導体組成物が被覆された
回路基板ては、十分満足できるハンダ濡れ性と強密着性
を有している。その理由は必すしも明らかではないか、
前記導体組成物中の無機結合剤を構成するガラスフリッ
ト、ビスマス化合物及びルテニウム化合物の３種類の成
分が焼成の段階で前記金属粉の焼結と相俟って相互に反
応する結果、導体表面の無機結合剤は無理なく導体膜中
に拡散してゆき、アルミナ基板ないし多層グレーズ界面
に金属成分と無機結合剤成分の緻密なマトリックスか形
成される結果、優れたハンダ濡れ性と強密着性を同時に
満足すると推定される。またｂ′Ｃ來の導体ペーストと
の大きな相異点としてアルミナ基板上のみならず多層グ
レーズ上でもハンダ濡れ性と密着強度を満足させる理由
としては、本発明に用いられたカラスフリットが極めて
軟化点が高いことで金属粉の焼結を総体的に大きく抑制
し、同時に添加されているルテニウム化合物が微細部分
にわたって一段と効果的にさせているものと考えられる
。その結果アルミナ基板上に比へ一般的に金属粉の焼結
が著しく進行する多層シーズ上においても、その焼結は
抑制され、アルミナ基板上に形成される導体膜と類似の
改質を持つ導体膜か形成されるためと推定される。また
酸化銅、酸化二ソゲル及び二酸化マンガンを必要に応じ
て組合せ配合させることにより、金属粉の焼結速度を適
度に変化させることが出来、多層クルーズの質が変化し
た際にも良好なハンダ濡れ性と密着強度を得ることが可
能となる。The circuit board coated with the conductive composition of the present invention produced in this manner has sufficiently satisfactory solder wettability and strong adhesion. Isn't the reason obvious?
The three components of the inorganic binder in the conductor composition, glass frit, bismuth compound, and ruthenium compound, react with each other in conjunction with the sintering of the metal powder during the firing stage, resulting in a change in the conductor surface. The inorganic binder diffuses effortlessly into the conductor film, forming a dense matrix of metal and inorganic binder components at the interface of the alumina substrate or multilayer glaze, resulting in excellent solder wettability and strong adhesion at the same time. Estimated to be satisfied. In addition, the major difference from b'C's conventional conductor paste is that the glass frit used in the present invention has a very high softening point, which satisfies solder wettability and adhesion strength not only on alumina substrates but also on multilayer glazes. It is thought that the high value of sintering of the metal powder greatly suppresses the sintering of the metal powder as a whole, and that the ruthenium compound added at the same time makes it even more effective in the finer parts. As a result, sintering of metal powder on an alumina substrate is suppressed even on a multilayer seed layer where sintering of metal powder progresses significantly, and the conductor film has similar properties to the conductor film formed on an alumina substrate. This is presumed to be due to the formation of a film. In addition, by combining copper oxide, disogel oxide, and manganese dioxide as necessary, the sintering speed of metal powder can be changed appropriately, and even when the quality of multilayer cruise changes, good solder wetting can be achieved. It becomes possible to obtain good properties and adhesion strength.
以下実施例に基づいて本発明をより詳細に説明するか、
該実施例は本発明を限定するちのではない。The present invention will be explained in more detail based on Examples below.
The examples are not intended to limit the invention.
（実施例）
微細に分割された金属粉、無期結合剤及び添加物をター
ピネオールにエチルセルロース樹脂を溶解したビヒクル
中に混線分散し導体組成物を作製した。その配合比は下
記表に示す通りてあり、９６％アルミナセラミック基板
及び多層クレース上双方に印刷し、コンヘア炉中８５０
’Ｃにおける１０分間の焼成を２回繰り返し、膜Ｊ５１
０〜１４ノｌの電気回路を形成した。ここで、多層クレ
ースの材質としては、アルミノホウケイ酸鉛系カラスに
酸化物フィラーを加えたタイプのものを用いた。(Example) A conductor composition was prepared by cross-dispersing finely divided metal powder, a permanent binder, and additives in a vehicle prepared by dissolving ethyl cellulose resin in terpineol. The mixing ratio is as shown in the table below, and it was printed on both a 96% alumina ceramic substrate and a multilayer clay, and
Repeat baking for 10 minutes at 'C twice, film J51
A 0-14 nol electrical circuit was formed. Here, as the material for the multilayer clay, a type of lead aluminoborosilicate glass to which an oxide filler was added was used.
また、スクリーンとしては２００メツシユ、総厚９０μ
のものを使用しな、このように形成された電気回路をロ
ジンフラックス中に浸漬し、銀を含む鉛−易共晶ハンダ
に２２０°Ｃ５秒間浸漬し５×５ｍｍパッドでのハンタ
繻れ性を目視した。一方２Ｘ２ｍｍパッドに直径０．６
ｍｍのハンダめっき銅線をハンダゴテでハンダ付けした
後、１５０℃のオーブン中に投入した。３００時間放置
後取り出し、ビールテストにより密着強度を測定し下表
の結果を得た。In addition, the screen has 200 meshes and a total thickness of 90μ.
The electric circuit thus formed was immersed in rosin flux, and then immersed in lead-easily eutectic solder containing silver at 220°C for 5 seconds to check the solderability with a 5 x 5 mm pad. I visually observed it. On the other hand, 2X2mm pad has a diameter of 0.6
After soldering a solder-plated copper wire of mm with a soldering iron, the wire was placed in an oven at 150°C. After being left for 300 hours, it was taken out and the adhesion strength was measured using a beer test, and the results shown in the table below were obtained.
（以下余白）
ガラスフリットに関し、Ａは本願で請求のカラス組成で
あり、Ｂは軟化点４５０°ＣのＢ２０゜Ｚｎ〇−ｐｂｏ
系ガラス、Ｃは軟化点７８０°Ｃの５ｉＯｚ Ａ１２
Ｏｉ ｐｂｏ系ガラス、Ｄは軟化点５５０℃のＳ ｉ
０２ Ｂ２０．Ｐ ｌ）０系ガラスである。(Space below) Regarding the glass frit, A is the glass composition claimed in this application, and B is B20°Zn〇-pbo with a softening point of 450°C.
Series glass, C is 5iOz A12 with a softening point of 780°C
Oi pbo glass, D is Si with a softening point of 550°C
02 B20. Pl)0 series glass.
上表から明らかな通り、ハンダ濡れ性において本発明に
よる導体組成物は、比較例にある導体組成物にくらベア
ルミナ基板上のみならず多層グレーズ上においても極め
て安定しており金属粉の任意の配合割合で、いずれも９
０％以上の良好な特性を示している。一方熱エージング
後の密着強度においても本発明による導体組成物はアル
ミナ基板上及び多層グレーズ上で極めて優れた値を示し
ている。As is clear from the table above, the conductor composition according to the present invention is extremely stable in terms of solder wettability, compared to the conductor composition in the comparative example, not only on bare alumina substrates but also on multilayer glazes, and is stable even with any combination of metal powders. In terms of percentage, both are 9
It shows good characteristics of 0% or more. On the other hand, the conductor composition according to the present invention also shows extremely excellent adhesion strength after heat aging on the alumina substrate and the multilayer glaze.
も導体表面の無機結合剤が金属粉の焼結によってさえき
られることなく導体膜中に拡散してゆき優れたハンダ濡
れ性を示す、その結果導体とアルミナ基板ないし多層グ
レーズとの界面に、金属成分と無機結合剤成分の緻密な
マトリックスが形成されることを可能にし、極めて優れ
た密着強度を示している。多層グレーズを併用したアル
ミナ回路基板においては、優れたハンダ濡れ性と密着強
度を有する本発明の導体組成物が、極めて有用かつ画１
１目的と言える。The inorganic binder on the conductor surface is not broken by the sintering of the metal powder and diffuses into the conductor film, exhibiting excellent solder wettability. This enables the formation of a dense matrix of inorganic binder components and exhibits extremely excellent adhesion strength. The conductor composition of the present invention, which has excellent solder wettability and adhesion strength, is extremely useful and uniform in alumina circuit boards that use a multilayer glaze.
It can be said that it has one purpose.
ｆ旨γ出願人 田中マッセイ株式会社 （発明の効果）f gamma applicant Tanaka Massey Co., Ltd. (Effect of the invention)
Claims (8)
がビヒクル中に分散されて成る導体組成物において、前
記無機結合剤がガラスフリット、ビスマス化合物及び添
加物としてルテニウム化合物を含むことを特徴とする導
体組成物。(1) A conductor composition comprising a metal powder containing at least silver and an inorganic binder powder dispersed in a vehicle, characterized in that the inorganic binder contains a glass frit, a bismuth compound, and a ruthenium compound as an additive. conductor composition.
がビヒクル中に分散されて成る導体組成物において、前
記無機結合剤がガラスフリット、ビスマス化合物及び添
加物としてルテニウム化合物を含み、かつ添加物として
酸化銅，酸化ニッケル及び二酸化マンガンの少なくとも
１つを含むことを特徴とする導体組成物。(2) A conductor composition comprising a metal powder containing at least silver and an inorganic binder powder dispersed in a vehicle, wherein the inorganic binder contains a glass frit, a bismuth compound, and a ruthenium compound as an additive; 1. A conductor composition comprising at least one of copper oxide, nickel oxide, and manganese dioxide.
又は、第２項に記載の導体組成物。(3) The conductor composition according to claim 1 or 2, wherein the metal powder consists of only silver powder.
金粉を含んでいる特許請求の範囲第１項又は、第２項に
記載の導体組成物。(4) The conductor composition according to claim 1 or 2, wherein the metal powder contains palladium powder and/or platinum powder in addition to silver powder.
，Ａｌ＿２Ｏ＿３１０〜２０，Ｂ＿２Ｏ＿３〜１０，Ｍ
ｇＯ０．０５〜５，ＣａＯ１５〜３０の組成を有してい
る特許請求の範囲第１項から第４項までのいずれかに記
載の導体組成物。(5) Glass frit is SiO_240-60 in weight%
, Al_2O_310~20, B_2O_3~10, M
The conductor composition according to any one of claims 1 to 4, having a composition of gO 0.05 to 5 and CaO 15 to 30.
〜１２重量％である特許請求の範囲第１項から第５項ま
でのいずれかに記載の導体組成物。(6) The content of glass frit in the conductor composition is 0.1
The conductor composition according to any one of claims 1 to 5, wherein the content is 12% by weight.
ルテニウムに換算して０．０５〜３重量％である特許請
求の範囲第１項から第６項までのいずれかに記載の導体
組成物。(7) The conductor composition according to any one of claims 1 to 6, wherein the content of the ruthenium compound in the conductor composition is 0.05 to 3% by weight in terms of ruthenium oxide. .
くとも１種を含み、導体組成物中の含有量が総量で０．
０５〜３重量％である特許請求の範囲第１項から第７項
までのいずれかに記載の導体組成物。(8) Contains at least one of copper oxide, nickel oxide, and manganese dioxide, and the total content in the conductor composition is 0.
05 to 3% by weight of the conductor composition according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14467690A JP2941002B2 (en) | 1990-06-02 | 1990-06-02 | Conductor composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14467690A JP2941002B2 (en) | 1990-06-02 | 1990-06-02 | Conductor composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0439812A true JPH0439812A (en) | 1992-02-10 |
| JP2941002B2 JP2941002B2 (en) | 1999-08-25 |
Family
ID=15367661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14467690A Expired - Lifetime JP2941002B2 (en) | 1990-06-02 | 1990-06-02 | Conductor composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2941002B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000069220A1 (en) * | 1999-05-07 | 2000-11-16 | Ibiden Co., Ltd. | Hot plate and conductive paste |
| US7556747B2 (en) | 2003-08-08 | 2009-07-07 | Sumitomo Electric Industries, Ltd. | Electrically conductive pastes |
| JP2011512426A (en) * | 2008-01-30 | 2011-04-21 | ビーエーエスエフ ソシエタス・ヨーロピア | Conductive ink having organometallic modifier |
-
1990
- 1990-06-02 JP JP14467690A patent/JP2941002B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000069220A1 (en) * | 1999-05-07 | 2000-11-16 | Ibiden Co., Ltd. | Hot plate and conductive paste |
| US7556747B2 (en) | 2003-08-08 | 2009-07-07 | Sumitomo Electric Industries, Ltd. | Electrically conductive pastes |
| JP2011512426A (en) * | 2008-01-30 | 2011-04-21 | ビーエーエスエフ ソシエタス・ヨーロピア | Conductive ink having organometallic modifier |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2941002B2 (en) | 1999-08-25 |
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