JPH0247542B2 - MUDENKAIMETSUKYOREJISUTOINKU - Google Patents
MUDENKAIMETSUKYOREJISUTOINKUInfo
- Publication number
- JPH0247542B2 JPH0247542B2 JP58135800A JP13580083A JPH0247542B2 JP H0247542 B2 JPH0247542 B2 JP H0247542B2 JP 58135800 A JP58135800 A JP 58135800A JP 13580083 A JP13580083 A JP 13580083A JP H0247542 B2 JPH0247542 B2 JP H0247542B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- electroless plating
- resist ink
- plating
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 24
- 238000007772 electroless plating Methods 0.000 claims description 19
- 239000000377 silicon dioxide Substances 0.000 claims description 11
- 239000010425 asbestos Substances 0.000 claims description 10
- 229910052895 riebeckite Inorganic materials 0.000 claims description 10
- 239000000945 filler Substances 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 4
- 239000011882 ultra-fine particle Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 238000007788 roughening Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000009974 thixotropic effect Effects 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010410 dusting Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
本発明は無電解めつき用レジストインクに関す
るものである。
各種電気機器に組み込まれている印刷配線板
は、機器の小型化に従つて、より高密度化され、
ライン間の間隔のより狭いものが必要とされるよ
うになつてきた。
ところで、必要な回路部分のみに無電解めつき
法により金属めつきしたフルアデイテイブ型の印
刷配線板は、例えば、めつき触媒入り基板にめつ
き触媒入り接着剤を塗布し、めつきレジストイン
ク印刷、化学粗化、洗浄、無電解めつき、半田レ
ジストインク印刷等の各処理を順次行ない製造さ
れる。そして従来は、無電解めつき処理の際にメ
ツキレジストインクの表面にめつき金属が付着し
成長し易く、このことが原因で、ライン間が短絡
される不良が発生する欠点がある。これは一般に
銅ふりと言われるが、印刷配線板の高密度化が進
むに従つて、この銅ふり対策が重要な技術的課題
となつてきた。このために、例えば、メツキレジ
ストインク中に超微粒子シリカを多量に入れ付着
しためつき金属の成長を防止しようとしたものも
あるが、このようなメツキレジストインクは、そ
の後の化学粗化液や無電解めつき液を汚染し易い
欠点があつた。
本発明は、以上の欠点を改良し、印刷配線板の
銅ふりを防止でき、かつ化学粗化液や無電解めつ
き液に対して安定で印刷性の良好な無電解めつき
用レジストインクの提供を目的とするものであ
る。
本発明は、上記の目的を達成するために、主と
してエポキシ樹脂、硬化剤、流れ調整剤、充填剤
及び溶剤からなるエポキシ樹脂系の無電解めつき
用レジストインクにおいて、充填剤が少なくとも
超微粒子シリカとアスベストとを含み、溶剤を除
く固形成分中に７〜30重量％含まれている特徴と
する無電解めつき用レジストインクを提供するも
のである。
すなわち、印刷配線板を製造する場合、Pd等
のめつき触媒入りの紙フエノール樹脂積層板や紙
エポキシ樹脂積層板の基板にPd等のめつき触媒
入り接着剤を塗布した後に、本発明による無電解
めつき用レジストインクを印刷する。この無電解
めつき用レジストインクは、エポキシ樹脂系組成
物からなり、超微粒子シリカとアスベストを含む
充填剤が混合されており、特にこの量が固形成分
中の７〜30重量％であると、このレジストインク
の表面に付着した金属の成長を抑制する作用があ
り、銅ふりを減少させる効果を有している。充填
剤の量はこの範囲が最適であり、７重量％末満で
あるとインクの印刷性が悪くなりまた30重量％よ
り多くなるとチクソトロピツク性が抵下し印刷性
が悪くなる。なお、充填剤中には、超微粒子シリ
カやアスベストの他に、珪酸アルミニウムや珪酸
ジルコニウム、硫酸バリウム、酸化チタン等が含
まれる。
そして、超微粒子シリカとアスベストの合計含
有量が５〜15重量％の範囲のときには、特に、印
刷性が良好であり、また、無電解銅めつきの際の
銅めつきの成長性が良い。５％未満ではチクソト
ロピツク性が不足し、また15％より大であると粒
度が高くなり印刷性が低下する。
また、超微粒子シリカの含有量は1.5〜５重量
％の範囲が良く、1.5重量％未満であるとチクソ
トロピツク性が劣り印刷性が低下し、５重量％よ
り多いと無電解めつき処理の際のめつき成長性が
低下するとともにライン間の吸湿絶縁性が低下す
る。
例えば無電解めつき用レジストインクとして、
エポキシ樹脂100重量部、流れ調整剤としてのモ
ダフロー３重量部、硬化剤としてのエピフオーム
17重量部、ブチルカルビトール30重量部に対し
て、珪酸アルミニウム10重量部、珪酸ジルコニウ
ム12重量部、超微粒子シリカ４重量部、アスベス
ト４重量部を含む充填剤を混合した本発明実施例
１と、上記組成において、珪酸ジルコニウムを９
重量部、超微粒子シリカを３重量部、アスベスト
を８重量部とした本発明実施例２と珪酸ジルコニ
ウムを14重量部、超微粒子シリカを６重量部、ア
スベストを０重量部とした従来例１と、超微粒子
シリカを０重量部、アスベストを８重量部とした
従来例２を用い、基板に印刷し、その後、化学粗
化、無電解めつきの各処理を行ない銅めつきを設
けた印刷配線板について、印刷性や耐化学粗化液
性、無電解めつき処理によるめつき成長性、銅ふ
り量（20倍顕微鏡で見える銅粒子数）、吸湿絶縁
性について測定したところ表の通りの結果が得ら
れた。すなわち、本発明による方が、従来
The present invention relates to a resist ink for electroless plating. Printed wiring boards built into various electrical devices are becoming more dense as devices become smaller.
There is a growing need for narrower spacing between lines. By the way, a fully additive printed wiring board in which only the necessary circuit parts are plated with metal by an electroless plating method is produced by, for example, applying an adhesive containing a plating catalyst to a substrate containing a plating catalyst, printing with a plating resist ink, It is manufactured by sequentially performing various treatments such as chemical roughening, cleaning, electroless plating, and solder resist ink printing. Conventionally, plating metal easily adheres to and grows on the surface of the plating resist ink during electroless plating treatment, and this has the disadvantage of causing defects such as short circuits between lines. This is generally referred to as copper splatter, and as printed wiring boards become more densely packed, countermeasures against copper splatter have become an important technical issue. For this purpose, for example, some methods have attempted to prevent the growth of adhesion metal by adding a large amount of ultrafine silica to the plating resist ink, but such plating resist ink is difficult to use after chemical roughening liquid or The disadvantage was that the electroless plating solution was easily contaminated. The present invention improves the above-mentioned drawbacks, and provides a resist ink for electroless plating that can prevent copper flaking on printed wiring boards, is stable against chemical roughening solutions and electroless plating solutions, and has good printability. It is intended for the purpose of providing. In order to achieve the above object, the present invention provides an epoxy resin-based resist ink for electroless plating mainly consisting of an epoxy resin, a curing agent, a flow control agent, a filler, and a solvent, in which the filler is at least ultrafine silica particles. The present invention provides a resist ink for electroless plating characterized by containing 7 to 30% by weight of asbestos in solid components excluding solvent. That is, when manufacturing printed wiring boards, after applying an adhesive containing a plating catalyst such as Pd to a substrate of a paper phenolic resin laminate or paper epoxy resin laminate containing a plating catalyst such as Pd, the adhesive containing a plating catalyst such as Pd is applied. Print resist ink for electrolytic plating. This resist ink for electroless plating is made of an epoxy resin composition, in which a filler containing ultrafine silica and asbestos is mixed. It has the effect of suppressing the growth of metal adhering to the surface of this resist ink, and has the effect of reducing copper scattering. The optimum amount of filler is within this range; if it is less than 7% by weight, the printability of the ink will be poor, and if it is more than 30% by weight, the thixotropic properties will be impaired and the printability will be poor. In addition to ultrafine silica and asbestos, the filler contains aluminum silicate, zirconium silicate, barium sulfate, titanium oxide, and the like. When the total content of ultrafine silica and asbestos is in the range of 5 to 15% by weight, the printability is particularly good and the growth of copper plating during electroless copper plating is good. If it is less than 5%, thixotropic properties will be insufficient, and if it is more than 15%, the particle size will become high and printability will deteriorate. In addition, the content of ultrafine silica should preferably be in the range of 1.5 to 5% by weight; if it is less than 1.5% by weight, thixotropic properties will be poor and printability will decrease, and if it is more than 5% by weight, it will be difficult to use during electroless plating. Plating growth is reduced and moisture absorption insulation between lines is also reduced. For example, as a resist ink for electroless plating,
100 parts by weight of epoxy resin, 3 parts by weight of Modaflow as a flow control agent, Epiform as a hardening agent
Example 1 of the present invention, in which a filler containing 10 parts by weight of aluminum silicate, 12 parts by weight of zirconium silicate, 4 parts by weight of ultrafine silica, and 4 parts by weight of asbestos was mixed with 17 parts by weight and 30 parts by weight of butyl carbitol. , in the above composition, zirconium silicate is 9
Example 2 of the present invention with 3 parts by weight of ultrafine silica and 8 parts by weight of asbestos, and conventional example 1 with 14 parts by weight of zirconium silicate, 6 parts by weight of ultrafine silica, and 0 parts by weight of asbestos. , a printed wiring board printed on a substrate using Conventional Example 2 containing 0 parts by weight of ultrafine silica and 8 parts by weight of asbestos, and then subjected to chemical roughening and electroless plating treatments to provide copper plating. We measured printability, chemical roughening liquid resistance, plating growth rate by electroless plating, amount of copper dusting (number of copper particles visible under a 20x microscope), and moisture absorption insulation properties, and the results are shown in the table. Obtained. In other words, the present invention is better than the conventional method.
【表】
例に比べて、印刷性等の各特性が平均して優れて
いる。
以上の通り、本発明によれば、印刷配線板の製
造時に発生する銅ふり量が少なく、また印刷性や
耐化学粗化液性、めつき成長性を向上しうる、か
つ信頼性が高く製造の容易な印刷配線板を提供し
うる無電解めつき用レジストインクが得られる。[Table] Compared to the examples, each property such as printability is superior on average. As described above, according to the present invention, the amount of copper dust generated during manufacturing of printed wiring boards is small, printability, chemical roughening liquid resistance, and plating growth performance can be improved, and manufacturing can be performed with high reliability. A resist ink for electroless plating can be obtained that can provide a printed wiring board with ease.
Claims (1)
剤、充填剤及び溶剤からなるエポキシ樹脂系の無
電解めつき用レジストインクにおいて、充填剤
が、少なくとも超微粒子シリカとアスベストとを
含み、溶剤を除く固形成分中に７〜30重量％含ま
れていることを特徴とする無電解めつき用レジス
トインク。 ２ 超微粒子シリカとアスベストとが溶剤を除く
固形成分中に５〜15重量％含まれている特許請求
の範囲第１項記載の無電解めつき用レジストイン
ク。 ３ 超微粒子シリカが溶剤を除く固形成分中に
1.5〜５重量％含まれている特許請求の範囲第１
項又は第２項記載の無電解めつき用レジストイン
ク。[Scope of Claims] 1. An epoxy resin-based resist ink for electroless plating mainly consisting of an epoxy resin, a curing agent, a flow control agent, a filler, and a solvent, wherein the filler contains at least ultrafine silica and asbestos. , a resist ink for electroless plating characterized in that the solid component excluding the solvent contains 7 to 30% by weight. 2. The resist ink for electroless plating according to claim 1, wherein ultrafine silica particles and asbestos are contained in the solid components excluding the solvent in an amount of 5 to 15% by weight. 3. Ultrafine particle silica is contained in the solid components excluding the solvent.
Claim 1 containing 1.5 to 5% by weight
The resist ink for electroless plating according to item 1 or 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58135800A JPH0247542B2 (en) | 1983-07-27 | 1983-07-27 | MUDENKAIMETSUKYOREJISUTOINKU |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58135800A JPH0247542B2 (en) | 1983-07-27 | 1983-07-27 | MUDENKAIMETSUKYOREJISUTOINKU |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6029472A JPS6029472A (en) | 1985-02-14 |
| JPH0247542B2 true JPH0247542B2 (en) | 1990-10-22 |
Family
ID=15160110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58135800A Expired - Lifetime JPH0247542B2 (en) | 1983-07-27 | 1983-07-27 | MUDENKAIMETSUKYOREJISUTOINKU |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247542B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03160071A (en) * | 1989-11-18 | 1991-07-10 | Somar Corp | Photo-setting electroless plating resist ink composition |
| WO2000068330A1 (en) * | 1999-05-10 | 2000-11-16 | Shunichi Haruyama | Inorganic-organic film and starting liquid composition therefor and method for preparation thereof, and applications and method for preparing them |
| CN103596371B (en) * | 2013-11-29 | 2016-08-31 | 丁保美 | The manufacture method of wiring board |
-
1983
- 1983-07-27 JP JP58135800A patent/JPH0247542B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6029472A (en) | 1985-02-14 |
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