JPH0475946B2 - - Google Patents
Info
- Publication number
- JPH0475946B2 JPH0475946B2 JP23953784A JP23953784A JPH0475946B2 JP H0475946 B2 JPH0475946 B2 JP H0475946B2 JP 23953784 A JP23953784 A JP 23953784A JP 23953784 A JP23953784 A JP 23953784A JP H0475946 B2 JPH0475946 B2 JP H0475946B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- plating
- resin
- adhesion
- inorganic filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 239000000654 additive Substances 0.000 claims description 10
- 230000000996 additive effect Effects 0.000 claims description 10
- 239000011256 inorganic filler Substances 0.000 claims description 8
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 8
- 239000011134 resol-type phenolic resin Substances 0.000 claims description 8
- 229920003051 synthetic elastomer Polymers 0.000 claims description 8
- 239000005061 synthetic rubber Substances 0.000 claims description 8
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 5
- 239000000194 fatty acid Substances 0.000 claims description 5
- 229930195729 fatty acid Natural products 0.000 claims description 5
- 150000004665 fatty acids Chemical class 0.000 claims description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000012790 adhesive layer Substances 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 229920000459 Nitrile rubber Polymers 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000004744 fabric Substances 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Chemically Coating (AREA)
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、化学的金属めつきにより密着性の良
好な金属皮膜を形成するためのめつき下地用接着
剤に関する。
[従来技術]
一般的に、アデイテイブめつき用積層板には、
合成ゴムを含む硬化性樹脂よりなる厚さ20〜
50μmの接着剤層を表面コートしたものが使用さ
れている。即ち、この接着剤コート基板を周知の
アデイテイブめつき用プロセスにより、プリント
配線板に加工することができる。この場合、めつ
き金属と接着剤との強力な密着性を得るために、
接着剤中の合成ゴム成分をクロム酸/硫剤溶液等
で溶解して粗面化し多孔性表面を形成すること、
ラジカルを形成すること、及び親水性基として=
C=O、−OH等を形成することが、一般的に実
施されている。
しかし、化学めつきにより20〜40μmの金属皮
膜を形成する場合、めつきの応力等によりめつき
フクレが発生する。また、金属皮膜と接着剤層と
の密着力は1.5〜2.5Kg/cm程度で必ずしも充分と
はいえないものである。さらに、接着剤皮膜の熱
軟化の問題、加工性の点でも問題があつた。
[発明の目的]
本発明は、従来のアデイテイブ法におけるめつ
き金属皮膜と接着剤層との密着性の改良、向上を
目的として検討した結果完成されたものであり、
その目的は、接着剤層と金属めつき皮膜との密着
性が良好で、かつ耐熱性、加工性の点でも改良さ
れた、アデイテイブめつき用接着剤を提供するこ
とにある。
[発明の構成]
本発明は、合成ゴムを含む硬化性樹脂よりなる
アデイテイブめつき用接着剤において、レゾール
型フエノール樹脂又は脂肪酸で表面処理された無
機充填剤を添加したことを特徴とするアデイテイ
ブめつき用接着剤である。
合成ゴムとしては、アクリロニトリルブタジエ
ンゴム(NBR)、ブタジエンゴム(BR)、スチレ
ンブタジエンゴム(SBR)等が使用できる。
硬化性樹脂としては、熱硬化性樹脂及び光硬化
性樹脂が含まれる。熱硬化性樹脂としては、フエ
ノール樹脂、エポキシ樹脂、メラミン樹脂等が使
用できる。光硬化性樹脂としては、トリメチロー
ルプロパントリアクリレート、ペンタエリスリト
ールトリアクリレート等の多価アルコールのアク
リルエステルの重合物等が利用できる。
合成ゴムと硬化性樹脂の配合割合は、合成ゴム
30〜70%(重量%、以下同じ)、硬化性樹脂70〜
30%が好ましい。合成ゴムが30%未満の場合に
は、めつき前処理において酸化剤による粗面化が
充分にできず、接着剤層表面に多孔性化すること
ができない。一方、合成ゴムが70%を越えると、
プリント配線板としての耐熱性が低下して、実用
化が困難となる。
次に、本発明の特徴であるレゾール型フエノー
ル樹脂又は脂肪酸で表面処理された無機充填剤と
しては、シリカ、酸化チタン、アルミナ等の無機
充填剤を、前記レゾール型フエノール樹脂又は脂
肪酸の溶液中に浸漬後、乾燥、焼き付けすること
により得られるものである。
レゾール型フエノール樹脂又は脂肪酸は−OH
基あるいは−COOH基を有しているので、かか
る官能基を無機質充填剤に付与することにより、
めつき工程でのパラジウム(Pd)触媒付加の際、
Pdと接着剤との密着性が著しく改良されるので、
後工程で化学銅めつきを行う際、めつき応力によ
るめつき金属皮膜の剥離がなくなる。
無機質充填剤の添加量は特に限定されないが、
接着剤固形分に対して1〜30%が好ましい。1%
未満ではPd触媒の密着力改良の効果が小さく、
30%を越えると、接着剤の粘度が上昇して実用性
が小さくなる傾向がある。
無機質充填剤の粒径は通常20μm以下であり、
特に0.01〜10μmが好ましい。粒径が20μmを越え
ると、充填剤の表面積が小さくなり所期の目的を
達成することがむずかしくなる。粒径が0.01〜
10μmでめつき金属皮膜の密着力が特によく、接
着剤の粘度上昇も大きくなく、実用上最も好まし
いものである。
[発明の効果]
本発明で得られたアデイテイブめつき用接着剤
は、次のような特長をしている。
(1) めつき前処理のPd粒子との密着性が良好で
あるので、めつき金属と接着剤層との密着性が
優れている。
(2) 無機質充填剤の補強効果により、接着剤皮膜
が物理的に硬く、耐熱変形性が良好となる。
(3) 接着剤を積層板の表面にコートした後に行わ
れるドリル穴あけ又は打抜プレスによる穴あけ
工程における加工性が良好である。
(4) 充填剤が官能基を有しているので、接着剤中
での充填剤の沈降、分離が防止できる。
[実施例]
本発明によるアデイテイブめつき用接着剤につ
いて、以下に実施例及び比較例により説明する。
実施例 1
NBR 50g
レゾール型フエノール樹脂 50g
レゾール型フエノール樹脂で表面コートされた
シリカ(粒径3〜5μm、官能基数109/m2) 3g
メチルエチルケトン 200g
上記の樹脂混合物をエポキシ樹脂/ガラスクロ
ス積層板に塗工し、厚み40μの接着剤層を形成し
た。この接着剤コート積層板に通常のアデイテイ
ブ法により30μmの化学銅めつきを行つた。
実施例 2
NBR 50g
エポキシ樹脂(Epon828) 50g
硬化剤(ジシアンジアミド) 5g
カプロン酸でコートされたタルク(粒径3〜
5μm、官能基数109/m2) 3g
メチルエチルケトン 200g
上記の樹脂混合物をエポキシ樹脂/ガラスクロ
ス積層板に塗工し、厚み40μの接着剤層を形成し
た。この接着剤コート積層板に通常のアデイテイ
ブ法により30μmの化学銅めつきを行つた。
比較例 1
NBR 50g
レゾール型フエノール樹脂 50g
シリカ(粒径3〜5μm) 3g
メチルエチルケトン 200g
上記の樹脂混合物を使用して、実施例と同様に
してエポキシ樹脂/ガラスクロス積層板に30μm
の化学銅めつきを行つた。
比較例 2
NBR 50g
エポキシ樹脂 50g
硬化剤(ジシアンジアミド) 5g
タルク(粒径3〜5μm) 3g
メチルエチルケトン 200g
上記の樹脂混合物を使用して、実施例と同様に
してエポキシ樹脂/ガラスクロス積層板に30μm
の化学銅めつきを行つた。
上記各例によつて得られた化学銅めつき付積層
板の特性は第1表の通りである。
【表】DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a plating base adhesive for forming a metal film with good adhesion by chemical metal plating. [Prior art] In general, laminates for additive plating include:
Made of curable resin containing synthetic rubber, thickness 20~
The surface is coated with a 50μm adhesive layer. That is, this adhesive-coated substrate can be processed into a printed wiring board by a well-known additive plating process. In this case, in order to obtain strong adhesion between the plated metal and the adhesive,
Roughening the synthetic rubber component in the adhesive by dissolving it with a chromic acid/sulfur solution, etc. to form a porous surface;
Forming radicals and as hydrophilic groups =
Forming C=O, -OH, etc. is commonly practiced. However, when forming a metal film of 20 to 40 μm by chemical plating, plating blisters occur due to the stress of plating. Further, the adhesion between the metal film and the adhesive layer is about 1.5 to 2.5 kg/cm, which is not necessarily sufficient. Furthermore, there were also problems in heat softening of the adhesive film and in processability. [Object of the Invention] The present invention was completed as a result of studies aimed at improving and improving the adhesion between the plated metal film and the adhesive layer in the conventional additive method.
The purpose is to provide an adhesive for additive plating that has good adhesion between the adhesive layer and the metal plating film and is also improved in terms of heat resistance and processability. [Structure of the Invention] The present invention provides an adhesive for additive plating made of a curable resin containing synthetic rubber, which is characterized in that an inorganic filler surface-treated with a resol type phenolic resin or a fatty acid is added. It is an adhesive for attaching. As the synthetic rubber, acrylonitrile butadiene rubber (NBR), butadiene rubber (BR), styrene butadiene rubber (SBR), etc. can be used. Curable resins include thermosetting resins and photocurable resins. As the thermosetting resin, phenol resin, epoxy resin, melamine resin, etc. can be used. As the photocurable resin, polymers of acrylic esters of polyhydric alcohols such as trimethylolpropane triacrylate and pentaerythritol triacrylate can be used. The blending ratio of synthetic rubber and curable resin is
30~70% (weight%, same below), curable resin 70~
30% is preferred. If the synthetic rubber content is less than 30%, the surface cannot be sufficiently roughened with an oxidizing agent in the plating pretreatment, and the surface of the adhesive layer cannot be made porous. On the other hand, if the synthetic rubber content exceeds 70%,
The heat resistance as a printed wiring board deteriorates, making it difficult to put it into practical use. Next, as the inorganic filler surface-treated with resol type phenolic resin or fatty acid, which is a feature of the present invention, an inorganic filler such as silica, titanium oxide, alumina, etc. is added to the solution of the resol type phenolic resin or fatty acid. It is obtained by dipping, drying, and baking. Resol type phenolic resin or fatty acid is -OH
group or -COOH group, by adding such a functional group to the inorganic filler,
When adding palladium (Pd) catalyst in the plating process,
Since the adhesion between Pd and adhesive is significantly improved,
When chemical copper plating is performed in the post-process, peeling of the plating metal film due to plating stress is eliminated. The amount of inorganic filler added is not particularly limited, but
It is preferably 1 to 30% based on the solid content of the adhesive. 1%
Below this, the effect of improving the adhesion of the Pd catalyst is small;
If it exceeds 30%, the viscosity of the adhesive tends to increase, making it less practical. The particle size of the inorganic filler is usually 20μm or less,
Particularly preferred is 0.01 to 10 μm. When the particle size exceeds 20 μm, the surface area of the filler decreases, making it difficult to achieve the intended purpose. Particle size is 0.01~
At 10 μm, the adhesion of the plated metal film is particularly good, and the viscosity of the adhesive does not increase significantly, making it the most preferred for practical use. [Effects of the Invention] The adhesive for additive plating obtained by the present invention has the following features. (1) Since the adhesion with the Pd particles in the plating pretreatment is good, the adhesion between the plating metal and the adhesive layer is excellent. (2) Due to the reinforcing effect of the inorganic filler, the adhesive film becomes physically hard and has good heat deformation resistance. (3) Good workability in the hole-drilling or punch-pressing step performed after coating the surface of the laminate with the adhesive. (4) Since the filler has a functional group, sedimentation and separation of the filler in the adhesive can be prevented. [Examples] The adhesive for additive plating according to the present invention will be explained below using Examples and Comparative Examples. Example 1 NBR 50g Resol type phenolic resin 50g Silica whose surface is coated with resol type phenolic resin (particle size 3 to 5 μm, number of functional groups 109 / m2 ) 3g Methyl ethyl ketone 200g The above resin mixture was mixed into an epoxy resin/glass cloth laminate. to form an adhesive layer with a thickness of 40μ. This adhesive-coated laminate was chemically plated with copper to a thickness of 30 μm using a conventional additive method. Example 2 NBR 50g Epoxy resin (Epon828) 50g Hardening agent (dicyandiamide) 5g Talc coated with caproic acid (particle size 3~
5 μm, number of functional groups: 10 9 /m 2 ) 3 g Methyl ethyl ketone 200 g The above resin mixture was applied to an epoxy resin/glass cloth laminate to form an adhesive layer with a thickness of 40 μ. This adhesive-coated laminate was chemically plated with copper to a thickness of 30 μm using a conventional additive method. Comparative Example 1 NBR 50g Resol type phenolic resin 50g Silica (particle size 3-5μm) 3g Methyl ethyl ketone 200g Using the above resin mixture, 30μm epoxy resin/glass cloth laminate was coated in the same manner as in Example.
Chemical copper plating was carried out. Comparative Example 2 NBR 50g Epoxy resin 50g Curing agent (dicyandiamide) 5g Talc (particle size 3-5μm) 3g Methyl ethyl ketone 200g Using the above resin mixture, 30μm epoxy resin/glass cloth laminate was applied in the same manner as in Example.
Chemical copper plating was carried out. The properties of the chemical copper-plated laminates obtained in each of the above examples are shown in Table 1. 【table】
Claims (1)
イブめつき用接着剤において、レゾール型フエノ
ール樹脂又は脂肪酸で表面処理された無機充填剤
を添加したことを特徴とするアデイテイブめつき
用接着剤。1. An adhesive for additive plating made of a curable resin containing synthetic rubber, characterized in that it contains an inorganic filler surface-treated with a resol type phenolic resin or a fatty acid.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23953784A JPS61118478A (en) | 1984-11-15 | 1984-11-15 | Adhesive for additive plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23953784A JPS61118478A (en) | 1984-11-15 | 1984-11-15 | Adhesive for additive plating |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61118478A JPS61118478A (en) | 1986-06-05 |
JPH0475946B2 true JPH0475946B2 (en) | 1992-12-02 |
Family
ID=17046282
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23953784A Granted JPS61118478A (en) | 1984-11-15 | 1984-11-15 | Adhesive for additive plating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61118478A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5237328B2 (en) * | 2010-05-26 | 2013-07-17 | パナソニック株式会社 | Liquid epoxy resin composition for reinforcing secondary mounting of FBGA package and FBGA package |
-
1984
- 1984-11-15 JP JP23953784A patent/JPS61118478A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61118478A (en) | 1986-06-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4911795B2 (en) | Manufacturing method of laminate | |
JP5799174B2 (en) | Insulating resin film, pre-cured product, laminate and multilayer substrate | |
US5571365A (en) | Adhesive for printed circuit board | |
JP4556260B2 (en) | Additive insulation film for printed wiring boards | |
JPH0475946B2 (en) | ||
JP4556261B2 (en) | Additive adhesive for printed wiring boards | |
JP4400060B2 (en) | Insulating resin composition and use thereof | |
JP2013075440A (en) | Method for manufacturing laminate, and laminate structure | |
JPH0475947B2 (en) | ||
JP3536937B2 (en) | Additive method adhesive for printed wiring board and method for manufacturing wiring board using the adhesive | |
JP3975984B2 (en) | Insulating substrate in adhesive state with copper | |
JP3637613B2 (en) | Manufacturing method of multilayer wiring board | |
JP3697726B2 (en) | Manufacturing method of multilayer wiring board | |
JPH02272075A (en) | Adhesive composition for additive printed wiring board | |
JP3517996B2 (en) | Additive adhesive for printed circuit boards | |
JPH04314391A (en) | Adhesive for fabricating printed circuit board by additive process | |
JP2614835B2 (en) | Printed wiring board | |
JP4051587B2 (en) | Method for producing multilayer wiring board using resin composition curable by heat or light | |
JPH0247542B2 (en) | MUDENKAIMETSUKYOREJISUTOINKU | |
JPH0573078B2 (en) | ||
JP3775824B2 (en) | Additive adhesive for printed wiring board, adhesive sheet and multilayer printed wiring board | |
JP2004137478A (en) | Adhesive | |
JPH023484A (en) | Adhesive for electroless plating and substrate | |
JPH10265752A (en) | Adhesive for additive-type printed circuit board | |
JPH09139579A (en) | Manufacture of multilayer printed wiring board |