JPS56166255A - Epoxy resin composition for pressure molding - Google Patents

Epoxy resin composition for pressure molding

Info

Publication number
JPS56166255A
JPS56166255A JP6955680A JP6955680A JPS56166255A JP S56166255 A JPS56166255 A JP S56166255A JP 6955680 A JP6955680 A JP 6955680A JP 6955680 A JP6955680 A JP 6955680A JP S56166255 A JPS56166255 A JP S56166255A
Authority
JP
Japan
Prior art keywords
epoxy resin
filler
particle diameter
liquid epoxy
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6955680A
Other languages
Japanese (ja)
Other versions
JPS6144109B2 (en
Inventor
Junichi Katagiri
Shigeo Hosaka
Toshikazu Narahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6955680A priority Critical patent/JPS56166255A/en
Publication of JPS56166255A publication Critical patent/JPS56166255A/en
Publication of JPS6144109B2 publication Critical patent/JPS6144109B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)

Abstract

PURPOSE: To obtain the titled composition capable of giving a cured article having improved molding fluidity and heat and impact resistance, by incorporating three specific types of fillers having different particle sizes in large amounts with a liquid epoxy resin.
CONSTITUTION: (A) A liquid epoxy resin is incorporated with (B) a mixed filler of (i) an inorganic filler containing 90wt% or more SiO2 having a particle diameter of 5W150μ, (ii) silica sand having a particle diameter of 150W1,000μ and (iii) a fine powdery filler, e.g. quartz powder, having a particle diameter ≤5μ, in an amount of 3.5W6 times that of the resin (A). The weight ratio between the silica sand (ii) and the filler containing SiO2 (i) is 1W6, and the amount of the fine powdery filler based on the total weight of the filler is 1W20wt%. The addition of 20W60wt% bisphenol A type epoxy resin having an epoxy equivalent of 200W500 to the liquid epoxy resin further improves the heat and impact resistance of the composition. A powdery hydroxy compound, particularly 4,4'-isopropylidenediphenol, used as a curing agent further improves the storage stability of the composition.
COPYRIGHT: (C)1981,JPO&Japio
JP6955680A 1980-05-27 1980-05-27 Epoxy resin composition for pressure molding Granted JPS56166255A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6955680A JPS56166255A (en) 1980-05-27 1980-05-27 Epoxy resin composition for pressure molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6955680A JPS56166255A (en) 1980-05-27 1980-05-27 Epoxy resin composition for pressure molding

Publications (2)

Publication Number Publication Date
JPS56166255A true JPS56166255A (en) 1981-12-21
JPS6144109B2 JPS6144109B2 (en) 1986-10-01

Family

ID=13406126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6955680A Granted JPS56166255A (en) 1980-05-27 1980-05-27 Epoxy resin composition for pressure molding

Country Status (1)

Country Link
JP (1) JPS56166255A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0626655A (en) * 1992-07-07 1994-02-04 Matsushita Electric Ind Co Ltd High-frequency oven
JP5206323B2 (en) * 2008-10-31 2013-06-12 パナソニック株式会社 Molded motor

Also Published As

Publication number Publication date
JPS6144109B2 (en) 1986-10-01

Similar Documents

Publication Publication Date Title
KR900013006A (en) Epoxy resin composition for semiconductor encapsulation and cured product thereof
JPS56136816A (en) Epoxy resin composition
KR920016518A (en) Fillers for Thermally Conductive Plastic Materials
JPS5610947A (en) Semiconductor sealing resin composition
ES367513A1 (en) Hardenable composition with resinous binder containing spheroidal micronic inorganic particles
JPS56166255A (en) Epoxy resin composition for pressure molding
JPS55118952A (en) Epoxy resin composition for sealing semiconductor
JPS5359798A (en) Epoxy resin composition of excellent warm-water resistance
JPS5679170A (en) Adhesive composition
JPS56122145A (en) Resin composition for sealing semiconductor device
JPS6429416A (en) Epoxy resin composition
JPS55125168A (en) Long-term rust-preventive coating composition
JPS5755921A (en) Water-resistant epoxy resin composition
JPS5747323A (en) Epoxy resin composition having improved resistance to hot water at high temperature
JPS56139563A (en) Powdered epoxy resin paint composition
JPS56149454A (en) Preparation of epoxy resin molding compound
JPS57187355A (en) Molding material
JPS57158259A (en) Curable soundproof composition
JPS5730719A (en) Preparation of cured novolak type epoxy resin
JPS5321298A (en) Epoxy resin composition filled with inorganic material
JPS53129292A (en) Curing of caking agent
Thai et al. Epoxy Resin Composition for Cast Molding
JPS57133120A (en) Manufacturing of cast epoxy resin
JPS5634758A (en) Semiconductor resin composition
JPS57162764A (en) Preparation of chemically platable powder coating