JPS56166255A - Epoxy resin composition for pressure molding - Google Patents
Epoxy resin composition for pressure moldingInfo
- Publication number
- JPS56166255A JPS56166255A JP6955680A JP6955680A JPS56166255A JP S56166255 A JPS56166255 A JP S56166255A JP 6955680 A JP6955680 A JP 6955680A JP 6955680 A JP6955680 A JP 6955680A JP S56166255 A JPS56166255 A JP S56166255A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- filler
- particle diameter
- liquid epoxy
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Abstract
PURPOSE: To obtain the titled composition capable of giving a cured article having improved molding fluidity and heat and impact resistance, by incorporating three specific types of fillers having different particle sizes in large amounts with a liquid epoxy resin.
CONSTITUTION: (A) A liquid epoxy resin is incorporated with (B) a mixed filler of (i) an inorganic filler containing 90wt% or more SiO2 having a particle diameter of 5W150μ, (ii) silica sand having a particle diameter of 150W1,000μ and (iii) a fine powdery filler, e.g. quartz powder, having a particle diameter ≤5μ, in an amount of 3.5W6 times that of the resin (A). The weight ratio between the silica sand (ii) and the filler containing SiO2 (i) is 1W6, and the amount of the fine powdery filler based on the total weight of the filler is 1W20wt%. The addition of 20W60wt% bisphenol A type epoxy resin having an epoxy equivalent of 200W500 to the liquid epoxy resin further improves the heat and impact resistance of the composition. A powdery hydroxy compound, particularly 4,4'-isopropylidenediphenol, used as a curing agent further improves the storage stability of the composition.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6955680A JPS56166255A (en) | 1980-05-27 | 1980-05-27 | Epoxy resin composition for pressure molding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6955680A JPS56166255A (en) | 1980-05-27 | 1980-05-27 | Epoxy resin composition for pressure molding |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56166255A true JPS56166255A (en) | 1981-12-21 |
JPS6144109B2 JPS6144109B2 (en) | 1986-10-01 |
Family
ID=13406126
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6955680A Granted JPS56166255A (en) | 1980-05-27 | 1980-05-27 | Epoxy resin composition for pressure molding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56166255A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0626655A (en) * | 1992-07-07 | 1994-02-04 | Matsushita Electric Ind Co Ltd | High-frequency oven |
JP5206323B2 (en) * | 2008-10-31 | 2013-06-12 | パナソニック株式会社 | Molded motor |
-
1980
- 1980-05-27 JP JP6955680A patent/JPS56166255A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6144109B2 (en) | 1986-10-01 |
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