JPS5634758A - Semiconductor resin composition - Google Patents

Semiconductor resin composition

Info

Publication number
JPS5634758A
JPS5634758A JP10993079A JP10993079A JPS5634758A JP S5634758 A JPS5634758 A JP S5634758A JP 10993079 A JP10993079 A JP 10993079A JP 10993079 A JP10993079 A JP 10993079A JP S5634758 A JPS5634758 A JP S5634758A
Authority
JP
Japan
Prior art keywords
filler
90vol
particles
vol
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10993079A
Other languages
Japanese (ja)
Other versions
JPS581147B2 (en
Inventor
Tadaharu Yoshiga
Kazuo Iko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP10993079A priority Critical patent/JPS581147B2/en
Publication of JPS5634758A publication Critical patent/JPS5634758A/en
Publication of JPS581147B2 publication Critical patent/JPS581147B2/en
Expired legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: The titled composition that is prepared by adding fillers mainly composed of a silicone powder or a mixture thereof with other powders to a heat-curable resin containing a curing agent, thus having stabilized electric resistance and fuidity necessary for casting materials.
CONSTITUTION: 100pts.vol. of the resin component composed of a heat-curable resin such as epoxy resin and a curing agent and 100W200pts.vol. of a filler imparting semiconductivity are combined. The filler is composed of (A) a powder of a metal or metal carbide, which contains at least 90vol% of silicone powder and more than 90vol% of particles with particles sizes of less than 149μ in the total amount of the filler, or (B) a mixture of the filler A with (b) another inorganic filler containing at least 90vol% of particles of less than 149μ such as a metal oxide wherein, when (b) is employed, the volume ratio of A/b is adusted to over 0.1. The specific resistance of the molded products becomes 102W1012Ωcm.
COPYRIGHT: (C)1981,JPO&Japio
JP10993079A 1979-08-28 1979-08-28 Semiconductive resin composition Expired JPS581147B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10993079A JPS581147B2 (en) 1979-08-28 1979-08-28 Semiconductive resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10993079A JPS581147B2 (en) 1979-08-28 1979-08-28 Semiconductive resin composition

Publications (2)

Publication Number Publication Date
JPS5634758A true JPS5634758A (en) 1981-04-07
JPS581147B2 JPS581147B2 (en) 1983-01-10

Family

ID=14522709

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10993079A Expired JPS581147B2 (en) 1979-08-28 1979-08-28 Semiconductive resin composition

Country Status (1)

Country Link
JP (1) JPS581147B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608324A (en) * 1983-06-29 1985-01-17 Toyo Soda Mfg Co Ltd Antistatic resin composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608324A (en) * 1983-06-29 1985-01-17 Toyo Soda Mfg Co Ltd Antistatic resin composition

Also Published As

Publication number Publication date
JPS581147B2 (en) 1983-01-10

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