JPS57162764A - Preparation of chemically platable powder coating - Google Patents
Preparation of chemically platable powder coatingInfo
- Publication number
- JPS57162764A JPS57162764A JP4889181A JP4889181A JPS57162764A JP S57162764 A JPS57162764 A JP S57162764A JP 4889181 A JP4889181 A JP 4889181A JP 4889181 A JP4889181 A JP 4889181A JP S57162764 A JPS57162764 A JP S57162764A
- Authority
- JP
- Japan
- Prior art keywords
- rubber
- epoxy resin
- mixture
- inorganic filler
- powder coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To prepare the titled powder coating having improved heat resistance, and suitable for the manufacturing of a metal-cored printed circuit board, by mixing specific amounts of a specific epoxy resin, a specific rubber and an inorganic filler, and finely pulverizing the mixture.
CONSTITUTION: The objective composition is prepared preferably by (1) crosslinking a mixture of 100pts.wt. of an epoxy resin (e.g. bisphenol A-epichlorohydrin epoxy resin) and 1W200pts. of a rubber (e.g. acrylonitrile-butadiene rubber), (2) mixing the reaction product, if necessary, with additional epoxy resin, rubber and an inorganic filler (e.g. zirconium silicate) to obtain a composition composed of 100pts. of epoxy resin, 1W60pts. of rubber and preferably 5W100pts. of inorganic filler, and (3) kneading the mixture and finely pulverizing the product.
EFFECT: The pulverization workability and its yield are improved, and the tolerable amount of the rubber is increased.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4889181A JPS57162764A (en) | 1981-03-31 | 1981-03-31 | Preparation of chemically platable powder coating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4889181A JPS57162764A (en) | 1981-03-31 | 1981-03-31 | Preparation of chemically platable powder coating |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57162764A true JPS57162764A (en) | 1982-10-06 |
Family
ID=12815887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4889181A Pending JPS57162764A (en) | 1981-03-31 | 1981-03-31 | Preparation of chemically platable powder coating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57162764A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60127348A (en) * | 1983-12-12 | 1985-07-08 | Kanegafuchi Chem Ind Co Ltd | Epoxy resin composition and electrical laminated board |
WO2004085550A3 (en) * | 2003-03-26 | 2005-08-18 | Atotech Deutschland Gmbh | Powder coating and process for the preparation of thin layers in the manufacture of printed circuit boards |
JP2012517491A (en) * | 2009-02-09 | 2012-08-02 | ハンツマン・アドヴァンスト・マテリアルズ・(スイッツランド)・ゲーエムベーハー | Powder coating composition |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54157150A (en) * | 1978-06-01 | 1979-12-11 | Nitto Electric Ind Co Ltd | Granular polymer composition |
JPS5584371A (en) * | 1978-12-20 | 1980-06-25 | Dainippon Ink & Chem Inc | Epoxy resin composition for powdered paint |
-
1981
- 1981-03-31 JP JP4889181A patent/JPS57162764A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54157150A (en) * | 1978-06-01 | 1979-12-11 | Nitto Electric Ind Co Ltd | Granular polymer composition |
JPS5584371A (en) * | 1978-12-20 | 1980-06-25 | Dainippon Ink & Chem Inc | Epoxy resin composition for powdered paint |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60127348A (en) * | 1983-12-12 | 1985-07-08 | Kanegafuchi Chem Ind Co Ltd | Epoxy resin composition and electrical laminated board |
JPS6336934B2 (en) * | 1983-12-12 | 1988-07-22 | Kanegafuchi Chemical Ind | |
WO2004085550A3 (en) * | 2003-03-26 | 2005-08-18 | Atotech Deutschland Gmbh | Powder coating and process for the preparation of thin layers in the manufacture of printed circuit boards |
JP2012517491A (en) * | 2009-02-09 | 2012-08-02 | ハンツマン・アドヴァンスト・マテリアルズ・(スイッツランド)・ゲーエムベーハー | Powder coating composition |
US8912254B2 (en) | 2009-02-09 | 2014-12-16 | Huntsman International Llc | Powder coating composition |
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