JPS57180626A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS57180626A
JPS57180626A JP6417881A JP6417881A JPS57180626A JP S57180626 A JPS57180626 A JP S57180626A JP 6417881 A JP6417881 A JP 6417881A JP 6417881 A JP6417881 A JP 6417881A JP S57180626 A JPS57180626 A JP S57180626A
Authority
JP
Japan
Prior art keywords
resin
dispersant
curing agent
composition
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6417881A
Other languages
Japanese (ja)
Other versions
JPS6351447B2 (en
Inventor
Masanori Segawa
Masahiro Kitamura
Yasuhide Sugawara
Hiroshi Suzuki
Shunichi Numata
Kunihiko Nishi
Takashi Urano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP6417881A priority Critical patent/JPS57180626A/en
Publication of JPS57180626A publication Critical patent/JPS57180626A/en
Publication of JPS6351447B2 publication Critical patent/JPS6351447B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: The titled composition which, when cured, can provide a resin layer throughout which rubbery particles are uniformly dispersed, and which has excellent mechanical and electrical properties, prepared by adding a phenolic resin as a dispersant and a curing agent to a composition consisting of an epoxy resin and a polybutadiene derivative having a functional group such as a carboxyl group at a terminal.
CONSTITUTION: The resin composition comprises (A) a polyepoxy compound (e.g., diglycidyl ether of bisphenol A), (B) a reaction product of a phenolic compound and formaldehyde as a dispersant and a curing agent, and (C), as a rubber component, a polybutadiene derivative containing, in the molecule, at least one member selected from the group consisting of carboxyl, amino, hydroxyl, epoxy, thiol and isocyanato. Said phenolic resin acts, before heating, as a dispersant for dispersing the rubbery polybutadiene derivative in the epoxy resin and, during heating, as a curing agent for the epoxy resin. This composition is freed from the conventional defects, and is useful as a material for packaging semiconductor elements.
COPYRIGHT: (C)1982,JPO&Japio
JP6417881A 1981-04-30 1981-04-30 Thermosetting resin composition Granted JPS57180626A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6417881A JPS57180626A (en) 1981-04-30 1981-04-30 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6417881A JPS57180626A (en) 1981-04-30 1981-04-30 Thermosetting resin composition

Publications (2)

Publication Number Publication Date
JPS57180626A true JPS57180626A (en) 1982-11-06
JPS6351447B2 JPS6351447B2 (en) 1988-10-14

Family

ID=13250542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6417881A Granted JPS57180626A (en) 1981-04-30 1981-04-30 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS57180626A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6162511A (en) * 1984-09-05 1986-03-31 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPS6162514A (en) * 1984-09-05 1986-03-31 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPH0341146A (en) * 1989-12-15 1991-02-21 Hitachi Ltd Resin composition
US5162437A (en) * 1989-03-15 1992-11-10 Sanyo Chemical Industries, Ltd. Epoxy resin composition with hydrogenated diene glycidyl ether
JPH05244493A (en) * 1992-07-31 1993-09-21 Canon Inc Picture processing method
WO2004069928A1 (en) * 2003-02-10 2004-08-19 Kuraray Co., Ltd. Epoxy resin composition
JP2004244442A (en) * 2003-02-10 2004-09-02 Kuraray Co Ltd Epoxy resin composition
JP2004244441A (en) * 2003-02-10 2004-09-02 Kuraray Co Ltd Thermosetting resin composition

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51135936A (en) * 1975-05-20 1976-11-25 Nitto Electric Ind Co Ltd Adhesive composition
JPS53101051A (en) * 1977-02-15 1978-09-04 Matsushita Electric Works Ltd Epoxy resin composition
JPS555963A (en) * 1978-06-28 1980-01-17 Matsushita Electric Ind Co Ltd Epoxy resin composition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51135936A (en) * 1975-05-20 1976-11-25 Nitto Electric Ind Co Ltd Adhesive composition
JPS53101051A (en) * 1977-02-15 1978-09-04 Matsushita Electric Works Ltd Epoxy resin composition
JPS555963A (en) * 1978-06-28 1980-01-17 Matsushita Electric Ind Co Ltd Epoxy resin composition

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6162511A (en) * 1984-09-05 1986-03-31 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPS6162514A (en) * 1984-09-05 1986-03-31 Sumitomo Bakelite Co Ltd Epoxy resin composition
US5162437A (en) * 1989-03-15 1992-11-10 Sanyo Chemical Industries, Ltd. Epoxy resin composition with hydrogenated diene glycidyl ether
JPH0341146A (en) * 1989-12-15 1991-02-21 Hitachi Ltd Resin composition
JPH05244493A (en) * 1992-07-31 1993-09-21 Canon Inc Picture processing method
WO2004069928A1 (en) * 2003-02-10 2004-08-19 Kuraray Co., Ltd. Epoxy resin composition
JP2004244442A (en) * 2003-02-10 2004-09-02 Kuraray Co Ltd Epoxy resin composition
JP2004244441A (en) * 2003-02-10 2004-09-02 Kuraray Co Ltd Thermosetting resin composition
US7652104B2 (en) 2003-02-10 2010-01-26 Kuraray Co., Ltd. Epoxy resin composition

Also Published As

Publication number Publication date
JPS6351447B2 (en) 1988-10-14

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