JPS56122145A - Resin composition for sealing semiconductor device - Google Patents

Resin composition for sealing semiconductor device

Info

Publication number
JPS56122145A
JPS56122145A JP2474380A JP2474380A JPS56122145A JP S56122145 A JPS56122145 A JP S56122145A JP 2474380 A JP2474380 A JP 2474380A JP 2474380 A JP2474380 A JP 2474380A JP S56122145 A JPS56122145 A JP S56122145A
Authority
JP
Japan
Prior art keywords
added
mold releasing
resin composition
nonsilicone
inorganic filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2474380A
Other languages
Japanese (ja)
Other versions
JPS6129544B2 (en
Inventor
Kunio Ito
Akitoshi Komiya
Yoshio Fujimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP2474380A priority Critical patent/JPS56122145A/en
Publication of JPS56122145A publication Critical patent/JPS56122145A/en
Publication of JPS6129544B2 publication Critical patent/JPS6129544B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To obtain a resin composition having preferable workability by mixing fine powdery silica surface treated with silicone resin, epoxy resin, inorganic filler or organic silicon compound; nonsilicone mold releasing agent and curing catalyst at predetermined ratios. CONSTITUTION:Inorganic filler such as quartz or the like is added in 100- 600pts.wt. to 100pts.wt. of silicone resin or epoxy resin to improve the size stability, mechanical strength and heat resistance of the molded product. Then, surface treated fine powdery silica having more than 50m<2>/g of specific surfce area is added in 1-25pts.wt. to the mixture, and 0.3-10pts.wt. of nonsilicone mold releasing agent such as higher fatty acid or the like having high mold releasing, heat resistant and moisture resistant properties is added thereto. Further, 0.1-5pts.wt. of organic carboxylic acid is added thereto. With such composition the sealing resin composition has excellent fluidity, high curing velocity, no burr, excellent mold releasing property and no void.
JP2474380A 1980-02-29 1980-02-29 Resin composition for sealing semiconductor device Granted JPS56122145A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2474380A JPS56122145A (en) 1980-02-29 1980-02-29 Resin composition for sealing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2474380A JPS56122145A (en) 1980-02-29 1980-02-29 Resin composition for sealing semiconductor device

Publications (2)

Publication Number Publication Date
JPS56122145A true JPS56122145A (en) 1981-09-25
JPS6129544B2 JPS6129544B2 (en) 1986-07-07

Family

ID=12146621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2474380A Granted JPS56122145A (en) 1980-02-29 1980-02-29 Resin composition for sealing semiconductor device

Country Status (1)

Country Link
JP (1) JPS56122145A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57195117A (en) * 1981-05-27 1982-11-30 Sumitomo Bakelite Co Ltd Epoxy resin composition and its preparation
JPS5947744A (en) * 1982-09-10 1984-03-17 Toshiba Ceramics Co Ltd Filler material for ic package
EP0114474A1 (en) * 1982-12-27 1984-08-01 Western Electric Company, Incorporated Methods of encapsulating electronic circuits
JPS59197421A (en) * 1983-04-26 1984-11-09 Shin Etsu Chem Co Ltd Curable epoxy resin composition
JPS6047019A (en) * 1983-08-25 1985-03-14 Toshiba Chem Corp Sealing epoxy resin composition
JPS61219A (en) * 1984-06-13 1986-01-06 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS61254619A (en) * 1985-05-07 1986-11-12 Shin Etsu Chem Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS6438424A (en) * 1987-08-03 1989-02-08 Matsushita Electric Works Ltd Epoxy resin molding material

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3334062A (en) * 1965-03-01 1967-08-01 Dow Corning Process for rendering inorganic powders hydrophobic
JPS4714148U (en) * 1971-03-16 1972-10-19
JPS48101444A (en) * 1972-03-02 1973-12-20

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3334062A (en) * 1965-03-01 1967-08-01 Dow Corning Process for rendering inorganic powders hydrophobic
JPS4714148U (en) * 1971-03-16 1972-10-19
JPS48101444A (en) * 1972-03-02 1973-12-20

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57195117A (en) * 1981-05-27 1982-11-30 Sumitomo Bakelite Co Ltd Epoxy resin composition and its preparation
JPS6243452B2 (en) * 1981-05-27 1987-09-14 Sumitomo Bakelite Co
JPS5947744A (en) * 1982-09-10 1984-03-17 Toshiba Ceramics Co Ltd Filler material for ic package
JPS6332268B2 (en) * 1982-09-10 1988-06-29 Toshiba Ceramics Co
EP0114474A1 (en) * 1982-12-27 1984-08-01 Western Electric Company, Incorporated Methods of encapsulating electronic circuits
US4508758A (en) * 1982-12-27 1985-04-02 At&T Technologies, Inc. Encapsulated electronic circuit
JPS6248968B2 (en) * 1983-04-26 1987-10-16 Shinetsu Chem Ind Co
JPS59197421A (en) * 1983-04-26 1984-11-09 Shin Etsu Chem Co Ltd Curable epoxy resin composition
JPS6047019A (en) * 1983-08-25 1985-03-14 Toshiba Chem Corp Sealing epoxy resin composition
JPS61219A (en) * 1984-06-13 1986-01-06 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS6247883B2 (en) * 1984-06-13 1987-10-09 Shinetsu Chem Ind Co
JPS6326128B2 (en) * 1985-05-07 1988-05-28 Shinetsu Chem Ind Co
JPS61254619A (en) * 1985-05-07 1986-11-12 Shin Etsu Chem Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS6438424A (en) * 1987-08-03 1989-02-08 Matsushita Electric Works Ltd Epoxy resin molding material

Also Published As

Publication number Publication date
JPS6129544B2 (en) 1986-07-07

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