JPS6438424A - Epoxy resin molding material - Google Patents

Epoxy resin molding material

Info

Publication number
JPS6438424A
JPS6438424A JP19392787A JP19392787A JPS6438424A JP S6438424 A JPS6438424 A JP S6438424A JP 19392787 A JP19392787 A JP 19392787A JP 19392787 A JP19392787 A JP 19392787A JP S6438424 A JPS6438424 A JP S6438424A
Authority
JP
Japan
Prior art keywords
epoxy resin
optionally
agent
si3n4
colorant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19392787A
Other languages
Japanese (ja)
Other versions
JP2590908B2 (en
Inventor
Hideki Okabe
Yasuhiro Kyotani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP62193927A priority Critical patent/JP2590908B2/en
Publication of JPS6438424A publication Critical patent/JPS6438424A/en
Application granted granted Critical
Publication of JP2590908B2 publication Critical patent/JP2590908B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To obtain the title material excellent in thermal conductivity and reliability of moisture resistance, by mixing an epoxy resin with Si3N4 and spherical silica and optionally a crosslinking agent, a cure accelerator, a curing agent, a colorant, a coupling agent, etc. CONSTITUTION:A curable epoxy resin (A) having at least two epoxy groups in the molecule is mixed with Si3N4 and spherical silica (B) of a mean particle diameter of 1-50mu, which are preferably surface-treated with an organopolysiloxane, and optionally a cure accelerator based on a phosphorus compound and/or a tert. amine, a curing agent, a crosslinking agent, a mold release, a colorant, a coupling agent, a filler other than component B, etc. (C), and the obtained mixture is kneaded, ground and optionally granulated.
JP62193927A 1987-08-03 1987-08-03 Epoxy resin molding material Expired - Lifetime JP2590908B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62193927A JP2590908B2 (en) 1987-08-03 1987-08-03 Epoxy resin molding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62193927A JP2590908B2 (en) 1987-08-03 1987-08-03 Epoxy resin molding material

Publications (2)

Publication Number Publication Date
JPS6438424A true JPS6438424A (en) 1989-02-08
JP2590908B2 JP2590908B2 (en) 1997-03-19

Family

ID=16316057

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62193927A Expired - Lifetime JP2590908B2 (en) 1987-08-03 1987-08-03 Epoxy resin molding material

Country Status (1)

Country Link
JP (1) JP2590908B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01182357A (en) * 1988-01-14 1989-07-20 Matsushita Electric Works Ltd Epoxy resin molding material
JPH01185320A (en) * 1988-01-18 1989-07-24 Matsushita Electric Works Ltd Epoxy resin molding material
JPH02281067A (en) * 1989-04-22 1990-11-16 Matsushita Electric Works Ltd Epoxy resin molding material
US5393805A (en) * 1990-06-23 1995-02-28 Hitachi, Ltd. Epoxy resin composition for insulating a coil, and a coil molded from the composition
US7494635B2 (en) 2003-08-21 2009-02-24 Saint-Gobain Ceramics & Plastics, Inc. Boron nitride agglomerated powder
US7662324B2 (en) 2001-04-30 2010-02-16 Saint-Gobain Ceramics & Plastics, Inc Polymer processing aid and method for processing polymers
USRE45803E1 (en) 2001-08-07 2015-11-17 Saint-Gobain Ceramics & Plastics, Inc. High solids HBN slurry, HBN paste, spherical HBN powder, and methods of making and using them
CN116178744A (en) * 2023-03-09 2023-05-30 广州豫顺新材料有限公司 Preparation process of functionalized silica toughening agent applied to epoxy resin

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56122145A (en) * 1980-02-29 1981-09-25 Shin Etsu Chem Co Ltd Resin composition for sealing semiconductor device
JPS5876456A (en) * 1981-11-02 1983-05-09 Matsushita Electric Works Ltd Thermosetting resin molding material
JPS61101522A (en) * 1984-10-25 1986-05-20 Toshiba Chem Corp Sealing resin composition
JPS6274924A (en) * 1985-09-30 1987-04-06 Toshiba Corp Epoxy resin composition for sealing semiconductor device
JPS62151447A (en) * 1985-12-26 1987-07-06 Hitachi Chem Co Ltd Epoxy resin composition for sealing semiconductor
JPS63179920A (en) * 1987-01-21 1988-07-23 Toshiba Corp Epoxy resin composition and resin-sealed type semiconductor device using said composition

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56122145A (en) * 1980-02-29 1981-09-25 Shin Etsu Chem Co Ltd Resin composition for sealing semiconductor device
JPS5876456A (en) * 1981-11-02 1983-05-09 Matsushita Electric Works Ltd Thermosetting resin molding material
JPS61101522A (en) * 1984-10-25 1986-05-20 Toshiba Chem Corp Sealing resin composition
JPS6274924A (en) * 1985-09-30 1987-04-06 Toshiba Corp Epoxy resin composition for sealing semiconductor device
JPS62151447A (en) * 1985-12-26 1987-07-06 Hitachi Chem Co Ltd Epoxy resin composition for sealing semiconductor
JPS63179920A (en) * 1987-01-21 1988-07-23 Toshiba Corp Epoxy resin composition and resin-sealed type semiconductor device using said composition

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01182357A (en) * 1988-01-14 1989-07-20 Matsushita Electric Works Ltd Epoxy resin molding material
JPH01185320A (en) * 1988-01-18 1989-07-24 Matsushita Electric Works Ltd Epoxy resin molding material
JPH02281067A (en) * 1989-04-22 1990-11-16 Matsushita Electric Works Ltd Epoxy resin molding material
US5393805A (en) * 1990-06-23 1995-02-28 Hitachi, Ltd. Epoxy resin composition for insulating a coil, and a coil molded from the composition
US7662324B2 (en) 2001-04-30 2010-02-16 Saint-Gobain Ceramics & Plastics, Inc Polymer processing aid and method for processing polymers
USRE45803E1 (en) 2001-08-07 2015-11-17 Saint-Gobain Ceramics & Plastics, Inc. High solids HBN slurry, HBN paste, spherical HBN powder, and methods of making and using them
USRE45923E1 (en) 2001-08-07 2016-03-15 Saint-Gobain Ceramics & Plastics, Inc. High solids HBN slurry, HBN paste, spherical HBN powder, and methods of making and using them
USRE47635E1 (en) 2001-08-07 2019-10-08 Saint-Gobain Ceramics & Plastics, Inc. High solids hBN slurry, hBN paste, spherical hBN powder, and methods of making and using them
US7494635B2 (en) 2003-08-21 2009-02-24 Saint-Gobain Ceramics & Plastics, Inc. Boron nitride agglomerated powder
CN116178744A (en) * 2023-03-09 2023-05-30 广州豫顺新材料有限公司 Preparation process of functionalized silica toughening agent applied to epoxy resin
CN116178744B (en) * 2023-03-09 2023-09-15 广州豫顺新材料有限公司 Preparation process of functionalized silica toughening agent applied to epoxy resin

Also Published As

Publication number Publication date
JP2590908B2 (en) 1997-03-19

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