JPS6438424A - Epoxy resin molding material - Google Patents
Epoxy resin molding materialInfo
- Publication number
- JPS6438424A JPS6438424A JP19392787A JP19392787A JPS6438424A JP S6438424 A JPS6438424 A JP S6438424A JP 19392787 A JP19392787 A JP 19392787A JP 19392787 A JP19392787 A JP 19392787A JP S6438424 A JPS6438424 A JP S6438424A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- optionally
- agent
- si3n4
- colorant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE:To obtain the title material excellent in thermal conductivity and reliability of moisture resistance, by mixing an epoxy resin with Si3N4 and spherical silica and optionally a crosslinking agent, a cure accelerator, a curing agent, a colorant, a coupling agent, etc. CONSTITUTION:A curable epoxy resin (A) having at least two epoxy groups in the molecule is mixed with Si3N4 and spherical silica (B) of a mean particle diameter of 1-50mu, which are preferably surface-treated with an organopolysiloxane, and optionally a cure accelerator based on a phosphorus compound and/or a tert. amine, a curing agent, a crosslinking agent, a mold release, a colorant, a coupling agent, a filler other than component B, etc. (C), and the obtained mixture is kneaded, ground and optionally granulated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62193927A JP2590908B2 (en) | 1987-08-03 | 1987-08-03 | Epoxy resin molding material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62193927A JP2590908B2 (en) | 1987-08-03 | 1987-08-03 | Epoxy resin molding material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6438424A true JPS6438424A (en) | 1989-02-08 |
JP2590908B2 JP2590908B2 (en) | 1997-03-19 |
Family
ID=16316057
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62193927A Expired - Lifetime JP2590908B2 (en) | 1987-08-03 | 1987-08-03 | Epoxy resin molding material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2590908B2 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01182357A (en) * | 1988-01-14 | 1989-07-20 | Matsushita Electric Works Ltd | Epoxy resin molding material |
JPH01185320A (en) * | 1988-01-18 | 1989-07-24 | Matsushita Electric Works Ltd | Epoxy resin molding material |
JPH02281067A (en) * | 1989-04-22 | 1990-11-16 | Matsushita Electric Works Ltd | Epoxy resin molding material |
US5393805A (en) * | 1990-06-23 | 1995-02-28 | Hitachi, Ltd. | Epoxy resin composition for insulating a coil, and a coil molded from the composition |
US7494635B2 (en) | 2003-08-21 | 2009-02-24 | Saint-Gobain Ceramics & Plastics, Inc. | Boron nitride agglomerated powder |
US7662324B2 (en) | 2001-04-30 | 2010-02-16 | Saint-Gobain Ceramics & Plastics, Inc | Polymer processing aid and method for processing polymers |
USRE45803E1 (en) | 2001-08-07 | 2015-11-17 | Saint-Gobain Ceramics & Plastics, Inc. | High solids HBN slurry, HBN paste, spherical HBN powder, and methods of making and using them |
CN116178744A (en) * | 2023-03-09 | 2023-05-30 | 广州豫顺新材料有限公司 | Preparation process of functionalized silica toughening agent applied to epoxy resin |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56122145A (en) * | 1980-02-29 | 1981-09-25 | Shin Etsu Chem Co Ltd | Resin composition for sealing semiconductor device |
JPS5876456A (en) * | 1981-11-02 | 1983-05-09 | Matsushita Electric Works Ltd | Thermosetting resin molding material |
JPS61101522A (en) * | 1984-10-25 | 1986-05-20 | Toshiba Chem Corp | Sealing resin composition |
JPS6274924A (en) * | 1985-09-30 | 1987-04-06 | Toshiba Corp | Epoxy resin composition for sealing semiconductor device |
JPS62151447A (en) * | 1985-12-26 | 1987-07-06 | Hitachi Chem Co Ltd | Epoxy resin composition for sealing semiconductor |
JPS63179920A (en) * | 1987-01-21 | 1988-07-23 | Toshiba Corp | Epoxy resin composition and resin-sealed type semiconductor device using said composition |
-
1987
- 1987-08-03 JP JP62193927A patent/JP2590908B2/en not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56122145A (en) * | 1980-02-29 | 1981-09-25 | Shin Etsu Chem Co Ltd | Resin composition for sealing semiconductor device |
JPS5876456A (en) * | 1981-11-02 | 1983-05-09 | Matsushita Electric Works Ltd | Thermosetting resin molding material |
JPS61101522A (en) * | 1984-10-25 | 1986-05-20 | Toshiba Chem Corp | Sealing resin composition |
JPS6274924A (en) * | 1985-09-30 | 1987-04-06 | Toshiba Corp | Epoxy resin composition for sealing semiconductor device |
JPS62151447A (en) * | 1985-12-26 | 1987-07-06 | Hitachi Chem Co Ltd | Epoxy resin composition for sealing semiconductor |
JPS63179920A (en) * | 1987-01-21 | 1988-07-23 | Toshiba Corp | Epoxy resin composition and resin-sealed type semiconductor device using said composition |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01182357A (en) * | 1988-01-14 | 1989-07-20 | Matsushita Electric Works Ltd | Epoxy resin molding material |
JPH01185320A (en) * | 1988-01-18 | 1989-07-24 | Matsushita Electric Works Ltd | Epoxy resin molding material |
JPH02281067A (en) * | 1989-04-22 | 1990-11-16 | Matsushita Electric Works Ltd | Epoxy resin molding material |
US5393805A (en) * | 1990-06-23 | 1995-02-28 | Hitachi, Ltd. | Epoxy resin composition for insulating a coil, and a coil molded from the composition |
US7662324B2 (en) | 2001-04-30 | 2010-02-16 | Saint-Gobain Ceramics & Plastics, Inc | Polymer processing aid and method for processing polymers |
USRE45803E1 (en) | 2001-08-07 | 2015-11-17 | Saint-Gobain Ceramics & Plastics, Inc. | High solids HBN slurry, HBN paste, spherical HBN powder, and methods of making and using them |
USRE45923E1 (en) | 2001-08-07 | 2016-03-15 | Saint-Gobain Ceramics & Plastics, Inc. | High solids HBN slurry, HBN paste, spherical HBN powder, and methods of making and using them |
USRE47635E1 (en) | 2001-08-07 | 2019-10-08 | Saint-Gobain Ceramics & Plastics, Inc. | High solids hBN slurry, hBN paste, spherical hBN powder, and methods of making and using them |
US7494635B2 (en) | 2003-08-21 | 2009-02-24 | Saint-Gobain Ceramics & Plastics, Inc. | Boron nitride agglomerated powder |
CN116178744A (en) * | 2023-03-09 | 2023-05-30 | 广州豫顺新材料有限公司 | Preparation process of functionalized silica toughening agent applied to epoxy resin |
CN116178744B (en) * | 2023-03-09 | 2023-09-15 | 广州豫顺新材料有限公司 | Preparation process of functionalized silica toughening agent applied to epoxy resin |
Also Published As
Publication number | Publication date |
---|---|
JP2590908B2 (en) | 1997-03-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071219 Year of fee payment: 11 |