JPS6429416A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS6429416A
JPS6429416A JP18499387A JP18499387A JPS6429416A JP S6429416 A JPS6429416 A JP S6429416A JP 18499387 A JP18499387 A JP 18499387A JP 18499387 A JP18499387 A JP 18499387A JP S6429416 A JPS6429416 A JP S6429416A
Authority
JP
Japan
Prior art keywords
epoxy resin
thixotropic
sealant
filler
dispersion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18499387A
Other languages
Japanese (ja)
Other versions
JP2515344B2 (en
Inventor
Hirohisa Hino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP62184993A priority Critical patent/JP2515344B2/en
Publication of JPS6429416A publication Critical patent/JPS6429416A/en
Application granted granted Critical
Publication of JP2515344B2 publication Critical patent/JP2515344B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain the title compsn. which is highly thixotropic and excellent in shape retention and is useful for IC sealant for chip-on-board, by mixing an epoxy resin with a specified curing agent, a cure accelerator, a filler and an fine silica powder which has been made hydrophobic as a thixotropic agent by dispersion. CONSTITUTION:One-pack epoxy resin compsn. contg. a hydrazinotriazine curing agent, an imidazole cure accelerator and a filler is mixed with a fine silica powder (SiO2 whose affinity for water has been decreased by methylating its surface) as a thixotropic agent by dispersion to give an epoxy resin compsn. which is highly thixotropic, excellent in shape retention and yet free from an extremely increased viscosity and a worsened defoaming property and is useful for IC sealant for chip-on-board.
JP62184993A 1987-07-24 1987-07-24 One-part liquid epoxy resin composition for sealing Expired - Lifetime JP2515344B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62184993A JP2515344B2 (en) 1987-07-24 1987-07-24 One-part liquid epoxy resin composition for sealing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62184993A JP2515344B2 (en) 1987-07-24 1987-07-24 One-part liquid epoxy resin composition for sealing

Publications (2)

Publication Number Publication Date
JPS6429416A true JPS6429416A (en) 1989-01-31
JP2515344B2 JP2515344B2 (en) 1996-07-10

Family

ID=16162910

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62184993A Expired - Lifetime JP2515344B2 (en) 1987-07-24 1987-07-24 One-part liquid epoxy resin composition for sealing

Country Status (1)

Country Link
JP (1) JP2515344B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0724289A3 (en) * 1995-01-30 1996-12-04 Matsushita Electric Ind Co Ltd Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging
WO1996042106A1 (en) * 1995-06-12 1996-12-27 Matsushita Electric Industrial Co., Ltd. Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging
WO1999036484A1 (en) * 1998-01-16 1999-07-22 Loctite (R & D) Limited Curable epoxy-based compositions
US6653371B1 (en) 1998-01-16 2003-11-25 Barry E. Burns One-part curable composition of polyepoxide, polythiol, latent hardener and solid organic acid
US6872762B2 (en) 2000-07-13 2005-03-29 Loctite (R&D) Limited Epoxy resin composition with solid organic acid
JP2008207403A (en) * 2007-02-23 2008-09-11 Matsushita Electric Works Ltd Manufacturing method of thermosetting resin molding
CN103275664A (en) * 2013-06-17 2013-09-04 漳州丽都化工有限公司 Quartz clock outer frame coating glue as well as preparation and use method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60127702A (en) * 1983-11-17 1985-07-08 チバ‐ガイギー　アクチエンゲゼルシヤフト Method of using 1-component epoxy resin coating material forhardening fixed resistor
JPS6123666A (en) * 1984-07-13 1986-02-01 Hitachi Ltd Plating-resistant solder resist ink composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60127702A (en) * 1983-11-17 1985-07-08 チバ‐ガイギー　アクチエンゲゼルシヤフト Method of using 1-component epoxy resin coating material forhardening fixed resistor
JPS6123666A (en) * 1984-07-13 1986-02-01 Hitachi Ltd Plating-resistant solder resist ink composition

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0724289A3 (en) * 1995-01-30 1996-12-04 Matsushita Electric Ind Co Ltd Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging
EP0878839A1 (en) * 1995-01-30 1998-11-18 Matsushita Electric Industrial Co., Ltd. Semiconductor unit package and semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging
EP1154470A3 (en) * 1995-01-30 2001-12-19 Matsushita Electric Industrial Co., Ltd. Semiconductor unit packaging method
WO1996042106A1 (en) * 1995-06-12 1996-12-27 Matsushita Electric Industrial Co., Ltd. Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging
WO1999036484A1 (en) * 1998-01-16 1999-07-22 Loctite (R & D) Limited Curable epoxy-based compositions
US6653371B1 (en) 1998-01-16 2003-11-25 Barry E. Burns One-part curable composition of polyepoxide, polythiol, latent hardener and solid organic acid
US6872762B2 (en) 2000-07-13 2005-03-29 Loctite (R&D) Limited Epoxy resin composition with solid organic acid
JP2008207403A (en) * 2007-02-23 2008-09-11 Matsushita Electric Works Ltd Manufacturing method of thermosetting resin molding
CN103275664A (en) * 2013-06-17 2013-09-04 漳州丽都化工有限公司 Quartz clock outer frame coating glue as well as preparation and use method thereof

Also Published As

Publication number Publication date
JP2515344B2 (en) 1996-07-10

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