JPS55153357A - Manufacturing method of resin sealed semiconductor device - Google Patents

Manufacturing method of resin sealed semiconductor device

Info

Publication number
JPS55153357A
JPS55153357A JP6037879A JP6037879A JPS55153357A JP S55153357 A JPS55153357 A JP S55153357A JP 6037879 A JP6037879 A JP 6037879A JP 6037879 A JP6037879 A JP 6037879A JP S55153357 A JPS55153357 A JP S55153357A
Authority
JP
Japan
Prior art keywords
epoxy resin
coupling agent
semiconductor device
hardener
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6037879A
Other languages
Japanese (ja)
Inventor
Masahiro Kitamura
Hiroshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP6037879A priority Critical patent/JPS55153357A/en
Publication of JPS55153357A publication Critical patent/JPS55153357A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To improve a dampproof property when making a resin sealed semiconductor device by moulding and hardening an epoxy resin component substance by specifying an epoxy resin, a hardener and a hardening accelerator to be composed of. CONSTITUTION:When moulding a semiconductor device using an epoxy resin composed substance, a cresol novolak type epoxy resin with an oxirane ring of more than two in a molecule is used. Also as a hardener to be mixed with the above, phthalic anhydride and novolak resin or the like are used, and as a hardener, silane coupling agent is used. At this time, as for the coupling agent among these mixing agents, within the limits of 0.01-5 parts of silane coupling agent having melcaptan radical is mixed with coupling agent against 100 parts of epoxy resin. The moisture absorption factor exceeds 1% ordinarily, but it will be decreased to below 1% with the method above-mentioned, thereby producing a high dampproof property.
JP6037879A 1979-05-18 1979-05-18 Manufacturing method of resin sealed semiconductor device Pending JPS55153357A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6037879A JPS55153357A (en) 1979-05-18 1979-05-18 Manufacturing method of resin sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6037879A JPS55153357A (en) 1979-05-18 1979-05-18 Manufacturing method of resin sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS55153357A true JPS55153357A (en) 1980-11-29

Family

ID=13140408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6037879A Pending JPS55153357A (en) 1979-05-18 1979-05-18 Manufacturing method of resin sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS55153357A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5875858A (en) * 1981-10-30 1983-05-07 Nitto Electric Ind Co Ltd Manufacture of resin-sealed semiconductor device
JPS59197421A (en) * 1983-04-26 1984-11-09 Shin Etsu Chem Co Ltd Curable epoxy resin composition

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5431500A (en) * 1977-08-13 1979-03-08 Allied Chem Packing composition based on anhydride curable epoxy resin

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5431500A (en) * 1977-08-13 1979-03-08 Allied Chem Packing composition based on anhydride curable epoxy resin

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5875858A (en) * 1981-10-30 1983-05-07 Nitto Electric Ind Co Ltd Manufacture of resin-sealed semiconductor device
JPS59197421A (en) * 1983-04-26 1984-11-09 Shin Etsu Chem Co Ltd Curable epoxy resin composition
JPS6248968B2 (en) * 1983-04-26 1987-10-16 Shinetsu Chem Ind Co

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