JPS6465116A - Resin composition for semiconductor sealing - Google Patents

Resin composition for semiconductor sealing

Info

Publication number
JPS6465116A
JPS6465116A JP22252487A JP22252487A JPS6465116A JP S6465116 A JPS6465116 A JP S6465116A JP 22252487 A JP22252487 A JP 22252487A JP 22252487 A JP22252487 A JP 22252487A JP S6465116 A JPS6465116 A JP S6465116A
Authority
JP
Japan
Prior art keywords
semiconductor sealing
resin composition
resin
diazabicyclo
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22252487A
Other languages
Japanese (ja)
Other versions
JPH0753791B2 (en
Inventor
Akio Oura
Hisashi Kondo
Tadahide Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP62222524A priority Critical patent/JPH0753791B2/en
Publication of JPS6465116A publication Critical patent/JPS6465116A/en
Publication of JPH0753791B2 publication Critical patent/JPH0753791B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To provide a resin composition for semiconductor sealing, excellent in soldering-heat resistance and low in an amount of a halogen generated, by mixing an epoxy resin of a specified composition with a phenol novolac resin as a curing agent and a specified cure accelerator. CONSTITUTION:A resin composition for semiconductor sealing is obtained by mixing an epoxy resin (A) comprising an epoxy resin having a skeleton of the formula (wherein R<1>-R<8> are each H, a 1-4C lower alkyl or a halogen) with a curing agent (B) based on a phenol novolac resin, and a cure accelerator (C) based on a mixture of a diazabicyclo compound and an organic tertiary phosphine compound. An example of said diazabicyclo compound is 1,8- diazabicyclo(5,4,0)undecene-7, and an example of said organic tertiary phosphine compound is triphenylphosphine.
JP62222524A 1987-09-04 1987-09-04 Resin composition for semiconductor encapsulation Expired - Fee Related JPH0753791B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62222524A JPH0753791B2 (en) 1987-09-04 1987-09-04 Resin composition for semiconductor encapsulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62222524A JPH0753791B2 (en) 1987-09-04 1987-09-04 Resin composition for semiconductor encapsulation

Publications (2)

Publication Number Publication Date
JPS6465116A true JPS6465116A (en) 1989-03-10
JPH0753791B2 JPH0753791B2 (en) 1995-06-07

Family

ID=16783780

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62222524A Expired - Fee Related JPH0753791B2 (en) 1987-09-04 1987-09-04 Resin composition for semiconductor encapsulation

Country Status (1)

Country Link
JP (1) JPH0753791B2 (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0291966A (en) * 1988-09-29 1990-03-30 Nitto Denko Corp Semiconductor device
JPH02258829A (en) * 1989-03-30 1990-10-19 Toray Ind Inc Epoxy resin composition
EP0403022A2 (en) * 1989-06-13 1990-12-19 Shell Internationale Researchmaatschappij B.V. Encapsulating epoxy resin composition
JPH03719A (en) * 1989-05-29 1991-01-07 Sumitomo Bakelite Co Ltd Resin composition
JPH039919A (en) * 1989-06-08 1991-01-17 Shin Etsu Chem Co Ltd Epoxy resin composition and semiconductor device
JPH0347827A (en) * 1989-04-22 1991-02-28 Matsushita Electric Works Ltd Epoxy resin composition
JPH03119051A (en) * 1989-10-02 1991-05-21 Toray Ind Inc Epoxy resin composition
JPH03278450A (en) * 1990-03-27 1991-12-10 Matsushita Electric Works Ltd Resin-sealed semiconductor device
JPH0450257A (en) * 1990-06-18 1992-02-19 Toray Ind Inc Epoxy resin composition for sealing semiconductor
US6207789B1 (en) 1997-06-03 2001-03-27 Hitachi Chemical Co., Ltd. Phenolic resin, resin composition, molding material for encapsulation, and electronic component device
US6495270B1 (en) 1998-02-19 2002-12-17 Hitachi Chemical Company, Ltd. Compounds, hardening accelerator, resin composition, and electronic part device
US7612458B2 (en) 2005-01-13 2009-11-03 Sumitomo Bakelite Company Limited Epoxy resin composition for semiconductor encapsulating use, and semiconductor device
KR20180136494A (en) 2016-04-28 2018-12-24 히타치가세이가부시끼가이샤 Epoxy resin composition and electronic component device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6147725A (en) * 1984-08-16 1986-03-08 Yuka Shell Epoxy Kk Epoxy resin composition for sealing semiconductor
JPS6181426A (en) * 1984-09-28 1986-04-25 Toshiba Corp Epoxy resin composition for encapsulatingj semiconductor
JPS61254619A (en) * 1985-05-07 1986-11-12 Shin Etsu Chem Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS61259552A (en) * 1985-05-14 1986-11-17 Nitto Electric Ind Co Ltd Semiconductor sealing device
JPS6281416A (en) * 1985-10-04 1987-04-14 Denki Kagaku Kogyo Kk Epoxy resin composition for sealing semiconductor
JPS62115849A (en) * 1985-11-15 1987-05-27 Nitto Electric Ind Co Ltd Resin-sealed semiconductor device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6147725A (en) * 1984-08-16 1986-03-08 Yuka Shell Epoxy Kk Epoxy resin composition for sealing semiconductor
JPS6181426A (en) * 1984-09-28 1986-04-25 Toshiba Corp Epoxy resin composition for encapsulatingj semiconductor
JPS61254619A (en) * 1985-05-07 1986-11-12 Shin Etsu Chem Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS61259552A (en) * 1985-05-14 1986-11-17 Nitto Electric Ind Co Ltd Semiconductor sealing device
JPS6281416A (en) * 1985-10-04 1987-04-14 Denki Kagaku Kogyo Kk Epoxy resin composition for sealing semiconductor
JPS62115849A (en) * 1985-11-15 1987-05-27 Nitto Electric Ind Co Ltd Resin-sealed semiconductor device

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0291966A (en) * 1988-09-29 1990-03-30 Nitto Denko Corp Semiconductor device
JPH02258829A (en) * 1989-03-30 1990-10-19 Toray Ind Inc Epoxy resin composition
JPH0347827A (en) * 1989-04-22 1991-02-28 Matsushita Electric Works Ltd Epoxy resin composition
JPH03719A (en) * 1989-05-29 1991-01-07 Sumitomo Bakelite Co Ltd Resin composition
JPH039919A (en) * 1989-06-08 1991-01-17 Shin Etsu Chem Co Ltd Epoxy resin composition and semiconductor device
EP0403022A3 (en) * 1989-06-13 1992-01-22 Shell Internationale Researchmaatschappij B.V. Encapsulating epoxy resin composition
EP0403022A2 (en) * 1989-06-13 1990-12-19 Shell Internationale Researchmaatschappij B.V. Encapsulating epoxy resin composition
JPH03119051A (en) * 1989-10-02 1991-05-21 Toray Ind Inc Epoxy resin composition
JPH03278450A (en) * 1990-03-27 1991-12-10 Matsushita Electric Works Ltd Resin-sealed semiconductor device
JPH0450257A (en) * 1990-06-18 1992-02-19 Toray Ind Inc Epoxy resin composition for sealing semiconductor
US6207789B1 (en) 1997-06-03 2001-03-27 Hitachi Chemical Co., Ltd. Phenolic resin, resin composition, molding material for encapsulation, and electronic component device
US6495270B1 (en) 1998-02-19 2002-12-17 Hitachi Chemical Company, Ltd. Compounds, hardening accelerator, resin composition, and electronic part device
US7612458B2 (en) 2005-01-13 2009-11-03 Sumitomo Bakelite Company Limited Epoxy resin composition for semiconductor encapsulating use, and semiconductor device
KR20180136494A (en) 2016-04-28 2018-12-24 히타치가세이가부시끼가이샤 Epoxy resin composition and electronic component device

Also Published As

Publication number Publication date
JPH0753791B2 (en) 1995-06-07

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