JPS5740963A - Resin-sealed semiconductor device - Google Patents

Resin-sealed semiconductor device

Info

Publication number
JPS5740963A
JPS5740963A JP55115941A JP11594180A JPS5740963A JP S5740963 A JPS5740963 A JP S5740963A JP 55115941 A JP55115941 A JP 55115941A JP 11594180 A JP11594180 A JP 11594180A JP S5740963 A JPS5740963 A JP S5740963A
Authority
JP
Japan
Prior art keywords
hardener
novolak type
resin
epoxy resin
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55115941A
Other languages
Japanese (ja)
Other versions
JPS583382B2 (en
Inventor
Hirotoshi Iketani
Akiko Hatanaka
Shiyuichi Suzuki
Moriyasu Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55115941A priority Critical patent/JPS583382B2/en
Publication of JPS5740963A publication Critical patent/JPS5740963A/en
Publication of JPS583382B2 publication Critical patent/JPS583382B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE:To improve humidity resistance, by sealing with a hardener composed of novolak type epoxy resin and mixture of novolak type phenol resin and anhydrous oxide, and a hardening accelerator composed of organic phosphine composite. CONSTITUTION:A hardener of epoxy resin composition includes the following: (a) novolak type epoxy resin of epoxy equivalent of 170-300, (b) mixture of novolak type phenol resin and anhydrous oxide as a hardener, (c) Bis-organic tertiary phosphine as a hardening accelerator (for example, triphenylphosphine), and if necessary (d) one of inorganic fillers with a main ingredient of quartz glass or crystalline silica. Said anhydrous oxide accountes for 0.1-35wt% of a hardener in weight. Its ratio between phenol hydroxide radicals of phenol resin and epoxy radicals of epoxy resin falls between 0.5-1.5. A semiconductor device is sealed therewith.
JP55115941A 1980-08-25 1980-08-25 Resin-encapsulated semiconductor device Expired JPS583382B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55115941A JPS583382B2 (en) 1980-08-25 1980-08-25 Resin-encapsulated semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55115941A JPS583382B2 (en) 1980-08-25 1980-08-25 Resin-encapsulated semiconductor device

Publications (2)

Publication Number Publication Date
JPS5740963A true JPS5740963A (en) 1982-03-06
JPS583382B2 JPS583382B2 (en) 1983-01-21

Family

ID=14674962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55115941A Expired JPS583382B2 (en) 1980-08-25 1980-08-25 Resin-encapsulated semiconductor device

Country Status (1)

Country Link
JP (1) JPS583382B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5943017A (en) * 1982-09-03 1984-03-09 Toshiba Corp Epoxy resin composition and resin-sealed semiconductor device
JPS61120943A (en) * 1984-11-19 1986-06-09 Seiko Instr & Electronics Ltd Heat stress distortion measuring apparatus
JPS63139232A (en) * 1986-12-01 1988-06-11 Seiko Instr & Electronics Ltd Apparatus for measuring dynamic viscoelasticity
JPH05187992A (en) * 1992-07-23 1993-07-27 Seiko Instr Inc Device for measuring dynamic viscoelasticity
EP0921388A2 (en) 1997-11-25 1999-06-09 Seiko Instruments Inc. Viscoelasticity measurement apparatus
US7247683B2 (en) * 2004-08-05 2007-07-24 Fry's Metals, Inc. Low voiding no flow fluxing underfill for electronic devices

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6142386U (en) * 1984-08-23 1986-03-18 三菱自動車工業株式会社 Rear floor joint structure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56130953A (en) * 1980-03-17 1981-10-14 Shin Etsu Chem Co Ltd Epoxy resin composition for sealing semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56130953A (en) * 1980-03-17 1981-10-14 Shin Etsu Chem Co Ltd Epoxy resin composition for sealing semiconductor device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5943017A (en) * 1982-09-03 1984-03-09 Toshiba Corp Epoxy resin composition and resin-sealed semiconductor device
JPS61120943A (en) * 1984-11-19 1986-06-09 Seiko Instr & Electronics Ltd Heat stress distortion measuring apparatus
JPS63139232A (en) * 1986-12-01 1988-06-11 Seiko Instr & Electronics Ltd Apparatus for measuring dynamic viscoelasticity
JPH0357420B2 (en) * 1986-12-01 1991-09-02 Seiko Instr & Electronics
JPH05187992A (en) * 1992-07-23 1993-07-27 Seiko Instr Inc Device for measuring dynamic viscoelasticity
EP0921388A2 (en) 1997-11-25 1999-06-09 Seiko Instruments Inc. Viscoelasticity measurement apparatus
US7247683B2 (en) * 2004-08-05 2007-07-24 Fry's Metals, Inc. Low voiding no flow fluxing underfill for electronic devices

Also Published As

Publication number Publication date
JPS583382B2 (en) 1983-01-21

Similar Documents

Publication Publication Date Title
JPS56136816A (en) Epoxy resin composition
JPS56130953A (en) Epoxy resin composition for sealing semiconductor device
KR910016067A (en) Encapsulant of Semiconductor Device
JPS5252958A (en) Glass-fiber reinforced polyphenylene sulfide resin compositions
KR870002198A (en) Epoxy Resin Compositions for Sealing Semiconductor Devices
JPS5740963A (en) Resin-sealed semiconductor device
MY107113A (en) Epoxy resin composition for semiconductor sealing.
JPS572329A (en) Epoxy resin type composition and semiconductor device of resin sealing type
JPS6465116A (en) Resin composition for semiconductor sealing
KR880002935A (en) Sound insulation
JPS5723625A (en) Epoxy resin composition and resin-sealed semiconductor device
JPS649214A (en) Epoxy resin composition for sealing semiconductor
JPS5740962A (en) Resin-sealed semiconductor device
JPS5426000A (en) Epoxy resin composition
JPS56122145A (en) Resin composition for sealing semiconductor device
JPS52135673A (en) Resin composition for semiconductor sealing
JPS5356294A (en) Thermosetting resin composition
JPS555929A (en) Semiconductor sealing epoxy resin composition
JPS56160056A (en) Resin sealing type semiconductor device
JPS578220A (en) Epoxy resin composition and resin-sealed semiconductor device
ES8605834A1 (en) Epoxy-resin/polysulfone molding compounds for cured products with excellent humidity and cracking resistance.
KR880002928A (en) Liquid epoxy resin composition
JPS5216553A (en) Reinforced olefin resin composition
JPS56120538A (en) Composite material for airtight seal bonding
JPS57115853A (en) Resin-sealed semiconductor device