JPS56160056A - Resin sealing type semiconductor device - Google Patents

Resin sealing type semiconductor device

Info

Publication number
JPS56160056A
JPS56160056A JP6335280A JP6335280A JPS56160056A JP S56160056 A JPS56160056 A JP S56160056A JP 6335280 A JP6335280 A JP 6335280A JP 6335280 A JP6335280 A JP 6335280A JP S56160056 A JPS56160056 A JP S56160056A
Authority
JP
Japan
Prior art keywords
type
resin
aluminum
epoxy
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6335280A
Other languages
Japanese (ja)
Inventor
Hirotoshi Iketani
Shiyuichi Suzuki
Naoyuki Kokuni
Akira Yoshizumi
Kazutaka Matsumoto
Akiko Hatanaka
Michiya Azuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP6335280A priority Critical patent/JPS56160056A/en
Publication of JPS56160056A publication Critical patent/JPS56160056A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To improve the moisture-proof and corrosion resisting properties for the subject semiconductor device by a method wherein novolac type phenol resin and a tertiary aluminum type or imidazol type hardener are added to epoxy resin as sealing matrials and in addition, the beta-diketone complex material of aluminum and inorganic filler are mixed. CONSTITUTION:As epoxy resin, when bisphenol A-type or F-type resin, for example, of epoxy equivalent weight of 500 or below, softening point of 60-90 deg.C are used at 10-35wt%, an excellent effect is obtained for thermal expansion. When phenol novolac is used as a hardener, the desirable range of equivalent weight ratio with epoxy radical and the hydroxyl radical of the phenol resin is 0.5-1.5, and as a hardening accelerator, 0.5-1.6wt% of tertiary aluminum type or imidazoil type and beta-diketone complex material of aluminum are used jointly. As an inorganic filler, an excellent rsult is obtained when 150-400wt. per resin component 100pts.wt. of crystalline silica powder, quartz glass powder and the like are used.
JP6335280A 1980-05-15 1980-05-15 Resin sealing type semiconductor device Pending JPS56160056A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6335280A JPS56160056A (en) 1980-05-15 1980-05-15 Resin sealing type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6335280A JPS56160056A (en) 1980-05-15 1980-05-15 Resin sealing type semiconductor device

Publications (1)

Publication Number Publication Date
JPS56160056A true JPS56160056A (en) 1981-12-09

Family

ID=13226764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6335280A Pending JPS56160056A (en) 1980-05-15 1980-05-15 Resin sealing type semiconductor device

Country Status (1)

Country Link
JP (1) JPS56160056A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6259626A (en) * 1985-09-10 1987-03-16 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS63130621A (en) * 1986-11-21 1988-06-02 Toshiba Corp Epoxy resin composition for sealing semiconductor device
JPH11228787A (en) * 1998-02-16 1999-08-24 Hitachi Chem Co Ltd Resin paste composition semiconductor device using the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6259626A (en) * 1985-09-10 1987-03-16 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS6325012B2 (en) * 1985-09-10 1988-05-24 Shinetsu Chem Ind Co
JPS63130621A (en) * 1986-11-21 1988-06-02 Toshiba Corp Epoxy resin composition for sealing semiconductor device
JPH11228787A (en) * 1998-02-16 1999-08-24 Hitachi Chem Co Ltd Resin paste composition semiconductor device using the same

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