GB1532592A - Composition for encapsulating semiconductors - Google Patents
Composition for encapsulating semiconductorsInfo
- Publication number
- GB1532592A GB1532592A GB97577A GB97577A GB1532592A GB 1532592 A GB1532592 A GB 1532592A GB 97577 A GB97577 A GB 97577A GB 97577 A GB97577 A GB 97577A GB 1532592 A GB1532592 A GB 1532592A
- Authority
- GB
- United Kingdom
- Prior art keywords
- parts
- halogenated
- bisphenol
- epoxy resin
- epoxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000203 mixture Substances 0.000 title abstract 7
- 239000004065 semiconductor Substances 0.000 title abstract 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 4
- 239000003822 epoxy resin Substances 0.000 abstract 3
- 229920000647 polyepoxide Polymers 0.000 abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 abstract 2
- -1 epoxide compound Chemical class 0.000 abstract 2
- 229920003986 novolac Polymers 0.000 abstract 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract 1
- 239000002841 Lewis acid Substances 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 125000003277 amino group Chemical group 0.000 abstract 1
- 239000003054 catalyst Substances 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 abstract 1
- 150000002118 epoxides Chemical class 0.000 abstract 1
- 239000011152 fibreglass Substances 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 239000003063 flame retardant Substances 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 150000007517 lewis acids Chemical class 0.000 abstract 1
- 150000002894 organic compounds Chemical class 0.000 abstract 1
- 239000004848 polyfunctional curative Substances 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 150000003512 tertiary amines Chemical class 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
1532592 Epoxy resin compositions ALLIED CHEMICAL CORP 11 Jan 1977 [12 Jan 1976] 00975/77 Heading C3B [Also in Division H1] Epoxy resin compositions, suitable for the encapsulation of semi-conductor devices, comprise (I) an epoxide compound containing at least two 1,2-epoxide groups; (II) a novolac hardener; (III) a catalyst; (IV) a filler; and as a flame retardant a mixture comprising (V) a reactive halogenated organic compound containing hydroxyl and/or epoxide and/or amine groups which is present so as to provide 0À5-15 parts by weight of halogen per 100 parts of the combined weight of I, II and V and (VI) Sb 2 O 3 present at 1-20 parts by weight per 100 parts of the combined weight of I, II and V. I may be a diglycidyl ether of bisphenol A. V may be a halogenated epoxy resin, e.g. a brominated diglycidyl ether of bisphenol A, halogenated bisphenol A or an aliphatic halogenated glycol. II may be a phenol- or an O-cresol-formaldehyde novolac and may be present at 5-20% by wt. of the total composition. III may be a Lewis acid or a tertiary amine. IV may comprise 50-85% by wt. of the total composition and may be tabular alumina, silica, fibre glass or mixtures thereof.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US64842476A | 1976-01-12 | 1976-01-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1532592A true GB1532592A (en) | 1978-11-15 |
Family
ID=24600721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB97577A Expired GB1532592A (en) | 1976-01-12 | 1977-01-11 | Composition for encapsulating semiconductors |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS5286069A (en) |
| DE (1) | DE2700363A1 (en) |
| FR (1) | FR2337752A1 (en) |
| GB (1) | GB1532592A (en) |
| IT (1) | IT1082701B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2210377A (en) * | 1987-09-25 | 1989-06-07 | Plessey Co Plc | Microencapsulated flame retardant: encapsulated semiconductor |
| WO2003041464A2 (en) * | 2001-11-07 | 2003-05-15 | Bourns, Inc. | Improved epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components |
| US8564391B2 (en) | 2006-03-21 | 2013-10-22 | Vacuumschmelze Gmbh & Co. Kg | Paint composition, in particular anti-corrosive paint for rare earth permanent magnets |
| CN103917570A (en) * | 2011-11-08 | 2014-07-09 | 陶氏环球技术有限责任公司 | Curable compositions |
| US20150087749A1 (en) * | 2012-06-15 | 2015-03-26 | Dow Global Technologies Llc | Curable compositions |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2732733A1 (en) * | 1977-07-20 | 1979-02-08 | Allied Chem | Anhydride-hardened epoxy resin-based encapsulating compsns. - contg. filler, wax lubricant and silane coupling agent to improve high temp. wet electrical properties |
| US4282136A (en) * | 1979-04-09 | 1981-08-04 | Hunt Earl R | Flame retardant epoxy molding compound method and encapsulated device |
| DE3027140A1 (en) * | 1979-07-20 | 1981-02-19 | Ciba Geigy Ag | CURABLE EPOXY RESIN MIXTURES AND THEIR USE |
| JPS5667948A (en) * | 1979-11-07 | 1981-06-08 | Toshiba Corp | Resin for sealing semiconductor element |
| JPS6178823A (en) * | 1984-09-27 | 1986-04-22 | Toshiba Corp | Epoxy resin composition |
| CA1288189C (en) * | 1986-01-20 | 1991-08-27 | Glenda C. Young | Epoxy resin composition |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE631287A (en) * | 1962-04-20 | 1900-01-01 | ||
| US3813379A (en) * | 1970-12-14 | 1974-05-28 | Motorola Inc | Thermally stabilized thermosetting plastic material,and article |
| JPS512385A (en) * | 1974-06-24 | 1976-01-09 | Hitachi Ltd | HANDOTAISOCHIFUSHOJUSHISOSEIBUTSU |
-
1977
- 1977-01-05 IT IT6701277A patent/IT1082701B/en active
- 1977-01-07 DE DE19772700363 patent/DE2700363A1/en not_active Withdrawn
- 1977-01-07 FR FR7700421A patent/FR2337752A1/en active Pending
- 1977-01-11 JP JP124477A patent/JPS5286069A/en active Pending
- 1977-01-11 GB GB97577A patent/GB1532592A/en not_active Expired
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2210377A (en) * | 1987-09-25 | 1989-06-07 | Plessey Co Plc | Microencapsulated flame retardant: encapsulated semiconductor |
| WO2003041464A2 (en) * | 2001-11-07 | 2003-05-15 | Bourns, Inc. | Improved epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components |
| WO2003041464A3 (en) * | 2001-11-07 | 2004-02-26 | Bourns Inc | Improved epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components |
| US8564391B2 (en) | 2006-03-21 | 2013-10-22 | Vacuumschmelze Gmbh & Co. Kg | Paint composition, in particular anti-corrosive paint for rare earth permanent magnets |
| CN103917570A (en) * | 2011-11-08 | 2014-07-09 | 陶氏环球技术有限责任公司 | Curable compositions |
| US20140256909A1 (en) * | 2011-11-08 | 2014-09-11 | Dow Global Technologies Llc | Curable compositions |
| US20150087749A1 (en) * | 2012-06-15 | 2015-03-26 | Dow Global Technologies Llc | Curable compositions |
| US9371417B2 (en) * | 2012-06-15 | 2016-06-21 | Blue Cube Ip Llc | Curable compositions |
Also Published As
| Publication number | Publication date |
|---|---|
| IT1082701B (en) | 1985-05-21 |
| FR2337752A1 (en) | 1977-08-05 |
| JPS5286069A (en) | 1977-07-16 |
| DE2700363A1 (en) | 1977-07-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| 732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
| PCNP | Patent ceased through non-payment of renewal fee |