JPS5286069A - Semiconductor enclosing material made of fire resistant novolak epoxy base - Google Patents

Semiconductor enclosing material made of fire resistant novolak epoxy base

Info

Publication number
JPS5286069A
JPS5286069A JP124477A JP124477A JPS5286069A JP S5286069 A JPS5286069 A JP S5286069A JP 124477 A JP124477 A JP 124477A JP 124477 A JP124477 A JP 124477A JP S5286069 A JPS5286069 A JP S5286069A
Authority
JP
Japan
Prior art keywords
material made
fire resistant
novolak epoxy
epoxy base
enclosing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP124477A
Other languages
Japanese (ja)
Inventor
Kei Rosuraa Robaato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Allied Corp
Original Assignee
Allied Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Allied Chemical Corp filed Critical Allied Chemical Corp
Publication of JPS5286069A publication Critical patent/JPS5286069A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
JP124477A 1976-01-12 1977-01-11 Semiconductor enclosing material made of fire resistant novolak epoxy base Pending JPS5286069A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US64842476A 1976-01-12 1976-01-12

Publications (1)

Publication Number Publication Date
JPS5286069A true JPS5286069A (en) 1977-07-16

Family

ID=24600721

Family Applications (1)

Application Number Title Priority Date Filing Date
JP124477A Pending JPS5286069A (en) 1976-01-12 1977-01-11 Semiconductor enclosing material made of fire resistant novolak epoxy base

Country Status (5)

Country Link
JP (1) JPS5286069A (en)
DE (1) DE2700363A1 (en)
FR (1) FR2337752A1 (en)
GB (1) GB1532592A (en)
IT (1) IT1082701B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6178823A (en) * 1984-09-27 1986-04-22 Toshiba Corp Epoxy resin composition

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2732733A1 (en) * 1977-07-20 1979-02-08 Allied Chem Anhydride-hardened epoxy resin-based encapsulating compsns. - contg. filler, wax lubricant and silane coupling agent to improve high temp. wet electrical properties
US4282136A (en) * 1979-04-09 1981-08-04 Hunt Earl R Flame retardant epoxy molding compound method and encapsulated device
GB2055843A (en) * 1979-07-20 1981-03-11 Ciba Geigy Ag Curable epoxide resin mixtures and their use in corrosion resistant coatings
JPS5667948A (en) * 1979-11-07 1981-06-08 Toshiba Corp Resin for sealing semiconductor element
CA1288189C (en) * 1986-01-20 1991-08-27 Glenda C. Young Epoxy resin composition
GB2210377A (en) * 1987-09-25 1989-06-07 Plessey Co Plc Microencapsulated flame retardant: encapsulated semiconductor
US6548576B1 (en) * 2001-11-07 2003-04-15 Bourns, Inc. Epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components
DE102006012839B4 (en) * 2006-03-21 2008-05-29 Vacuumschmelze Gmbh & Co. Kg Lacquer composition and its use
WO2013070393A1 (en) * 2011-11-08 2013-05-16 Dow Global Technologies Llc Curable compositions
CN104364289A (en) * 2012-06-15 2015-02-18 陶氏环球技术有限责任公司 Transmission for a motor vehicle

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS512385A (en) * 1974-06-24 1976-01-09 Hitachi Ltd HANDOTAISOCHIFUSHOJUSHISOSEIBUTSU

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE631287A (en) * 1962-04-20 1900-01-01
US3813379A (en) * 1970-12-14 1974-05-28 Motorola Inc Thermally stabilized thermosetting plastic material,and article

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS512385A (en) * 1974-06-24 1976-01-09 Hitachi Ltd HANDOTAISOCHIFUSHOJUSHISOSEIBUTSU

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6178823A (en) * 1984-09-27 1986-04-22 Toshiba Corp Epoxy resin composition
JPS6251973B2 (en) * 1984-09-27 1987-11-02 Tokyo Shibaura Electric Co

Also Published As

Publication number Publication date
FR2337752A1 (en) 1977-08-05
GB1532592A (en) 1978-11-15
DE2700363A1 (en) 1977-07-14
IT1082701B (en) 1985-05-21

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