JPS5667948A - Resin for sealing semiconductor element - Google Patents

Resin for sealing semiconductor element

Info

Publication number
JPS5667948A
JPS5667948A JP14327879A JP14327879A JPS5667948A JP S5667948 A JPS5667948 A JP S5667948A JP 14327879 A JP14327879 A JP 14327879A JP 14327879 A JP14327879 A JP 14327879A JP S5667948 A JPS5667948 A JP S5667948A
Authority
JP
Japan
Prior art keywords
resin
constitution
silicate
enstatite
chain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14327879A
Other languages
Japanese (ja)
Inventor
Koichiro Kishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP14327879A priority Critical patent/JPS5667948A/en
Priority to GB8034992A priority patent/GB2062646B/en
Priority to DE19803042093 priority patent/DE3042093C2/en
Publication of JPS5667948A publication Critical patent/JPS5667948A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To reduce a distortion quantity given to an element by a sealing resin by a method wherein silicate such as enstatite having a chain-like bonding constitution or a two dimensional mesh constitution is dispersed into a base resin such as a hardened resin, etc. as a filler agent. CONSTITUTION:A curable resin such as a phenol.novolak type epoxy plastic is used as a base resin. As for this resin, a resin wherein a Barcol hardness reaches at least 80% or more by hardening is optimum. As for filler, a silicate having a chain- like bonding constitution such as enstatite (MgSiO3), wollastonite (CaSiO3), rhodomite, a silicate having a two dimensional mesh constitution such as kaolinite or steatite are used. With this, a distortion quantity given to an element such as a bipolar IC by a sealing resin can be reduced, thus, preventing the characteristics of an element from variation.
JP14327879A 1979-11-07 1979-11-07 Resin for sealing semiconductor element Pending JPS5667948A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP14327879A JPS5667948A (en) 1979-11-07 1979-11-07 Resin for sealing semiconductor element
GB8034992A GB2062646B (en) 1979-11-07 1980-10-30 Moulding compound for semiconductor devices
DE19803042093 DE3042093C2 (en) 1979-11-07 1980-11-07 Molding compound for encasing semiconductor elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14327879A JPS5667948A (en) 1979-11-07 1979-11-07 Resin for sealing semiconductor element

Publications (1)

Publication Number Publication Date
JPS5667948A true JPS5667948A (en) 1981-06-08

Family

ID=15335012

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14327879A Pending JPS5667948A (en) 1979-11-07 1979-11-07 Resin for sealing semiconductor element

Country Status (3)

Country Link
JP (1) JPS5667948A (en)
DE (1) DE3042093C2 (en)
GB (1) GB2062646B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6164145A (en) * 1984-09-05 1986-04-02 Mitsubishi Electric Corp Resin sealed semiconductor device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1252321B (en) * 1961-06-16 1967-10-19
IT1082701B (en) * 1976-01-12 1985-05-21 Allied Chem EPOXY AND NOVOLACCA-BASED FLAME RETARDANT SEMICONDUCTORS

Also Published As

Publication number Publication date
DE3042093A1 (en) 1981-05-27
GB2062646A (en) 1981-05-28
DE3042093C2 (en) 1985-06-13
GB2062646B (en) 1983-08-10

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