TW430685B - Epoxy resin liquid composition for semiconductor encapsulation - Google Patents

Epoxy resin liquid composition for semiconductor encapsulation

Info

Publication number
TW430685B
TW430685B TW086110550A TW86110550A TW430685B TW 430685 B TW430685 B TW 430685B TW 086110550 A TW086110550 A TW 086110550A TW 86110550 A TW86110550 A TW 86110550A TW 430685 B TW430685 B TW 430685B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
liquid composition
resin liquid
semiconductor encapsulation
silicone
Prior art date
Application number
TW086110550A
Other languages
Chinese (zh)
Inventor
Tsutomu Namiki
Masahiro Hirano
Nobuo Takahashi
Haruki Niimoto
Original Assignee
Nippon Kayaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Kk filed Critical Nippon Kayaku Kk
Application granted granted Critical
Publication of TW430685B publication Critical patent/TW430685B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The present invention relates to an epoxy resin liquid composition for encapsulating semiconductors which permit production of semiconductor packages with a high resistance to warpage even when the packages have a large surface area. In more particular, it relates to an epoxy resin liquid composition for encapsulating semiconductors which comprises as indispensable components and epoxy resin (a) other than silicone-modified epoxy resins, a silicone-modified epoxy resin (b), a polybasic carboxylic acid type curing agent (c), an inorganic filler (d) and a curing accelerator (e).
TW086110550A 1996-07-30 1997-07-24 Epoxy resin liquid composition for semiconductor encapsulation TW430685B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21596296 1996-07-30

Publications (1)

Publication Number Publication Date
TW430685B true TW430685B (en) 2001-04-21

Family

ID=16681132

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086110550A TW430685B (en) 1996-07-30 1997-07-24 Epoxy resin liquid composition for semiconductor encapsulation

Country Status (4)

Country Link
KR (1) KR980012311A (en)
DE (1) DE19732500A1 (en)
FR (1) FR2751977B1 (en)
TW (1) TW430685B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI629296B (en) * 2013-09-30 2018-07-11 長瀨化成股份有限公司 Epoxy resin composition for semiconductor encapsulation, mounting structure for semiconductor, and production method of mounting structure for semiconductor

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001055431A (en) * 1999-08-19 2001-02-27 Shin Etsu Chem Co Ltd Epoxy resin composition for sealing semiconductor and semiconductor device
US6342309B1 (en) * 1999-08-19 2002-01-29 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition and semiconductor device
KR100517075B1 (en) 2003-08-11 2005-09-26 삼성전자주식회사 Method for manufacturing semiconductor device
EP2280044A4 (en) * 2008-05-21 2015-08-19 Nagase Chemtex Corp Epoxy resin composition for encapsulating electronic part
JP5353629B2 (en) * 2008-11-14 2013-11-27 信越化学工業株式会社 Thermosetting resin composition

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62184017A (en) * 1986-02-08 1987-08-12 Matsushita Electric Works Ltd Epoxy resin molding material
JP2570002B2 (en) * 1991-05-29 1997-01-08 信越化学工業株式会社 Flip chip sealing material and semiconductor device
DE4138411C2 (en) * 1991-11-22 1995-01-26 Bosch Gmbh Robert Curing potting compounds
JP3147677B2 (en) * 1994-09-30 2001-03-19 株式会社村田製作所 Liquid epoxy resin composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI629296B (en) * 2013-09-30 2018-07-11 長瀨化成股份有限公司 Epoxy resin composition for semiconductor encapsulation, mounting structure for semiconductor, and production method of mounting structure for semiconductor

Also Published As

Publication number Publication date
DE19732500A1 (en) 1998-02-05
FR2751977A1 (en) 1998-02-06
KR980012311A (en) 1998-04-30
FR2751977B1 (en) 1999-06-11

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent