SE9704602L - Semiconductor Capsule, Semiconductor Enclosure Procedure and Enclosure for Use in Semiconductor Enclosure - Google Patents

Semiconductor Capsule, Semiconductor Enclosure Procedure and Enclosure for Use in Semiconductor Enclosure

Info

Publication number
SE9704602L
SE9704602L SE9704602A SE9704602A SE9704602L SE 9704602 L SE9704602 L SE 9704602L SE 9704602 A SE9704602 A SE 9704602A SE 9704602 A SE9704602 A SE 9704602A SE 9704602 L SE9704602 L SE 9704602L
Authority
SE
Sweden
Prior art keywords
semiconductor
enclosure
encapsulant
filler
substrate
Prior art date
Application number
SE9704602A
Other languages
Swedish (sv)
Other versions
SE9704602D0 (en
SE522253C2 (en
Inventor
Kazunori Omoya
Takashi Oobayashi
Wataru Sakurai
Mitsuru Harada
Yoshihiro Bessho
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP07308798A external-priority patent/JP3093621B2/en
Priority claimed from US08/593,675 external-priority patent/US5641996A/en
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of SE9704602D0 publication Critical patent/SE9704602D0/en
Publication of SE9704602L publication Critical patent/SE9704602L/en
Publication of SE522253C2 publication Critical patent/SE522253C2/en

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    • H01L2924/078—Adhesive characteristics other than chemical
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    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Tires In General (AREA)

Abstract

An improved semiconductor unit package is disclosed. This package is implemented by a semiconductor device (1) having an electrode pad (2), a substrate (6) having a terminal electrode (5), a bump electrode (3) formed on the electrode pad (2), a conductive adhesion layer (4) with flexibility, and an encapsulating layer (7) formed by curing a composition the viscosity and thixotropy index of which are below 100 Pa<.>s and below 1.1, respectively. Such a composition essentially consists of (A) a resin binder that contains, for example, a polyepoxide, an acid anhydride, and a rheology modifier and (B) a filler. The rheology modifier is one capable of impeding interaction between a free acid contained in the acid anhydride and a polar group at the surface of the filler. An encapsulant with improved flowability is used, so that the encapsulant readily flows and spreads to fill a gap between the semiconductor device (1) and the substrate (6) with no air bubbles. This achieves semiconductor unit packages with high reliability and productivity.
SE9704602A 1995-06-12 1997-12-10 Semiconductor Capsule, Semiconductor Enclosure Procedure and Enclosure for Use in Semiconductor Enclosure SE522253C2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP14437395 1995-06-12
JP07308798A JP3093621B2 (en) 1995-01-30 1995-11-28 Semiconductor device mounting method
US08/593,675 US5641996A (en) 1995-01-30 1996-01-29 Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging
PCT/JP1996/001600 WO1996042106A1 (en) 1995-06-12 1996-06-12 Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging

Publications (3)

Publication Number Publication Date
SE9704602D0 SE9704602D0 (en) 1997-12-10
SE9704602L true SE9704602L (en) 1998-02-05
SE522253C2 SE522253C2 (en) 2004-01-27

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Family Applications (1)

Application Number Title Priority Date Filing Date
SE9704602A SE522253C2 (en) 1995-06-12 1997-12-10 Semiconductor Capsule, Semiconductor Enclosure Procedure and Enclosure for Use in Semiconductor Enclosure

Country Status (9)

Country Link
CN (1) CN1101594C (en)
AU (1) AU695142B2 (en)
CA (1) CA2221286A1 (en)
FI (1) FI974488A (en)
ID (2) ID19377A (en)
IN (1) IN192021B (en)
NO (1) NO321429B1 (en)
SE (1) SE522253C2 (en)
WO (1) WO1996042106A1 (en)

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KR100467946B1 (en) * 1997-01-24 2005-01-24 로무 가부시키가이샤 Method for manufacturing a semiconductor chip
JPH10270496A (en) 1997-03-27 1998-10-09 Hitachi Ltd Electronic device, information processor, semiconductor device, semiconductor chip, and mounting method thereof
US6407461B1 (en) 1997-06-27 2002-06-18 International Business Machines Corporation Injection molded integrated circuit chip assembly
DE69934153T2 (en) * 1998-02-02 2007-09-20 Shin-Etsu Chemical Co., Ltd. Method for mounting flip-chip semiconductor devices
WO2000002245A1 (en) 1998-07-01 2000-01-13 Seiko Epson Corporation Semiconductor device, method of manufacture thereof, circuit board, and electronic device
US7834464B2 (en) * 2007-10-09 2010-11-16 Infineon Technologies Ag Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
JP5729468B2 (en) * 2011-05-13 2015-06-03 富士電機株式会社 Semiconductor device
JP5658088B2 (en) * 2011-05-23 2015-01-21 パナソニックＩｐマネジメント株式会社 Semiconductor package component mounting structure and manufacturing method
US10894935B2 (en) 2015-12-04 2021-01-19 Samsung Electronics Co., Ltd. Composition for removing silicone resins and method of thinning substrate by using the same
CN107034028B (en) * 2015-12-04 2021-05-25 三星电子株式会社 Composition for removing silicone resin, method for thinning substrate and manufacturing semiconductor package using the same, and system using the same
US10157887B2 (en) 2017-03-09 2018-12-18 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method of manufacturing the same
US10297564B2 (en) * 2017-10-05 2019-05-21 Infineon Technologies Ag Semiconductor die attach system and method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63268724A (en) * 1987-04-24 1988-11-07 Matsushita Electric Works Ltd Liquid epoxy resin composition
JP2515344B2 (en) * 1987-07-24 1996-07-10 松下電工株式会社 One-part liquid epoxy resin composition for sealing
JPH04130633A (en) * 1990-09-20 1992-05-01 Matsushita Electron Corp Semiconductor device and manufacture thereof and capillary used therefor
US5194930A (en) * 1991-09-16 1993-03-16 International Business Machines Dielectric composition and solder interconnection structure for its use
US5436503A (en) * 1992-11-18 1995-07-25 Matsushita Electronics Corporation Semiconductor device and method of manufacturing the same
JP2826049B2 (en) * 1992-11-18 1998-11-18 松下電子工業株式会社 Semiconductor device and manufacturing method thereof
JPH06279654A (en) * 1993-02-26 1994-10-04 Matsushita Electric Works Ltd Liquid epoxy resin composition
JPH06313027A (en) * 1993-05-06 1994-11-08 Matsushita Electric Works Ltd Epoxy resin molding material for sealing

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FI974488A (en) 1998-02-09
CA2221286A1 (en) 1996-12-27
AU6015496A (en) 1997-01-09
CN1185231A (en) 1998-06-17
SE9704602D0 (en) 1997-12-10
NO975833L (en) 1998-02-03
WO1996042106A1 (en) 1996-12-27
NO321429B1 (en) 2006-05-08
FI974488A0 (en) 1997-12-11
AU695142B2 (en) 1998-08-06
SE522253C2 (en) 2004-01-27
NO975833D0 (en) 1997-12-11
CN1101594C (en) 2003-02-12
ID19376A (en) 1998-07-09
ID19377A (en) 1998-07-09
IN192021B (en) 2004-02-07

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