FI974488A - Semiconductor Unit Capsule, Semiconductor Unit Enclosure Procedure, and Enclosure for Use for Semiconductor Unit Enclosure - Google Patents
Semiconductor Unit Capsule, Semiconductor Unit Enclosure Procedure, and Enclosure for Use for Semiconductor Unit Enclosure Download PDFInfo
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- FI974488A FI974488A FI974488A FI974488A FI974488A FI 974488 A FI974488 A FI 974488A FI 974488 A FI974488 A FI 974488A FI 974488 A FI974488 A FI 974488A FI 974488 A FI974488 A FI 974488A
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- enclosure
- semiconductor unit
- procedure
- capsule
- semiconductor
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- 239000004065 semiconductor Substances 0.000 title 3
- 239000002775 capsule Substances 0.000 title 1
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01049—Indium [In]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01061—Promethium [Pm]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01077—Iridium [Ir]
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- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
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- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12033—Gunn diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Packages (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Tires In General (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14437395 | 1995-06-12 | ||
JP07308798A JP3093621B2 (en) | 1995-01-30 | 1995-11-28 | Semiconductor device mounting method |
US08/593,675 US5641996A (en) | 1995-01-30 | 1996-01-29 | Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging |
PCT/JP1996/001600 WO1996042106A1 (en) | 1995-06-12 | 1996-06-12 | Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging |
Publications (2)
Publication Number | Publication Date |
---|---|
FI974488A0 FI974488A0 (en) | 1997-12-11 |
FI974488A true FI974488A (en) | 1998-02-09 |
Family
ID=27318812
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI974488A FI974488A (en) | 1995-06-12 | 1997-12-11 | Semiconductor Unit Capsule, Semiconductor Unit Enclosure Procedure, and Enclosure for Use for Semiconductor Unit Enclosure |
Country Status (9)
Country | Link |
---|---|
CN (1) | CN1101594C (en) |
AU (1) | AU695142B2 (en) |
CA (1) | CA2221286A1 (en) |
FI (1) | FI974488A (en) |
ID (2) | ID19376A (en) |
IN (1) | IN192021B (en) |
NO (1) | NO321429B1 (en) |
SE (1) | SE522253C2 (en) |
WO (1) | WO1996042106A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100467946B1 (en) * | 1997-01-24 | 2005-01-24 | 로무 가부시키가이샤 | Method for manufacturing a semiconductor chip |
JPH10270496A (en) | 1997-03-27 | 1998-10-09 | Hitachi Ltd | Electronic device, information processor, semiconductor device, semiconductor chip, and mounting method thereof |
US6407461B1 (en) | 1997-06-27 | 2002-06-18 | International Business Machines Corporation | Injection molded integrated circuit chip assembly |
DE69934153T2 (en) * | 1998-02-02 | 2007-09-20 | Shin-Etsu Chemical Co., Ltd. | Method for mounting flip-chip semiconductor devices |
JP3702788B2 (en) | 1998-07-01 | 2005-10-05 | セイコーエプソン株式会社 | Manufacturing method of semiconductor device |
US7834464B2 (en) * | 2007-10-09 | 2010-11-16 | Infineon Technologies Ag | Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device |
US8957508B2 (en) * | 2011-05-13 | 2015-02-17 | Fuji Electric Co., Ltd. | Semiconductor device and method of manufacturing the same |
JP5658088B2 (en) * | 2011-05-23 | 2015-01-21 | パナソニックIpマネジメント株式会社 | Semiconductor package component mounting structure and manufacturing method |
CN107034028B (en) * | 2015-12-04 | 2021-05-25 | 三星电子株式会社 | Composition for removing silicone resin, method for thinning substrate and manufacturing semiconductor package using the same, and system using the same |
US10894935B2 (en) | 2015-12-04 | 2021-01-19 | Samsung Electronics Co., Ltd. | Composition for removing silicone resins and method of thinning substrate by using the same |
US10157887B2 (en) * | 2017-03-09 | 2018-12-18 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method of manufacturing the same |
US10297564B2 (en) * | 2017-10-05 | 2019-05-21 | Infineon Technologies Ag | Semiconductor die attach system and method |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63268724A (en) * | 1987-04-24 | 1988-11-07 | Matsushita Electric Works Ltd | Liquid epoxy resin composition |
JP2515344B2 (en) * | 1987-07-24 | 1996-07-10 | 松下電工株式会社 | One-part liquid epoxy resin composition for sealing |
JPH04130633A (en) * | 1990-09-20 | 1992-05-01 | Matsushita Electron Corp | Semiconductor device and manufacture thereof and capillary used therefor |
US5194930A (en) * | 1991-09-16 | 1993-03-16 | International Business Machines | Dielectric composition and solder interconnection structure for its use |
US5436503A (en) * | 1992-11-18 | 1995-07-25 | Matsushita Electronics Corporation | Semiconductor device and method of manufacturing the same |
JP2826049B2 (en) * | 1992-11-18 | 1998-11-18 | 松下電子工業株式会社 | Semiconductor device and manufacturing method thereof |
JPH06279654A (en) * | 1993-02-26 | 1994-10-04 | Matsushita Electric Works Ltd | Liquid epoxy resin composition |
JPH06313027A (en) * | 1993-05-06 | 1994-11-08 | Matsushita Electric Works Ltd | Epoxy resin molding material for sealing |
-
1996
- 1996-06-11 ID IDP980876A patent/ID19376A/en unknown
- 1996-06-11 ID IDP980877A patent/ID19377A/en unknown
- 1996-06-12 AU AU60154/96A patent/AU695142B2/en not_active Ceased
- 1996-06-12 WO PCT/JP1996/001600 patent/WO1996042106A1/en active Application Filing
- 1996-06-12 CN CN96194158A patent/CN1101594C/en not_active Expired - Fee Related
- 1996-06-12 CA CA002221286A patent/CA2221286A1/en not_active Abandoned
- 1996-11-06 IN IN1083CA1996 patent/IN192021B/en unknown
-
1997
- 1997-12-10 SE SE9704602A patent/SE522253C2/en not_active IP Right Cessation
- 1997-12-11 NO NO19975833A patent/NO321429B1/en not_active IP Right Cessation
- 1997-12-11 FI FI974488A patent/FI974488A/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
AU6015496A (en) | 1997-01-09 |
ID19376A (en) | 1998-07-09 |
IN192021B (en) | 2004-02-07 |
AU695142B2 (en) | 1998-08-06 |
SE9704602L (en) | 1998-02-05 |
ID19377A (en) | 1998-07-09 |
NO975833L (en) | 1998-02-03 |
NO321429B1 (en) | 2006-05-08 |
WO1996042106A1 (en) | 1996-12-27 |
FI974488A0 (en) | 1997-12-11 |
CA2221286A1 (en) | 1996-12-27 |
SE522253C2 (en) | 2004-01-27 |
NO975833D0 (en) | 1997-12-11 |
CN1101594C (en) | 2003-02-12 |
SE9704602D0 (en) | 1997-12-10 |
CN1185231A (en) | 1998-06-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD | Application lapsed |