ID19377A - Semiconductor unit packages, the semiconductor unit packaging methods and materials for use in packaging pengkapsul semiconductor unit (fractions of P-961 658) - Google Patents

Semiconductor unit packages, the semiconductor unit packaging methods and materials for use in packaging pengkapsul semiconductor unit (fractions of P-961 658)

Info

Publication number
ID19377A
ID19377A IDP980877A ID980877A ID19377A ID 19377 A ID19377 A ID 19377A ID P980877 A IDP980877 A ID P980877A ID 980877 A ID980877 A ID 980877A ID 19377 A ID19377 A ID 19377A
Authority
ID
Indonesia
Prior art keywords
semiconductor unit
packaging
pengkapsul
fractions
materials
Prior art date
Application number
IDP980877A
Other languages
Indonesian (id)
Inventor
Kazunori Omoya
Takashi Oobayashi
Wataru Sakurai
Mitsuru Harada
Yoshihiro Bessho
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP14437395 priority Critical
Priority to JP07308798A priority patent/JP3093621B2/en
Priority to US08/593,675 priority patent/US5641996A/en
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of ID19377A publication Critical patent/ID19377A/en

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    • H01L24/10Bump connectors ; Manufacturing methods related thereto
    • H01L24/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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IDP980877A 1995-01-30 1996-06-11 Semiconductor unit packages, the semiconductor unit packaging methods and materials for use in packaging pengkapsul semiconductor unit (fractions of P-961 658) ID19377A (en)

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JP07308798A JP3093621B2 (en) 1995-01-30 1995-11-28 Implementation method of a semiconductor device
US08/593,675 US5641996A (en) 1995-01-30 1996-01-29 Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging

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AU (1) AU695142B2 (en)
CA (1) CA2221286A1 (en)
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KR100522223B1 (en) * 1997-01-24 2005-12-21 로무 가부시키가이샤 Semiconductor device and method for manufacturing thereof
US6737741B2 (en) 1997-03-27 2004-05-18 Hitachi, Ltd. Process for mounting electronic device and semiconductor device
JPH10270496A (en) 1997-03-27 1998-10-09 Hitachi Hokkai Semiconductor Ltd Electronic device, information processor, semiconductor device, semiconductor chip, and mounting method thereof
US6407461B1 (en) * 1997-06-27 2002-06-18 International Business Machines Corporation Injection molded integrated circuit chip assembly
EP0933809B1 (en) * 1998-02-02 2006-11-29 Shin-Etsu Chemical Co., Ltd. Method for mounting flip-chip semiconductor devices
CN1143375C (en) 1998-07-01 2004-03-24 精工爱普生株式会社 Semiconductor device, method of manufacture, circuit board and electronic device
US7868466B2 (en) 1998-07-01 2011-01-11 Seiko Epson Corporation Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
US7834464B2 (en) * 2007-10-09 2010-11-16 Infineon Technologies Ag Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
CN100521129C (en) 2007-12-28 2009-07-29 苏州固锝电子股份有限公司 A protection and sealing method of high-power semiconductor device
EP2709149A4 (en) * 2011-05-13 2015-08-05 Fuji Electric Co Ltd Semiconductor device and manufacturing method thereof
JP5658088B2 (en) * 2011-05-23 2015-01-21 パナソニックIpマネジメント株式会社 Mounting structure and a method of manufacturing a semiconductor package component

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JPH04130633A (en) * 1990-09-20 1992-05-01 Matsushita Electron Corp Semiconductor device and manufacture thereof and capillary used therefor
US5194930A (en) * 1991-09-16 1993-03-16 International Business Machines Dielectric composition and solder interconnection structure for its use
US5436503A (en) * 1992-11-18 1995-07-25 Matsushita Electronics Corporation Semiconductor device and method of manufacturing the same
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SE522253C2 (en) 2004-01-27
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CA2221286A1 (en) 1996-12-27
WO1996042106A1 (en) 1996-12-27
CN1185231A (en) 1998-06-17
AU695142B2 (en) 1998-08-06
FI974488A (en) 1998-02-09
SE9704602D0 (en) 1997-12-10
NO321429B1 (en) 2006-05-08
FI974488D0 (en)
SE9704602L (en) 1998-02-05
IN192021B (en) 2004-02-07
FI974488A0 (en) 1997-12-11
AU6015496A (en) 1997-01-09
ID19376A (en) 1998-07-09

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