ID19376A - SEMICONDUCTOR UNIT PACKAGE, SEMICONDUCTOR UNIT PACKAGING METHOD, AND COMPACTING MATERIALS FOR USE IN PACKAGING SEMICONDUCTOR UNITS (FROM P-961658) - Google Patents

SEMICONDUCTOR UNIT PACKAGE, SEMICONDUCTOR UNIT PACKAGING METHOD, AND COMPACTING MATERIALS FOR USE IN PACKAGING SEMICONDUCTOR UNITS (FROM P-961658)

Info

Publication number
ID19376A
ID19376A IDP980876A ID980876A ID19376A ID 19376 A ID19376 A ID 19376A ID P980876 A IDP980876 A ID P980876A ID 980876 A ID980876 A ID 980876A ID 19376 A ID19376 A ID 19376A
Authority
ID
Indonesia
Prior art keywords
semiconductor
packaging
semiconductor unit
units
compacting materials
Prior art date
Application number
IDP980876A
Other languages
Indonesian (id)
Inventor
Kazunori Omoya
Takashi Oobayashi
Wataru Sakurai
Mitsuru Harada
Yoshihiro Bessho
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP07308798A external-priority patent/JP3093621B2/en
Priority claimed from US08/593,675 external-priority patent/US5641996A/en
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of ID19376A publication Critical patent/ID19376A/en

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    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
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    • H01L2924/01082—Lead [Pb]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
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    • H01L2924/013—Alloys
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    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
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    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
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    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Packages (AREA)
  • Tires In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
IDP980876A 1995-06-12 1996-06-11 SEMICONDUCTOR UNIT PACKAGE, SEMICONDUCTOR UNIT PACKAGING METHOD, AND COMPACTING MATERIALS FOR USE IN PACKAGING SEMICONDUCTOR UNITS (FROM P-961658) ID19376A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP14437395 1995-06-12
JP07308798A JP3093621B2 (en) 1995-01-30 1995-11-28 Semiconductor device mounting method
US08/593,675 US5641996A (en) 1995-01-30 1996-01-29 Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging

Publications (1)

Publication Number Publication Date
ID19376A true ID19376A (en) 1998-07-09

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IDP980877A ID19377A (en) 1995-06-12 1996-06-11 SEMICONDUCTOR UNIT PACKAGE, SEMICONDUCTOR UNIT PACKAGING METHOD, AND COMPACTING MATERIALS FOR USE IN PACKAGING SEMICONDUCTOR UNITS (FROM P-961658)

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CA (1) CA2221286A1 (en)
FI (1) FI974488A (en)
ID (2) ID19376A (en)
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NO (1) NO321429B1 (en)
SE (1) SE522253C2 (en)
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KR100467946B1 (en) * 1997-01-24 2005-01-24 로무 가부시키가이샤 Method for manufacturing a semiconductor chip
JPH10270496A (en) 1997-03-27 1998-10-09 Hitachi Ltd Electronic device, information processor, semiconductor device, semiconductor chip, and mounting method thereof
US6407461B1 (en) 1997-06-27 2002-06-18 International Business Machines Corporation Injection molded integrated circuit chip assembly
DE69934153T2 (en) * 1998-02-02 2007-09-20 Shin-Etsu Chemical Co., Ltd. Method for mounting flip-chip semiconductor devices
JP3702788B2 (en) 1998-07-01 2005-10-05 セイコーエプソン株式会社 Manufacturing method of semiconductor device
US7834464B2 (en) * 2007-10-09 2010-11-16 Infineon Technologies Ag Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
US8957508B2 (en) * 2011-05-13 2015-02-17 Fuji Electric Co., Ltd. Semiconductor device and method of manufacturing the same
JP5658088B2 (en) * 2011-05-23 2015-01-21 パナソニックＩｐマネジメント株式会社 Semiconductor package component mounting structure and manufacturing method
CN107034028B (en) * 2015-12-04 2021-05-25 三星电子株式会社 Composition for removing silicone resin, method for thinning substrate and manufacturing semiconductor package using the same, and system using the same
US10894935B2 (en) 2015-12-04 2021-01-19 Samsung Electronics Co., Ltd. Composition for removing silicone resins and method of thinning substrate by using the same
US10157887B2 (en) * 2017-03-09 2018-12-18 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method of manufacturing the same
US10297564B2 (en) * 2017-10-05 2019-05-21 Infineon Technologies Ag Semiconductor die attach system and method

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JPS63268724A (en) * 1987-04-24 1988-11-07 Matsushita Electric Works Ltd Liquid epoxy resin composition
JP2515344B2 (en) * 1987-07-24 1996-07-10 松下電工株式会社 One-part liquid epoxy resin composition for sealing
JPH04130633A (en) * 1990-09-20 1992-05-01 Matsushita Electron Corp Semiconductor device and manufacture thereof and capillary used therefor
US5194930A (en) * 1991-09-16 1993-03-16 International Business Machines Dielectric composition and solder interconnection structure for its use
US5436503A (en) * 1992-11-18 1995-07-25 Matsushita Electronics Corporation Semiconductor device and method of manufacturing the same
JP2826049B2 (en) * 1992-11-18 1998-11-18 松下電子工業株式会社 Semiconductor device and manufacturing method thereof
JPH06279654A (en) * 1993-02-26 1994-10-04 Matsushita Electric Works Ltd Liquid epoxy resin composition
JPH06313027A (en) * 1993-05-06 1994-11-08 Matsushita Electric Works Ltd Epoxy resin molding material for sealing

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AU6015496A (en) 1997-01-09
IN192021B (en) 2004-02-07
AU695142B2 (en) 1998-08-06
SE9704602L (en) 1998-02-05
ID19377A (en) 1998-07-09
NO975833L (en) 1998-02-03
NO321429B1 (en) 2006-05-08
FI974488A (en) 1998-02-09
WO1996042106A1 (en) 1996-12-27
FI974488A0 (en) 1997-12-11
CA2221286A1 (en) 1996-12-27
SE522253C2 (en) 2004-01-27
NO975833D0 (en) 1997-12-11
CN1101594C (en) 2003-02-12
SE9704602D0 (en) 1997-12-10
CN1185231A (en) 1998-06-17

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