JPS61133223A - Epoxy resin molding material for semiconductor sealing - Google Patents

Abstract

PURPOSE:The title molding material is obtained by adding a modified silicon compound to an epoxy resin at a specific ratio, thus being suitable for use in sealing semiconductors, because it has good moldability, high resistance to moisture and low stress. CONSTITUTION:The objective molding material is obtained by adding (A) 2-30pts.wt. of a modified silicon compound such as aminosilicone intermediate with an amino equivalent of 500-3,000 and (B) a curing agent and/or curing promotor to (C) 100pts.wt. of an epoxy resin such as a novolak type epoxy resin. The component A is used after it is dispersed in the component B or C.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an epoxy resin molding material for encapsulating a semiconductor.

[Background technology]

In recent years, the development of semiconductor devices has been remarkable.Especially in the field of memory, the trend toward larger device sizes due to higher functionality has led to a decline in moisture resistance, and problems with sealing, which had not been a problem in the past. The problems of stress on the elements, and furthermore, thermal stress during the mounting process such as soldering have come to have a serious impact on the reliability of semiconductors. In recent years, it has been found that the development of various new curing accelerators has improved moisture resistance compared to conventional ones, and research on the contribution of curing aids will continue in the future. There was a problem with the occurrence of light flakes. The occurrence of thin flakes not only reduces molding workability but also reduces the reliability of semiconductor devices. . Conventional methods include adjusting the particle size distribution of fillers such as silica and the molecular weight distribution of resins to prevent thin flakes, but these methods are not sufficient and also vary depending on the curing speed, so it cannot be said to be a perfect method.

[Purpose of the invention]

An object of the present invention is to provide an epoxy resin molding material for semiconductor encapsulation that has good moldability, moisture resistance, and low stress.

[Disclosure of the invention]

The present invention relates to an epoxy resin molding material for semiconductor encapsulation, which is characterized in that 100 parts by weight (hereinafter simply referred to as "parts") of an epoxy resin contains 2 to 2 to 10 parts of a modified silicone compound, and the present invention will be described in detail below. .

The modified silicone compounds used in the present invention include epoxy-modified silicone intermediates, amino-modified silicone intermediates, acid-modified silicone intermediates, hydroxyl-modified silicone intermediates, polyether-modified silicone intermediates, glyco-! It uses modified silicon compounds in general such as modified silicon intermediates, and is not particularly limited, but preferably has an amino equivalent of 500.
From the viewpoint of overall balance, it is desirable to use a 7-minosilicon intermediate of ~3000. The amount of the modified silicone compound must be 2 to 10 parts per 100 parts of the epoxy resin. That is, if the amount is less than 2 parts, there is no effect of preventing thin flakes during molding, and moisture resistance is not improved, and even if the amount exceeds the level, low stress and improvement in moisture resistance are the same. The epoxy resins used in the present invention include bispheno-A/A type epoxy resin, novolac type epoxy resin, flexible epoxy resin,
For epoxy resins such as halogenated epoxy resins, glycidyl ester/L/type epoxy resins, and polymeric epoxy resins, amine curing agents, aliphatic polyamines, polyamide resins, aromatic diamines, acid anhydride curing agents, Lewis acid complexes, etc. Compounds, curing agents such as phenolic resins, isocyanate resins, crosslinking agents, curing accelerators such as imidazole, imidacillin, attack phosphine compounds, etc. are added, and additives such as fillers, mold release agents, surfactants, etc. are added. It is. The method of adding the modified silicone compound is not particularly limited, but it is preferable to disperse the modified silicone compound in advance in the resin, curing agent, or curing accelerator before use. Furthermore, regarding the molding of the molding material, transfer molding, injection molding, etc.
Not only is it suitable for multi-cavity molding of electronic components such as C, LSI, and 5LSI, but it can also be applied to casting and compression molding. The present invention will be described in detail below using examples.

Examples 1 to 3 and Conventional Examples 1 and 2 An epoxy resin molding material for semiconductor encapsulation was obtained by blending, mixing, and mixing the materials according to the recipe in Table 1, and was molded at a mold temperature of 175"C1 using a transfer molding machine. Molding pressure 50-1
A transistor was sealed and molded under conditions of a curing time of 3 minutes to obtain an electronic component.

Table 1 [Effects of the Invention] As is clear from Table 2, the results of testing the molded products of Examples 1 to 3 and Conventional Examples 1 and 2 show that the epoxy resin molding material for semiconductor encapsulation of the present invention can be used. The obtained molded product had good moldability, moisture resistance, and low stress, confirming the superiority of the epoxy resin molding material for semiconductor encapsulation according to the present invention.

Table 2 note

Claims (2)

[Claims] (1) An epoxy resin molding material for semiconductor encapsulation, characterized in that it contains 2 to 30 parts by weight of a modified silicone compound per 100 parts by weight of epoxy resin. (2) The epoxy resin molding material for semiconductor encapsulation according to claim 1, wherein the modified silicone compound is an aminosilicon intermediate.