GB2062646B - Moulding compound for semiconductor devices - Google Patents

Moulding compound for semiconductor devices

Info

Publication number
GB2062646B
GB2062646B GB8034992A GB8034992A GB2062646B GB 2062646 B GB2062646 B GB 2062646B GB 8034992 A GB8034992 A GB 8034992A GB 8034992 A GB8034992 A GB 8034992A GB 2062646 B GB2062646 B GB 2062646B
Authority
GB
United Kingdom
Prior art keywords
semiconductor devices
moulding compound
moulding
compound
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8034992A
Other versions
GB2062646A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Publication of GB2062646A publication Critical patent/GB2062646A/en
Application granted granted Critical
Publication of GB2062646B publication Critical patent/GB2062646B/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • H01L23/295Organic, e.g. plastic containing a filler
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
GB8034992A 1979-11-07 1980-10-30 Moulding compound for semiconductor devices Expired GB2062646B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14327879A JPS5667948A (en) 1979-11-07 1979-11-07 Resin for sealing semiconductor element

Publications (2)

Publication Number Publication Date
GB2062646A GB2062646A (en) 1981-05-28
GB2062646B true GB2062646B (en) 1983-08-10

Family

ID=15335012

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8034992A Expired GB2062646B (en) 1979-11-07 1980-10-30 Moulding compound for semiconductor devices

Country Status (3)

Country Link
JP (1) JPS5667948A (en)
DE (1) DE3042093C2 (en)
GB (1) GB2062646B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6164145A (en) * 1984-09-05 1986-04-02 Mitsubishi Electric Corp Resin sealed semiconductor device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1252321B (en) * 1961-06-16 1967-10-19
IT1082701B (en) * 1976-01-12 1985-05-21 Allied Chem EPOXY AND NOVOLACCA-BASED FLAME RETARDANT SEMICONDUCTORS

Also Published As

Publication number Publication date
DE3042093C2 (en) 1985-06-13
GB2062646A (en) 1981-05-28
DE3042093A1 (en) 1981-05-27
JPS5667948A (en) 1981-06-08

Similar Documents

Publication Publication Date Title
GB2056169B (en) Manufacturing system for semiconductor devices
GB2065973B (en) Processes for manufacturing semiconductor devices
EP0033037A3 (en) Heterojunction semiconductor devices
GB2057762B (en) Explosion-proof semiconductor device
JPS55118651A (en) Semiconductor device
JPS55133562A (en) Semiconductor device
JPS567457A (en) Package for semiconductor device
JPS5637680A (en) Semiconductor device
EP0023782A3 (en) Semiconductor device
JPS567466A (en) Selffalignment semiconductor device
JPS55140272A (en) Semiconductor device
IE801825L (en) Semiconductor manufacture
JPS567450A (en) Semiconductor device
JPS567465A (en) Semiconductor device
DE3071218D1 (en) Integrated semiconductor devices
DE3067917D1 (en) Constructional arrangement for semiconductor devices
JPS5687395A (en) Semiconductor device
DE3071242D1 (en) Semiconductor device
JPS55162248A (en) Semiconductor device
JPS5666049A (en) Semiconductor device
JPS5650542A (en) Semiconductor package
GB2043343B (en) Semiconductor device
GB2061001B (en) Semiconductor device
JPS5676581A (en) Semiconductor device
DE3066946D1 (en) Semiconductor master-slice device

Legal Events

Date Code Title Description
746 Register noted 'licences of right' (sect. 46/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19981030