JPH04338613A - Magnetic shielding resin - Google Patents
Magnetic shielding resinInfo
- Publication number
- JPH04338613A JPH04338613A JP3140895A JP14089591A JPH04338613A JP H04338613 A JPH04338613 A JP H04338613A JP 3140895 A JP3140895 A JP 3140895A JP 14089591 A JP14089591 A JP 14089591A JP H04338613 A JPH04338613 A JP H04338613A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealing resin
- magnetic sealing
- powder
- core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 75
- 239000011347 resin Substances 0.000 title claims abstract description 75
- 239000000843 powder Substances 0.000 claims abstract description 28
- 238000007789 sealing Methods 0.000 claims description 55
- 229920002050 silicone resin Polymers 0.000 claims description 20
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 5
- 229910000859 α-Fe Inorganic materials 0.000 abstract description 5
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 239000006247 magnetic powder Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- 229910052710 silicon Inorganic materials 0.000 abstract description 4
- 239000010703 silicon Substances 0.000 abstract description 4
- 230000035699 permeability Effects 0.000 abstract description 3
- 229920006026 co-polymeric resin Polymers 0.000 abstract description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 229920002545 silicone oil Polymers 0.000 description 14
- 239000000463 material Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 8
- 238000005452 bending Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 4
- 238000001721 transfer moulding Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000001010 compromised effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Insulating Of Coils (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】この発明は磁性封止樹脂に関し、
特にたとえば、チップ型コイル素子のコアおよびコイル
の周囲にモールドされる、磁性封止樹脂に関する。[Industrial Application Field] This invention relates to magnetic sealing resin.
In particular, the present invention relates to a magnetic sealing resin that is molded around the core and coil of a chip-type coil element.
【０００２】0002
【従来の技術】この種の従来の磁性封止樹脂には、エポ
キシ樹脂に透磁率を上げるためにフェライト粉末を充填
したものがあった。この磁性封止樹脂は、フェライト粉
末を含有しない通常のエポキシ樹脂からなる封止樹脂よ
りも弾性率が高い。2. Description of the Related Art Conventional magnetic sealing resins of this type include epoxy resins filled with ferrite powder to increase magnetic permeability. This magnetic sealing resin has a higher elastic modulus than a sealing resin made of a normal epoxy resin that does not contain ferrite powder.
【０００３】0003
【発明が解決しようとする課題】このような磁性封止樹
脂でチップ型コイル素子の周囲をモールドする場合、磁
性封止樹脂の硬化時において、磁性封止樹脂からコアに
対して応力がかかる。また、この磁性封止樹脂でモール
ドされるコアのつばの部分は、その厚みがたとえば０．
５ｍｍ程度に形成され、その強度が最も弱い。そのため
、磁性封止樹脂からコアにかかる応力によって、特に、
コアのつばの部分にクラックが発生することがあった。When the periphery of a chip-type coil element is molded with such a magnetic sealing resin, stress is applied from the magnetic sealing resin to the core when the magnetic sealing resin hardens. Further, the thickness of the brim portion of the core molded with this magnetic sealing resin is, for example, 0.
It is formed with a thickness of about 5 mm, and its strength is the weakest. Therefore, due to the stress applied to the core from the magnetic sealing resin,
Cracks sometimes occurred at the brim of the core.
【０００４】そこで、コアにかかる磁性封止樹脂からの
応力を低減させてクラックの発生を防止するために、フ
ェライト粉末などの無機充填材料を高充填化することに
よってコアと磁性封止樹脂との熱膨張係数の差を低下さ
せる方法やシリコンオイルなどを添加して樹脂のマトリ
ックス中に応力を低下させる他の材料を島状に分散させ
ることによって磁性封止樹脂の弾性率を低下させる方法
などが用いられているが、成形性や材料の信頼性の影響
からこれらの方法による磁性封止樹脂の低応力化に限界
がある。たとえば、シリコンオイルは、反応に寄与しな
いため、硬化した樹脂中に液状で存在する。そのため、
シリコンオイルの添加量には限界がある。さらに、シリ
コンオイルは樹脂の硬化後もその表面に浮き出てくる場
合があり、その場合は製品の信頼性に欠ける。[0004] Therefore, in order to reduce the stress from the magnetic sealing resin applied to the core and prevent the occurrence of cracks, the bond between the core and the magnetic sealing resin is increased by increasing the amount of inorganic filler material such as ferrite powder. There are methods to reduce the elastic modulus of magnetic sealing resin by reducing the difference in thermal expansion coefficients, and by adding silicone oil and other materials that reduce stress in the resin matrix by dispersing them in island shapes. However, there are limits to the reduction of stress in magnetic sealing resins by these methods due to the influence of moldability and reliability of the material. For example, silicone oil exists in a liquid state in the cured resin because it does not contribute to the reaction. Therefore,
There is a limit to the amount of silicone oil that can be added. Furthermore, silicone oil may float on the surface of the resin even after it has hardened, and in this case, the reliability of the product is compromised.
【０００５】それゆえに、この発明の主たる目的は、硬
化時に生じる応力の小さい磁性封止樹脂を提供すること
である。[0005] Therefore, the main object of the present invention is to provide a magnetic sealing resin that generates less stress during curing.
【０００６】[0006]
【課題を解決するための手段】この発明は、シリコン樹
脂の粉末が添加された、磁性封止樹脂である。[Means for Solving the Problems] The present invention is a magnetic sealing resin to which silicone resin powder is added.
【０００７】[0007]
【作用】シリコン樹脂の粉末を含有した磁性封止樹脂は
、弾性率が低くなる。そのため、硬化時に生じる応力が
低下する。[Operation] Magnetic sealing resin containing silicone resin powder has a low elastic modulus. Therefore, the stress generated during curing is reduced.
【０００８】[0008]
【発明の効果】この発明によれば、硬化時に生じる応力
の小さい磁性封止樹脂が得られる。そのため、この磁性
封止樹脂でたとえばチップ型コイル素子のコアおよびコ
イルをモールドすれば、磁性封止樹脂からコアにかかる
応力によってコアにクラック等が発生しにくくなる。According to the present invention, a magnetic sealing resin with low stress generated during curing can be obtained. Therefore, if the core and coil of a chip-type coil element, for example, are molded with this magnetic sealing resin, cracks and the like are less likely to occur in the core due to stress applied to the core from the magnetic sealing resin.
【０００９】この発明の上述の目的，その他の目的，特
徴および利点は、図面を参照して行う以下の実施例の詳
細な説明から一層明らかとなろう。The above objects, other objects, features and advantages of the present invention will become more apparent from the following detailed description of embodiments with reference to the drawings.
【００１０】0010
【実施例】図１はこの発明の背景となり、かつ、この発
明が適用されるチップ型コイル素子の一例を示す断面図
である。このチップ型コイル素子１０はコア１２を含む
。コア１２は、たとえば円柱状の軸１４を含み、軸１４
の両端には、たとえば４角板状のつば１６および１８が
それぞれ形成されている。このコア１２の軸１４の周囲
には、コイル２０が巻かれる。また、コア１２の一方の
つば１６の表面には、端子２２および２４が固着される
。これらの端子２２および２４には、コイル２０が電気
的に接続される。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a cross-sectional view showing an example of a chip-type coil element which forms the background of the present invention and to which the present invention is applied. This chip-type coil element 10 includes a core 12 . The core 12 includes a cylindrical shaft 14, for example, and the shaft 14
For example, rectangular plate-shaped collars 16 and 18 are formed at both ends, respectively. A coil 20 is wound around the axis 14 of this core 12. Furthermore, terminals 22 and 24 are fixed to the surface of one collar 16 of the core 12. A coil 20 is electrically connected to these terminals 22 and 24.
【００１１】一方、コア１２およびコイル２０の周囲に
は、磁性封止樹脂２６がモールドされる。この磁性封止
樹脂２６は、たとえばエポキシ樹脂，フェノール樹脂あ
るいはこれらの共重合体樹脂などの熱硬化型樹脂を含み
、この熱硬化型樹脂には、透磁率を上げるために、磁性
粉末としてのフェライト粉末が含有され、さらに、弾性
率を低下させるために、シリコン樹脂の粉末が添加され
ている。On the other hand, a magnetic sealing resin 26 is molded around the core 12 and coil 20. The magnetic sealing resin 26 includes a thermosetting resin such as an epoxy resin, a phenol resin, or a copolymer resin thereof, and the thermosetting resin contains ferrite as a magnetic powder to increase magnetic permeability. Powder is included, and silicone resin powder is also added to reduce the elastic modulus.
【００１２】この磁性封止樹脂２６中の熱硬化型樹脂と
しては、耐熱性に優れ、かつ、低溶融粘度のものを用い
ることが好ましい。また、熱硬化型樹脂としては、溶融
粘度が１５０℃で５０００ｃｐｓ以下のものを用いるこ
とが好ましい。これは、溶融粘度が低いほどモールドが
容易だからである。また、磁性封止樹脂２６中の磁性粉
末については、その粒径が数１０μｍ径程度のものを用
いることができるが、成形性を考慮した場合、１０μｍ
〜３０μｍの磁性粉末を用いることが好ましい。さらに
、シリコン樹脂の粉末としては、その粒径がたとえば１
０μｍ以下のものが好ましい。このようにシリコン樹脂
の粉末の粒径を小さくそろえれば、磁性封止樹脂２６に
おいて応力低下の効果が大きい。It is preferable to use a thermosetting resin in the magnetic sealing resin 26 that has excellent heat resistance and low melt viscosity. Further, as the thermosetting resin, it is preferable to use one having a melt viscosity of 5000 cps or less at 150°C. This is because the lower the melt viscosity, the easier it is to mold. Further, as for the magnetic powder in the magnetic sealing resin 26, particles having a particle size of about several tens of micrometers can be used, but when moldability is taken into account, it is 10 micrometers.
It is preferable to use magnetic powder of ~30 μm. Furthermore, the particle size of the silicone resin powder is, for example, 1
Preferably, the thickness is 0 μm or less. If the particle size of the silicone resin powder is made small in this way, the effect of reducing stress in the magnetic sealing resin 26 is large.
【００１３】なお、端子２２および２４は、コア１２の
下方で磁性封止樹脂２６の表面に沿って折り曲げられて
いる。Note that the terminals 22 and 24 are bent below the core 12 along the surface of the magnetic sealing resin 26.
【００１４】このチップ型コイル素子１０では、その磁
性封止樹脂２６中にシリコン樹脂の粉末が添加されてい
るので、シリコン樹脂の粉末を含まない磁性封止樹脂に
比べて、磁性封止樹脂２６の弾性率が小さくなり、磁性
封止樹脂２６を硬化するときにコア１２にかかる応力が
小さくなる。そのため、コア１２の最も強度の弱いつば
１６および１８にクラックが生じにくくなる。In this chip-type coil element 10, since silicone resin powder is added to the magnetic sealing resin 26, the magnetic sealing resin 26 is lower than that of a magnetic sealing resin that does not contain silicone resin powder. The elastic modulus of the core 12 becomes smaller, and the stress applied to the core 12 when the magnetic sealing resin 26 is cured becomes smaller. Therefore, cracks are less likely to occur in the flanges 16 and 18 of the core 12, which have the weakest strength.
【００１５】次に、このチップ型コイル素子１０の製造
方法の一例について説明する。まず、コイル２０を巻い
たコア１２を、図２に示すように、金属製の端子材３０
上に固定する。この場合、コア１２のつば１６を、端子
材３０の間隔を隔てて対向する２つの片３２および３４
上に固定する。なお、端子材３０の２つの片３２および
３４は、図２の１点鎖線Ａで示すそれらの根元部分で切
断されて、端子１６および１８として構成されるもので
ある。そして、端子材３０上に固定されたコア１２を、
図３に示す金型４０のキャビティ４２内に配置する。そ
の後、トランスファポット４４から溶融状態の磁性封止
樹脂２６を注入し、トランスファ・モールドを行い、コ
ア１２およびコイル２０の周囲を磁性封止樹脂２６で被
覆する。そして、図２の１点鎖線Ａに沿って端子材３０
を切断することによって２つの端子２２および２４を形
成し、それらの端子２２および２４をコア１２の下方で
折り曲げて、図１に示すチップ型コイル素子１０を得る
。Next, an example of a method for manufacturing the chip-type coil element 10 will be explained. First, as shown in FIG.
Fix it on top. In this case, the collar 16 of the core 12 is separated from the two pieces 32 and 34 facing each other with the terminal material 30 spaced apart.
Fix it on top. The two pieces 32 and 34 of the terminal material 30 are cut at their root portions indicated by the dashed line A in FIG. 2 to form the terminals 16 and 18. Then, the core 12 fixed on the terminal material 30 is
It is placed in a cavity 42 of a mold 40 shown in FIG. Thereafter, molten magnetic sealing resin 26 is injected from transfer pot 44 and transfer molding is performed to cover the core 12 and coil 20 with magnetic sealing resin 26 . Then, the terminal material 30 is
are cut to form two terminals 22 and 24, and these terminals 22 and 24 are bent below the core 12 to obtain the chip-type coil element 10 shown in FIG.
【００１６】上述の製造方法に従って、表１に示す各種
合成樹脂材を用いてトランスファ・モールドを行って、
実施例１〜３および比較例１〜３のチップ型コイル素子
を得た。なお、実施例１〜３と比べて、比較例１および
２ではシリコン粉末に代えてシリコンオイルを添加し、
比較例３ではシリコン樹脂の粉末もシリコンオイルも添
加していない。According to the above manufacturing method, transfer molding was performed using various synthetic resin materials shown in Table 1.
Chip-type coil elements of Examples 1 to 3 and Comparative Examples 1 to 3 were obtained. In addition, compared to Examples 1 to 3, in Comparative Examples 1 and 2, silicon oil was added instead of silicon powder,
In Comparative Example 3, neither silicone resin powder nor silicone oil was added.
【００１７】[0017]
【表１】[Table 1]
【００１８】このようにして得られた実施例１〜３およ
び比較例１〜３のチップ型コイル素子について、それぞ
れ、曲げ強度および曲げ弾性率を測定し、それらの測定
結果を表１に示した。The bending strength and bending elastic modulus of the chip-type coil elements of Examples 1 to 3 and Comparative Examples 1 to 3 thus obtained were measured, and the measurement results are shown in Table 1. .
【００１９】表１から明らかなように、実施例１〜３で
は、磁性封止樹脂にシリコン樹脂の粉末が添加されてい
るので、磁性封止樹脂の曲げ弾性率が小さい。そのため
、磁性封止樹脂からコアにかかる応力が小さい。また、
比較例１〜２では、磁性封止樹脂にシリコンオイルが添
加されているので、磁性封止樹脂の曲げ弾性率が小さく
、磁性封止樹脂からコアにかかる応力が小さい。一方、
比較例３では、磁性封止樹脂にシリコン樹脂の粉末ある
いはシリコンオイルが添加されていないので、磁性封止
樹脂の曲げ弾性率が大きく、磁性封止樹脂からコアにか
かる応力も大きい。As is clear from Table 1, in Examples 1 to 3, since silicone resin powder is added to the magnetic sealing resin, the bending elastic modulus of the magnetic sealing resin is small. Therefore, the stress applied to the core from the magnetic sealing resin is small. Also,
In Comparative Examples 1 and 2, since silicone oil is added to the magnetic sealing resin, the bending elastic modulus of the magnetic sealing resin is small, and the stress applied from the magnetic sealing resin to the core is small. on the other hand,
In Comparative Example 3, since no silicone resin powder or silicone oil is added to the magnetic sealing resin, the bending elastic modulus of the magnetic sealing resin is high, and the stress applied from the magnetic sealing resin to the core is also large.
【００２０】また、実施例１〜２および比較例１〜２か
ら明らかなように、シリコン樹脂の粉末あるいはシリコ
ンオイルの添加量が同じであれば、それらの曲げ弾性率
の違いは小さいが、曲げ強度は、シリコン樹脂の粉末を
添加した実施例１〜２の方が大きい。これは、磁性封止
樹脂の強度が同じであるならば、シリコン樹脂の粉末を
添加した実施例の方がシリコンオイルを添加した比較例
より小さい弾性率が得られることを示している。言い換
えると、シリコン樹脂の粉末が添加された磁性封止樹脂
は、シリコンオイルを添加した磁性封止樹脂に比べて、
同一強度の場合は、より弾性率が低くなることがわかる
。すなわち、磁性封止樹脂の強度を同じにすれば、シリ
コン樹脂の粉末を添加した磁性封止樹脂を用いたチップ
型コイル素子は、シリコンオイルを添加した磁性封止樹
脂を用いたチップ型コイル素子と比べて、そのコアにか
かる応力が小さく、コアの特につばにクラックが生じに
くい。Furthermore, as is clear from Examples 1 and 2 and Comparative Examples 1 and 2, if the amount of silicone resin powder or silicone oil added is the same, the difference in their flexural modulus is small; The strength is higher in Examples 1 and 2 in which silicone resin powder is added. This indicates that, if the strength of the magnetic sealing resin is the same, the example in which silicone resin powder is added has a smaller elastic modulus than the comparative example in which silicone oil is added. In other words, the magnetic sealing resin to which silicone resin powder is added is more effective than the magnetic sealing resin to which silicone oil is added.
It can be seen that for the same strength, the elastic modulus becomes lower. In other words, if the strength of the magnetic sealing resin is the same, a chip-type coil element using a magnetic sealing resin containing silicone resin powder will be different from a chip-type coil element using a magnetic sealing resin containing silicone oil. Compared to other materials, the stress applied to the core is small, and cracks are less likely to occur in the core, especially at the brim.
【００２１】また、実施例１〜３のように磁性封止樹脂
にシリコンオイルを添加しなければ、その表面にシリコ
ンオイルが浮き出ることもない。そのため、製品の信頼
性も低下しない。さらに、シリコン樹脂の粉末は、シリ
コンオイルのように浮き出ることがないので、磁性封止
樹脂中に多く添加することができる。また、シリコン樹
脂の粉末に表面処理を施せば、シリコン樹脂の粉末が磁
性封止樹脂中の熱硬化型樹脂と反応するため、磁性封止
樹脂中のシリコン樹脂の粉末の添加量を多くしても、磁
性封止樹脂の強度があまり低下しない。Furthermore, unless silicone oil is added to the magnetic sealing resin as in Examples 1 to 3, no silicone oil will come out on the surface of the magnetic sealing resin. Therefore, the reliability of the product does not deteriorate. Furthermore, since silicone resin powder does not stand out like silicone oil, a large amount can be added to the magnetic sealing resin. In addition, if surface treatment is applied to silicone resin powder, the silicone resin powder will react with the thermosetting resin in the magnetic sealing resin, so increase the amount of silicone resin powder added in the magnetic sealing resin. However, the strength of the magnetic sealing resin does not decrease much.
【図１】この発明の背景となり、かつ、この発明が適用
されるチップ型コイル素子の一例を示す断面図である。FIG. 1 is a cross-sectional view showing an example of a chip-type coil element that forms the background of the present invention and to which the present invention is applied.
【図２】図１に示すチップ型コイル素子を得るための一
過程を示し、端子材上にコイルの巻回されたコアが固定
された状態を示す斜視図である。FIG. 2 is a perspective view showing a process for obtaining the chip-type coil element shown in FIG. 1, and showing a state in which a core around which a coil is wound is fixed on a terminal material.
【図３】トランスファ・モールド工程を説明するための
断面図である。FIG. 3 is a cross-sectional view for explaining a transfer molding process.
１０ チップ型コイル素子 １２ コア １６，１８ つば ２０ コイル ２２，２４ 端子 ２６ 磁性封止樹脂 10 Chip type coil element 12 core 16,18 Tsuba 20 Coil 22, 24 terminal 26 Magnetic sealing resin
Claims (1)
性封止樹脂。1. A magnetic sealing resin to which silicone resin powder is added.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3140895A JPH04338613A (en) | 1991-05-15 | 1991-05-15 | Magnetic shielding resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3140895A JPH04338613A (en) | 1991-05-15 | 1991-05-15 | Magnetic shielding resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04338613A true JPH04338613A (en) | 1992-11-25 |
Family
ID=15279290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3140895A Pending JPH04338613A (en) | 1991-05-15 | 1991-05-15 | Magnetic shielding resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04338613A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2345801A (en) * | 1997-08-19 | 2000-07-19 | Taiyo Yuden Kk | Wire wound electronic component |
| US6198373B1 (en) | 1997-08-19 | 2001-03-06 | Taiyo Yuden Co., Ltd. | Wire wound electronic component |
| GB2361110A (en) * | 2000-04-03 | 2001-10-10 | Abb Ab | An induction device |
| JP2007227426A (en) * | 2006-02-21 | 2007-09-06 | Nec Tokin Corp | Magnetic admixture and inductor employing it |
| JP2008041691A (en) * | 2006-08-01 | 2008-02-21 | Nec Tokin Corp | Compound magnetic material and its manufacturing method |
| JP2009170488A (en) * | 2008-01-11 | 2009-07-30 | Yoshizumi Fukui | Method for manufacturing mold coil |
| JP2009228722A (en) * | 2008-03-21 | 2009-10-08 | Yokogawa Electric Corp | Electropneumatic conversion module and valve positioner having this electropneumatic conversion module |
| JP2010010544A (en) * | 2008-06-30 | 2010-01-14 | Yoshizumi Fukui | Method of manufacturing mold coil |
| JP2010118574A (en) * | 2008-11-14 | 2010-05-27 | Denso Corp | Reactor, and method of manufacturing the same |
| US8354910B2 (en) * | 2006-07-28 | 2013-01-15 | Samsung Electronics Co., Ltd. | Coil block and electronic device using the same |
| JP2021036013A (en) * | 2019-08-30 | 2021-03-04 | 住友ベークライト株式会社 | Resin composition and molded article |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54129357A (en) * | 1978-03-29 | 1979-10-06 | Tdk Electronics Co Ltd | Inductance element and method of producing same |
| JPS62192445A (en) * | 1986-02-18 | 1987-08-24 | Matsushita Electric Works Ltd | Epoxy resin molding material for sealing |
| JPH01150304A (en) * | 1987-12-07 | 1989-06-13 | Murata Mfg Co Ltd | Composite magnetic molding material |
-
1991
- 1991-05-15 JP JP3140895A patent/JPH04338613A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54129357A (en) * | 1978-03-29 | 1979-10-06 | Tdk Electronics Co Ltd | Inductance element and method of producing same |
| JPS62192445A (en) * | 1986-02-18 | 1987-08-24 | Matsushita Electric Works Ltd | Epoxy resin molding material for sealing |
| JPH01150304A (en) * | 1987-12-07 | 1989-06-13 | Murata Mfg Co Ltd | Composite magnetic molding material |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6198373B1 (en) | 1997-08-19 | 2001-03-06 | Taiyo Yuden Co., Ltd. | Wire wound electronic component |
| GB2329762B (en) * | 1997-08-19 | 2001-06-06 | Taiyo Yuden Kk | Wire wound electronic component |
| GB2345801B (en) * | 1997-08-19 | 2001-08-08 | Taiyo Yuden Kk | Wire wound electronic component |
| GB2345801A (en) * | 1997-08-19 | 2000-07-19 | Taiyo Yuden Kk | Wire wound electronic component |
| GB2361110A (en) * | 2000-04-03 | 2001-10-10 | Abb Ab | An induction device |
| JP2007227426A (en) * | 2006-02-21 | 2007-09-06 | Nec Tokin Corp | Magnetic admixture and inductor employing it |
| US8354910B2 (en) * | 2006-07-28 | 2013-01-15 | Samsung Electronics Co., Ltd. | Coil block and electronic device using the same |
| JP4646238B2 (en) * | 2006-08-01 | 2011-03-09 | Ｎｅｃトーキン株式会社 | Composite magnetic material and method for producing composite magnetic material |
| JP2008041691A (en) * | 2006-08-01 | 2008-02-21 | Nec Tokin Corp | Compound magnetic material and its manufacturing method |
| JP2009170488A (en) * | 2008-01-11 | 2009-07-30 | Yoshizumi Fukui | Method for manufacturing mold coil |
| JP4730847B2 (en) * | 2008-01-11 | 2011-07-20 | 義純 福井 | Molded coil manufacturing method |
| JP2009228722A (en) * | 2008-03-21 | 2009-10-08 | Yokogawa Electric Corp | Electropneumatic conversion module and valve positioner having this electropneumatic conversion module |
| JP4718583B2 (en) * | 2008-06-30 | 2011-07-06 | 義純 福井 | Molded coil manufacturing method |
| JP2010010544A (en) * | 2008-06-30 | 2010-01-14 | Yoshizumi Fukui | Method of manufacturing mold coil |
| JP2010118574A (en) * | 2008-11-14 | 2010-05-27 | Denso Corp | Reactor, and method of manufacturing the same |
| JP2021036013A (en) * | 2019-08-30 | 2021-03-04 | 住友ベークライト株式会社 | Resin composition and molded article |
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