JPS6260245A - Semiconductor device - Google Patents

Abstract

PURPOSE:To protect a device from warpage by a method wherein linear protrusions are provided on the primary surface or both surfaces of the device. CONSTITUTION:Beam-shaped protrusions are built of resin on the primary surface or both surfaces of a semiconductor device to be sealed in resin. A protuberance at the central portion of the primary surface serves as a marking and, at the same time, equips the portion for a semiconductor chip with a greater thickness. In a device designed as such, tension works on both sides of the chip during the process of hardening and shrinking of the molding material, decreasing the warpage the semiconductor device itself may be subjected to because of the difference in quantity of resin on both sides of the chip. This adds to mechanical strength and stabilized the mechanical characteristics of the semiconductor device.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement in a semiconductor device sealed with resin (hereinafter referred to as a mold).

[Conventional technology]

Conventionally, a semiconductor device to be molded has had both its main surface and both surfaces flat. (Figure 2) [Problems to be Solved by the Invention] With the conventional technology, in a molded semiconductor device, tension acts on both sides of the chip due to curing and shrinkage of the molding material, and due to the difference in the amount of resin on both sides of the chip, Warpage often occurred in the semiconductor device itself (Fig. 5).

Such warpage applies stress to the semiconductor chip itself, resulting in peeling of the bonding portion and mechanical damage to the surface of the semiconductor chip, resulting in reduced long-term reliability or cracking of the semiconductor chip.

[Means for solving the problem]

In order to solve the above problem, the present invention provides a beam-shaped convex portion on one or both sides of a molded semiconductor device to increase the mechanical strength of the molding material (FIG. 1).

〔Example〕

As shown in Figure 1, by providing a beam-shaped convex portion on the main surface or both surfaces of the resin of a semiconductor device to be resin-sealed, the stress generated when the resin shrinks and hardens is absorbed and the warpage (distortion) of the semiconductor device is prevented. Reduced mechanical strength and stabilized properties.

In Figure 1, the center of the main surface is a convex part, which makes it possible to mark the semiconductor device, and also increases the thickness of the resin in the semiconductor chip area, contributing to improved reliability. can do.

In Fig. 1, the convex portion is provided only on the main surface, but it is possible to provide the convex portion on both sides, and the shape of the convex portion may be any shape that can achieve the above object. [Effects of the Invention] The present invention In the invention, since the beam-shaped convex portion is provided, tension is exerted on both sides of the chip due to curing and shrinkage of the molding material, which reduces the occurrence of warpage in the semiconductor device itself due to the difference in the amount of resin on both sides of the chip, and improves mechanical stability. This has the effect of stabilizing strength and properties.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a semiconductor device having a beam-like convex portion on its main surface according to the present invention. FIG. 2 is a perspective view of a conventional semiconductor device. FIG. 3 is a perspective view of a conventional semiconductor device in which J#6 occurs. that's all

Claims (1)

[Claims] A semiconductor device of the resin-sealed type that has a beam-shaped convex portion on its main surface or both surfaces.