JPH05190763A - Sealed component - Google Patents

Abstract

PURPOSE:To provide a sealed component having a structure wherein, even when the size of a substrate is irregular, no burr is produced on an external electrode when the substrate is sealed with a resin. CONSTITUTION:Circuits are formed on a substrate 16. External electrodes 20 are formed on the edge of the substrate 16 in such a way that they are connected to the circuits. In addition, s sealing resin 14 is formed on the substrate 16 in such a way that the circuits are covered with it. The size of the sealing resin 14 is formed to be smaller than the size of the substrate 16.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing component, and more particularly, for example, a sealing component such as a resin-sealed composite component in which each element is mounted on a multilayer substrate having external electrodes to form a circuit. Regarding

[0002]

2. Description of the Related Art For example, hybrid ICs include those using a lead frame and chips. In particular, in recent years, a chip-type composite component in which each element is mounted on a multi-layer substrate has been required for the purpose of multifunctionalization and surface mounting in response to a demand for high-density mounting. In such a composite component, it is necessary to seal each element from the outside in order to protect the circuit. As a method of sealing the circuit formed on the multilayer substrate, there is a method of covering with a cap of alumina or metal. However, the method of covering with a cap of alumina or metal results in high cost. Therefore, a method of encapsulating the circuit on the multilayer substrate by inexpensive resin encapsulation can be considered.

FIG. 5 is a perspective view showing a composite component.
The composite component 1 includes a substrate 2. The substrate 2 is made of an insulating material such as ceramic. For example, four elements 3 are mounted on the substrate 2, and these elements 3 form a circuit 4. Furthermore, on the end surface of the substrate 2, for example, eight external electrodes 5 are formed so as to be connected to the circuit 4. The substrate 2 on which the circuit 4 is formed is put into a mold, and the circuit 4 is sealed by injecting and curing resin in the mold. In this way, as shown in FIG. 6, the sealing component 7 in which the circuit 4 is resin-sealed with the sealing resin 6 is formed.

[0004]

However, the ceramic used for the multilayer substrate has a property of shrinking during sintering, and the width dimension tolerance between the multilayer substrates is large. Therefore,
When the dimension of the multilayer substrate is smaller than the inner dimension of the mold, a gap is created between the multilayer substrate and the mold. In such a case, the resin enters the gap, and burrs are generated on the external electrodes.

Therefore, the main object of the present invention is to provide a resin-sealed resin, even if the dimensions of the substrate vary.
It is an object of the present invention to provide a sealing component having a structure in which burrs do not occur on external electrodes.

[0006]

According to the present invention, a substrate, a circuit formed on the substrate, external electrodes connected to the circuit and formed on an end surface of the substrate, and a circuit formed on the substrate so as to cover the circuit. In the sealing component including the sealing resin to be formed, the dimension of the sealing resin is smaller than that of the substrate.

[0007]

In order to make the size of the sealing resin smaller than the size of the substrate, the inner size of the mold at the portion where the resin is injected is designed to be smaller than the size of the substrate. Therefore, even if the substrate becomes smaller than the inner size of the mold in which the substrate is placed, the resin does not enter the end face portion of the substrate.

[0008]

According to the present invention, burrs do not occur on the external electrodes even when the composite component having the elements mounted on the multilayer substrate is resin-sealed.

The above-mentioned objects, other objects, features and advantages of the present invention will become more apparent from the following detailed description of embodiments with reference to the drawings.

[0010]

1 is a perspective view showing an embodiment of the present invention. The sealing component 10 is formed by resin-sealing the composite component 12 shown in FIG. 2 with the sealing resin 14. The composite component 12 includes a substrate 16. As the substrate 16, for example, a multilayer substrate made of ceramic or the like is used. This board 16
For example, four elements 18 are mounted on the top. A circuit 19 is formed by these elements 18. Board 16
Eight external electrodes 20, for example, are provided on opposite end surfaces of
It is formed so as to be connected to the circuit 19.

That is, the circuit 19 of the composite component 12 is resin-sealed with the sealing resin 14 to form the circuit 19.
Protect. Next, a method of resin-sealing the composite component 12 with the sealing resin 14 to form the sealing component 10 will be described.

First, as shown in FIG. 3, a lower mold 22 and an upper mold 24 for resin sealing are prepared. The lower die 22 has a first recess 26, and the composite part 1 is placed in the first recess 26.
The second board 16 is accommodated. The upper mold 24 is the second recess 28
And the size of the second recess 28 is smaller than that of the substrate 16. This upper mold 24 is the lower mold 2
2 is placed on. At this time, the second recess 2 of the upper mold 24
Since 8 is formed smaller than the size of the substrate 16,
A space 30 is formed between the substrate 16 and the upper mold 24.

Next, resin is injected into the space 30 and cured. At this time, resin cutting is performed between the substrate 16 and the upper mold 24. That is, the size of the sealing resin 14 formed by the size of the second recess 28 is set. Since the second recess 28 of the upper mold 24 is formed to have a size smaller than that of the substrate 16, the sealing resin 14 is formed.
Is formed smaller than the size of the substrate 16. Therefore, the sealing resin 14 does not cause burrs on the external electrodes 20.

FIG. 4 is a perspective view showing another embodiment of the present invention. In this embodiment, a silicon rubber film 32 having elasticity is printed especially on the substrate 16 at the contact portion between the substrate 16 and the upper mold 24. As a result, the substrate 1
Even if the upper surface of 6 becomes lower than the upper surface of the lower mold 22, the substrate 1
6, the space 30 is formed between the second recess 28 and the silicon rubber film 32, and the resin does not go around the end face portion of the substrate 16. Therefore, burrs do not occur on the external electrodes 20. Further, when the upper surface of the substrate 16 is higher than the upper surface of the lower mold 22, the upper mold 24 is placed on the elastic silicon rubber film 32, so that the pressure of the upper mold 24 is absorbed by the silicon rubber film 32. It Therefore, the substrate 16 at the time of molding
Can be prevented from cracking. By forming the silicon rubber film 32 in this way, it is possible to absorb variations in the thickness of the substrate 16.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a perspective view showing a composite component.

FIG. 3 is a schematic cross-sectional view showing a process of forming a sealing resin on a composite component.

FIG. 4 is a perspective view showing another embodiment of the present invention.

FIG. 5 is a perspective view showing a composite component.

FIG. 6 is a perspective view showing a conventional sealing component.

[Explanation of symbols]

 10 Sealing Parts 14 Sealing Resin 16 Substrate 19 Circuit 20 External Electrode

Claims (1)

[Claims] 1. A substrate, a circuit formed on the substrate, an external electrode connected to the circuit and formed on an end surface of the substrate, and a seal formed on the substrate so as to cover the circuit. A sealing component including a resin, wherein the dimension of the sealing resin is smaller than the dimension of the substrate.