JPH02124927A - Epoxy resin molding material - Google Patents
Epoxy resin molding materialInfo
- Publication number
- JPH02124927A JPH02124927A JP27796288A JP27796288A JPH02124927A JP H02124927 A JPH02124927 A JP H02124927A JP 27796288 A JP27796288 A JP 27796288A JP 27796288 A JP27796288 A JP 27796288A JP H02124927 A JPH02124927 A JP H02124927A
- Authority
- JP
- Japan
- Prior art keywords
- curing
- epoxy resin
- molding material
- agent
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 20
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 20
- 239000012778 molding material Substances 0.000 title claims abstract description 16
- 239000000945 filler Substances 0.000 claims abstract description 15
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 7
- 239000000654 additive Substances 0.000 claims abstract description 4
- 239000007822 coupling agent Substances 0.000 claims abstract description 3
- 239000003086 colorant Substances 0.000 claims description 2
- -1 curing accelerators Substances 0.000 claims 1
- 239000006082 mold release agent Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 8
- 239000011347 resin Substances 0.000 abstract description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 4
- 238000007789 sealing Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 229920000768 polyamine Polymers 0.000 abstract description 2
- 239000000377 silicon dioxide Substances 0.000 abstract description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 abstract 2
- 238000004040 coloring Methods 0.000 abstract 1
- 238000002156 mixing Methods 0.000 description 4
- 239000000835 fiber Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000012765 fibrous filler Substances 0.000 description 1
- 239000006261 foam material Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Details Of Resistors (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電気部品や電子部品を封止する樹脂モールド品
に主として用いられるエポキシ樹脂成形材料に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an epoxy resin molding material mainly used for resin molded products for sealing electrical and electronic components.
近年、電気、電子機器の高性能化、ｇ！ｉｍ性、生産性
向上のため、プラスチックによる封止がなされるように
なってきた。これらの封止用成形材料としてはエポキシ
樹脂にクリ力等の粉末状無機質充填剤を含有させたもの
が一般に用いられて匹る。In recent years, the performance of electrical and electronic equipment has improved, and g! In order to improve immovability and productivity, plastic sealing has come to be used. As these molding materials for sealing, epoxy resins containing powdered inorganic fillers such as Kuriku are generally used.
最近のデバイスのパッケージ形態は、従来のＤＩＦ型か
ら高密度実装をするためにＳＯＰ、ＱＦＰ等の表面実装
対応パッケージの比率が増加してｈる。表面実装対応で
問題になってくるのは、バッグージ全体が直接に半田等
の高熱に暴露されることで、このような熱Ｖ、ラック後
耐湿性低下が大きな問題になってくる。更に表面実装対
応パッケージは従来パッケージより肉厚が薄く、リード
間のビンピッチも従来の１００ミルから５０〜７５ミル
と狭くなってきておシ機械強変が低下しているので、組
立加工時の外力応力により密着性（ペレットと封止材、
リードと封止材の界面）が低下するため耐湿性が低下す
るという問題も発生している。In recent device packaging formats, the proportion of surface-mountable packages such as SOP and QFP has increased from the conventional DIF type to enable high-density packaging. The problem with surface mounting is that the entire baggage is directly exposed to the high heat of soldering, etc., and such heat V and deterioration of moisture resistance after racking become major problems. Furthermore, surface mount compatible packages have thinner wall thickness than conventional packages, and the pitch between the leads has narrowed from 100 mils to 50 to 75 mils, reducing mechanical strength and reducing external forces during assembly. Adhesion due to stress (pellet and sealing material,
Another problem has arisen in that moisture resistance is reduced due to a decrease in the interface between the lead and the encapsulant.
本発明は従来の技術における上述の問題点に鑑みてなさ
れたもので、その目的とするところは、後加工時に発生
する外的応力を低減すると共に、密着性を向上し、耐湿
性の優れたエポキシｔＭ脂吠形材料を提供することにあ
る。The present invention was made in view of the above-mentioned problems in the conventional technology, and its purpose is to reduce the external stress generated during post-processing, improve adhesion, and provide a material with excellent moisture resistance. An object of the present invention is to provide an epoxy tM foam material.
本発明はエポキシ樹脂に対し必要に応じて架橋剤、硬化
剤、硬化促進剤、充填剤、雌型剤、着色剤、カップリン
グ剤等の添加剤を添加してなるエポキシ樹脂成形材料に
おいて、充填剤表面を硬化成分で表面処理してから添加
したことを特徴とするエポキシ樹脂成形材料のため、成
形材料組成の大半を占める充填剤と樹脂分との濡れが向
上し樹脂分と充填割分との結合が大となシ成形品として
の耐湿性を向上させることができたもので、以下本発明
の詳細な説明する。The present invention provides an epoxy resin molding material in which additives such as a crosslinking agent, a curing agent, a curing accelerator, a filler, a molding agent, a coloring agent, and a coupling agent are added to an epoxy resin as necessary. Since this is an epoxy resin molding material that is added after the surface of the agent has been treated with a curing component, the wetting of the filler and resin component, which makes up the majority of the molding material composition, is improved, and the resin component and filler fraction are improved. The present invention will be described in detail below.
本発明に用いるエポキシ樹脂としては１分子中に２個以
上のエポキシ基を有する硬化可能なエポキシ樹脂である
ならばビスフェノールム型エポキシ樹脂、ノボフック型
エボキＶ樹脂、可撓性エポキシ樹脂、ハロゲン化エポキ
シ樹脂、グリｖａ）／Ｌ／エステル型エポキシ樹脂、高
分子型エポキシ樹脂各れでもよく特に限定するものでは
ない。架橋剤としてはフェノール樹脂、メラミン樹脂、
アクリル樹脂、エリア樹脂、イソシアネート等が用いら
れ、特に限定するものではない。硬化剤としてはｆｌｌ
ｌｌｆｆ族ポリアミン、ポリアミド樹脂、芳香族シアミ
ン等のアミン系硬化剤、酸無水物硬化剤、ルイス酸錯化
合物等が用いられ、特に限定するものではない。硬化促
進剤としてはリン系及び又は３級アミン系硬化促進剤を
用いることが必要である。The epoxy resin used in the present invention is a curable epoxy resin having two or more epoxy groups in one molecule, such as bisphenol type epoxy resin, Novohook type EBOKI V resin, flexible epoxy resin, and halogenated epoxy resin. The resin, green va)/L/ester type epoxy resin, or polymer type epoxy resin may be used, and is not particularly limited. As a crosslinking agent, phenol resin, melamine resin,
Acrylic resin, area resin, isocyanate, etc. are used, and there are no particular limitations. flll as a hardening agent
Used are llff group polyamines, polyamide resins, amine curing agents such as aromatic cyamine, acid anhydride curing agents, Lewis acid complex compounds, etc., and are not particularly limited. As the curing accelerator, it is necessary to use a phosphorus-based and/or tertiary amine-based curing accelerator.
充填剤としては炭酸カルシウム、シリカ、アルミナ、水
酸化アルミニウム、クレー、タルク、がフス粉、ミ酸化
アンチモン、酸化チタン等の無機粉末充填剤やガラス繊
維、アスベスト繊維、パルプ繊維、合成繊維、セラミッ
クファイバー等の繊維質充填剤を単独或は併用するもの
であるが、充填剤表面を架橋剤、硬化剤、硬化促進剤等
の硬化成分のうちの１つ又は必要に応じ２つ又は全てを
用いて表面処理してから用いることが必要である。Fillers include inorganic powder fillers such as calcium carbonate, silica, alumina, aluminum hydroxide, clay, talc, fufu powder, antimony oxide, and titanium oxide, as well as glass fibers, asbestos fibers, pulp fibers, synthetic fibers, and ceramic fibers. These fibrous fillers are used alone or in combination, but the surface of the filler is cured by using one or, if necessary, two or all of the curing components such as a crosslinking agent, a curing agent, and a curing accelerator. It is necessary to use it after surface treatment.
表面処理は硬化成分をそのまま或は必要に応じて溶媒で
希釈してから充填剤中にスプレーしたシして用いるもの
で表面処理方法については通常用いられる方法をそのｉ
ま用いることができ、特に限定するものではない。充填
剤に対する硬化成分の添加量は充填剤１００重量部（以
下単に部と記す］に対しｌ−ω部が好ましい。即ち１部
未満では濡れが向上し難く、ω部をこえると分散性が低
下する煩向にあるからである。離型剤、ｉｎ色剤、カッ
プリング剤等の添加剤については通常用いられているも
のをそのまま用いることができるので特に限定するもの
ではない。かくして上記材料を混合、混線、粉砕し更に
必要に応じて造粒して成形材料ｔ−得るものである。更
に該成形材料の成形については、トランスファー成形、
射出成形等によるトフンジスター ダイオード、コンデ
ンサー フィμター、整流器、抵抗体、コイρ等の電子
部品の多数個取り成形に適することは勿論、圧縮成形等
にも適用できるものである。For surface treatment, the curing component is used as it is or after diluting it with a solvent as necessary and then sprayed onto the filler.The surface treatment method is as follows:
However, it is not particularly limited. The amount of the curing component added to the filler is preferably 1-ω parts per 100 parts by weight of the filler (hereinafter simply referred to as parts).In other words, if it is less than 1 part, it is difficult to improve wetting, and if it exceeds ω parts, the dispersibility decreases. This is because there is a tendency to The molding material is obtained by mixing, mixing, pulverizing, and granulating if necessary.Moreover, the molding material can be molded by transfer molding,
Not only is it suitable for multi-piece molding of electronic components such as diodes, capacitors, rectifiers, resistors, and coil coils by injection molding, but it can also be applied to compression molding.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例及び比較例
第１表の配合表に従って材料を配合、混合、混練してエ
ポキシ樹脂成形材料を得るが、実施例については充填剤
を予じめ架橋剤で表面処理しておいてから用いた。次に
該成形材料をトランスファー成形機を用いて金型温度１
７５℃、成形圧力５０も、硬化時間３分間でハイブリッ
ドＩＣを封止成形した。EXAMPLES AND COMPARATIVE EXAMPLES Epoxy resin molding materials are obtained by blending, mixing, and kneading the materials according to the formulation table in Table 1. In the examples, the fillers were surface-treated with a crosslinking agent in advance before use. there was. Next, the molding material is transferred to a mold temperature of 1 using a transfer molding machine.
The hybrid IC was also sealed and molded at 75° C. and a molding pressure of 50 with a curing time of 3 minutes.
第 １ 表
部
注
４ｋＬ エポキシ当ｊ１２２０．軟化点８０″Ｃのエポ
キシ樹脂。1st table note 4kL epoxy J1220. Epoxy resin with a softening point of 80″C.
秦２ 水酸基当量１０４、軟化点８７℃のフェノ−１％
／樹脂。Hata 2 Hydroxyl equivalent: 104, softening point: 87℃ pheno-1%
/resin.
５Ｉ！施例社与辛４と比較例の成形品耐湿性は第２表の
ようである。5I! The moisture resistance of the molded products of Examplesha Yoshin 4 and Comparative Example is as shown in Table 2.
第
表
注
齋 封止品と３００°Ｃで１０秒間半田′Ｉ！Ｍ理後、
ＰＣＴ試涜で１５１’Ｃ，１００％湿度内でアルミニウ
ム線のｊ４蝕する迄の時［川をみた。Notes to the table: Solder the sealed product at 300°C for 10 seconds! After M.
During the PCT test, the aluminum wire was eroded at 151'C and 100% humidity [I looked at the river].
本発明は上述した如く構成されている。特許請求の範囲
第１項に記載した構成を有するエポキシ樹脂成形材料に
おいては＃４湿性が向上する効果を有している。The present invention is constructed as described above. The epoxy resin molding material having the structure described in claim 1 has the effect of improving #4 wettability.
Claims (1)
、硬化促進剤、充填剤、離型剤、着色剤、カップリング
剤等の添加剤を添加してなるエポキシ樹脂成形材料にお
いて、充填剤表面を硬化成分で表面処理してから添加し
たことを特徴とするエポキシ樹脂成形材料。(1) In epoxy resin molding materials, additives such as crosslinking agents, curing agents, curing accelerators, fillers, mold release agents, coloring agents, coupling agents, etc. are added to epoxy resin as necessary. An epoxy resin molding material that is added after the surface of the agent has been treated with a curing component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27796288A JPH02124927A (en) | 1988-11-02 | 1988-11-02 | Epoxy resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27796288A JPH02124927A (en) | 1988-11-02 | 1988-11-02 | Epoxy resin molding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02124927A true JPH02124927A (en) | 1990-05-14 |
Family
ID=17590702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27796288A Pending JPH02124927A (en) | 1988-11-02 | 1988-11-02 | Epoxy resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02124927A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02133423A (en) * | 1988-11-15 | 1990-05-22 | Ube Ind Ltd | Epoxy resin composition |
| JPH04298067A (en) * | 1991-03-27 | 1992-10-21 | Nippondenso Co Ltd | Resin-sealed semiconductor device |
-
1988
- 1988-11-02 JP JP27796288A patent/JPH02124927A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02133423A (en) * | 1988-11-15 | 1990-05-22 | Ube Ind Ltd | Epoxy resin composition |
| JPH04298067A (en) * | 1991-03-27 | 1992-10-21 | Nippondenso Co Ltd | Resin-sealed semiconductor device |
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