JPH01185321A - Epoxy resin molding material - Google Patents

Abstract

PURPOSE:To obtain the title material excellent in humidity resistance, adhesion, etc., by mixing an epoxy resin with a specified ceramic fiber and, optionally, a crosslinking agent, a curing agent, a cure accelerator, etc. CONSTITUTION:A filler (B) is obtained by surface-treating a ceramic fiber (a) of a diameter of 1-10mu and a length of 10-150mu with a silane coupling agent (b). A curable epoxy resin (A) having at least two epoxy groups in the molecule is mixed with component B and, optionally, a crosslinking agent, a curing agent, a cure accelerator, a mold release, a colorant, a filler other than component B, etc.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an epoxy resin molding material mainly used for resin molded products for sealing electrical and electronic components.

[Conventional technology]

In recent years, in order to improve the performance, reliability, and productivity of electric and electronic equipment, plastic sealing has been used. As these molding materials for sealing, epoxy resins containing powdered inorganic fillers such as silica are generally used.

[Problem that the invention seeks to solve]

In recent device packaging formats, the proportion of surface-mountable packages such as SOP and QFP is increasing from the conventional DIP type to enable high-density mounting. The problem with surface mounting is that the entire package is directly exposed to the high heat of soldering, etc., and the drop in moisture resistance after such heat shock becomes a major problem. Furthermore, surface mount compatible packages have thinner walls than conventional packages, and the pitch between the leads has narrowed from the conventional 100 mils to 50-75 mils, reducing mechanical strength and reducing external stress during assembly. Adhesion (belt and sealing material,
Another problem has arisen in that moisture resistance is reduced due to a decrease in the interface between the lead and the encapsulant.

The present invention was made in view of the above-mentioned problems in the conventional technology, and its purpose is to reduce the external stress generated during post-processing, improve adhesion, and provide a material with excellent moisture resistance. Our objective is to provide epoxy resin molding materials.

Means for Solving Problem C] The present invention provides an epoxy resin with a crosslinking agent, a curing agent, a curing accelerator, a mold release agent, a coloring agent, a coupling agent,
In epoxy resin molding materials containing additives such as fillers, the surface of ceramic fibers with a diameter of 1 to 10 microns and a length of 10 to 150 microns is treated with a silane coupling agent. The above object has been achieved because of the characteristic epoxy resin molding material, and the present invention will be described in detail below.

The epoxy resin used in the present invention is a curable epoxy resin having two or more epoxy groups in one molecule, such as bisphenol A type epoxy resin, Nopowoc type epoxy resin, flexible epoxy resin, and halogenated epoxy resin. , a glycidyl ester type epoxy resin, or a polymer type epoxy resin, without any particular limitation.

As the crosslinking agent, phenol resin, melamine resin, acrylic resin, urea resin, isocyanate, etc. are used, and there are no particular limitations. As the curing agent, amine curing agents such as aliphatic polyamines, polyamide resins, aromatic diamines, acid anhydride curing agents, Lewis acid complex compounds, etc. can be used, and there are no particular limitations. As the curing accelerator, it is necessary to use a phosphorus-based and/or tertiary amine-based curing accelerator.

It is necessary to contain cefmic fiber as a filler, but if necessary, other glass N & fibers,
Fibrous fillers such as asbestos R fibers and pulp fibers and inorganic fillers such as silica, antimony trioxide, calcium carbonate, silica, talc, glass powder, and aluminum hydrate may be used in combination. The ceramic eyeper needs to have a diameter of 1 to 10 microns and a length of 10 to 150 microns. That is, if the diameter is less than 1 micron and the length is less than 10 microns, it is difficult to improve mechanical strength, and if the diameter exceeds 10 microns and the length is more than 150 microns, filling properties and moldability tend to decrease. Furthermore, it is often necessary to coat the surface of the cefmic fiber with a silane coupling agent in order to further improve dispersibility.

Furthermore, the amount of ceramic fiber is 100 parts by weight of silica.
The amount is preferably 5 to (equity) parts. That is, if the amount is less than 5 parts, the mechanical strength will not improve, and if it exceeds the critical point, the filling properties and moldability will tend to decrease.

Mold release agent, coloring agent, coupling agent and even triphenyl/+
/Phosphine and the like are not particularly limited, as commonly used ones can be used as they are. In this way, the above materials are mixed, kneaded, pulverized, and further granulated if necessary to obtain a molding material. Furthermore, regarding the molding of the molding material, transistors, diodes, capacitors, etc. by transfer molding, injection molding, etc.
It is suitable not only for molding large numbers of electronic components such as filters, rectifiers, resistors, and coils, but also for compression molding.

Examples 1 to 3 and comparative examples The present invention will be explained below based on examples.

! Compound, mix, and knead the materials according to the recipe in Table M1 to obtain an epoxy resin molding material, and seal and mold a hybrid IC using a transfer molding machine at a mold temperature of 175°C, molding pressure of 50-1, and curing time of 3 minutes. did.

Table 1 Note 411 Epoxy resin with an epoxy equivalent of 220 and a softening point of 80°C.

Rice 2 A phenolic resin with a hydroxyl equivalent of 104 and a softening point of 87°C.

In Examples 1 to 3, the surface of the ceramic fiber was treated with an aminosilane thread coupling agent before use.

Table 2 Note: After soldering the sealed product at 300"C for 10 seconds, PCT
In the test, the time required for aluminum wire to corrode at 151°C and Zoo% humidity was measured.

〔Effect of the invention〕

The present invention is constructed as described above. The epoxy resin molding material having the structure described in claim 1 has the effect of improving moisture resistance.

Furthermore, the epoxy resin molding material having the structure described in claim 2 has the effect of significantly improving moisture resistance.

Claims (1)

[Claims] (1) In an epoxy resin molding material made by adding additives such as a crosslinking agent, a curing agent, a curing accelerator, a mold release agent, a coloring agent, a coupling agent, and a filler to an epoxy resin as necessary, An epoxy resin molding material containing ceramic fibers having a diameter of 1 to 10 microns and a length of 10 to 150 microns after surface treatment with a silane coupling agent. (2) The epoxy resin molding material according to claim 1, wherein the amount of ceramic fiber is 5 to 50 parts by weight based on 100 parts by weight of silica.