JPH02124925A - Epoxy resin molding material - Google Patents
Epoxy resin molding materialInfo
- Publication number
- JPH02124925A JPH02124925A JP27796088A JP27796088A JPH02124925A JP H02124925 A JPH02124925 A JP H02124925A JP 27796088 A JP27796088 A JP 27796088A JP 27796088 A JP27796088 A JP 27796088A JP H02124925 A JPH02124925 A JP H02124925A
- Authority
- JP
- Japan
- Prior art keywords
- filler
- molding material
- epoxy resin
- agent
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 18
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 18
- 239000012778 molding material Substances 0.000 title claims abstract description 17
- 239000000945 filler Substances 0.000 claims abstract description 16
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- 239000000654 additive Substances 0.000 claims abstract description 6
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 4
- 239000003086 colorant Substances 0.000 claims description 3
- 239000006082 mold release agent Substances 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 239000006087 Silane Coupling Agent Substances 0.000 claims 1
- -1 curing accelerator Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 9
- 239000011347 resin Substances 0.000 abstract description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 6
- 239000007822 coupling agent Substances 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 3
- 239000000377 silicon dioxide Substances 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 2
- 238000004040 coloring Methods 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 description 4
- 239000000835 fiber Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical group 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006355 external stress Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000012765 fibrous filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N phosphoric acid Substances OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Details Of Resistors (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電気部品や電子部品を封止する樹脂モールド品
に主として用いられるエポキシ樹脂成形材料に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an epoxy resin molding material mainly used for resin molded products for sealing electrical and electronic components.
近年、電気、電子機器の高性能化、昼信頼性、生産性向
上のため、プラスチラフによる封止がなされるようにな
ってきた。これらの封土用成形材株としてはエポキシ樹
脂にシ１１力等の粉末状無機質充填剤を含有させたもの
が一般に用いられている。In recent years, in order to improve the performance, daytime reliability, and productivity of electrical and electronic equipment, sealing with plasticaf has come to be used. As the molding materials for these earthen fiefs, epoxy resins containing powdered inorganic fillers such as silica are generally used.
最近のデバイスのバーＩケージ形態は、従来のＤＩＰ型
から高密度実装をするためにＳＯＰ、ＱＦＰ等の表面実
装対応パッケージの比率が増加してｂる。表面実装対応
で問題になってくるのは、パッケージ全体が直接に半田
等の高熱に暑露されることで、このような熱シ曹ツク後
の耐湿性低下が大きな問題になってくる。更に表面実装
対応パッケージは従来バタケージより肉厚が薄く、リー
ド間のビンビ９チも従来の１００ミルから５０＾７５ミ
ルと狭くなりできており機械強度が低下しているので、
組立加工時の外力応力により密宕性（ベレツトと封止材
、１１−ドと封止材の界面）が低下するため耐湿性が低
下するとｂう問題も発生じている。Recently, the I-cage type of devices has changed from the conventional DIP type to an increasing proportion of surface-mountable packages such as SOP and QFP for high-density mounting. The problem with surface mounting is that the entire package is directly exposed to the high heat of soldering, etc., and the drop in moisture resistance after such heat exposure becomes a major problem. Furthermore, the surface mount compatible package is thinner than the conventional Batacage, and the width between the leads has been narrowed from 100 mils to 50^75 mils, reducing mechanical strength.
A problem has also arisen in which the moisture resistance is reduced because the tightness (at the interface between the beret and the sealing material, the interface between the beret and the sealing material) is reduced due to external stress during assembly.
本発明は従来の技術における上述の問題点に鑑みてなさ
れたもので、その目的とするところは、後加工時に発生
ゴる外的応力を低減すると共に、密着性を向上し、耐湿
性の優れたエポキシ樹脂成形材料を提供することにある
。The present invention was made in view of the above-mentioned problems in the conventional technology, and its purpose is to reduce the external stress generated during post-processing, improve adhesion, and provide excellent moisture resistance. The purpose of the present invention is to provide an epoxy resin molding material that has the same properties as described above.
本発明はエポキシ樹脂に対し必要に応じて架橋剤、硬化
剤、硬化促進剤、充填剤、離型剤、着色剤等の添加剤を
添加してなるエポキシ樹脂成形材料におりで、充填提表
面をエポキシシラン系力９プリング剤で表面処理してか
ら添加したことを特徴とするエポキシ樹脂成形材料のた
め、成形材料組成の大半を占める充填剤と樹脂分との濡
れが向上し樹脂分と充填割分との結合が大となり成形品
としての耐湿性を向上させることができたもので、以下
３本発明の詳細な説明する。The present invention is an epoxy resin molding material prepared by adding additives such as a crosslinking agent, a curing agent, a curing accelerator, a filler, a mold release agent, and a coloring agent to an epoxy resin as necessary. This is an epoxy resin molding material that is added after surface treatment with an epoxy silane-based pulling agent, which improves wetting between the filler and resin component, which makes up the majority of the molding material composition, and improves the wetting of the resin component with the resin component. The bonding with the split portions is increased, and the moisture resistance of the molded product can be improved.Three of the present inventions will be described in detail below.
本発明に用するエポキシ樹脂としては１分子中に２個以
上のエポキシ基を有する硬化可能なエポキシ樹脂である
ならばビスフェノールＡ型エポキシ樹脂、ノボラリク型
エポキシ樹脂、可撓性エポキシ樹脂、ハロゲン化エポキ
シ樹脂、グー１シジルエステル型エボキＶ樹脂、高分子
型エポキシ４１脂各れでもよく特に限定するものではな
い。架橋剤トシてはフェノール樹脂、メラミン樹脂、ア
クリル樹脂、ユ１１ア樹脂、イソシアネート等が用いら
れ、特に限定するものではなり、硬化剤としては脂肪族
ポリアミン、ポリアミド樹脂、芳香族ジアミン等のアミ
ン系硬化剤、酸無水物硬化剤、ルイス酸錯化合物等が用
すられ、特に限定するものではなり、硬化促進剤として
は１１ン酸及び又は３Ｒアミン系硬化促進剤を用いる４
とが必要である。The epoxy resin used in the present invention is a curable epoxy resin having two or more epoxy groups in one molecule, such as bisphenol A epoxy resin, novolalic epoxy resin, flexible epoxy resin, and halogenated epoxy resin. There is no particular limitation, and the resin may be a goo-1 cidyl ester type epoxy V resin or a polymer type epoxy 41 resin. The crosslinking agent used is phenol resin, melamine resin, acrylic resin, urethane resin, isocyanate, etc., and is not particularly limited, and the curing agent is amine type such as aliphatic polyamine, polyamide resin, aromatic diamine, etc. A curing agent, an acid anhydride curing agent, a Lewis acid complex compound, etc. are used, and there are no particular limitations.As a curing accelerator, an 11-phosphoric acid and/or 3R amine curing accelerator is used.
is necessary.
充填剤としては炭酸カルシウム、シリカ、アルミナ、水
酸化アルミニウム、クレー タルク、ガラス粉、三酸化
アンチモン、酸化チタン等の無機粉末充填剤やガラス繊
維、アスベスト繊維、パルプ繊維、合成繊維、セラミッ
クファイバー等の繊維質充填剤を単独或は併用するもの
であるが、充填剤表面をエポキシシラン系力・、プリン
グ剤で表面処理してから用いることが必要である。エポ
キシシラン系力、プリング剤の種類は特に限定しなく表
面処理はカップ１１ング剤を溶媒で希釈してから充填剤
中にスプレーしたりして用−るもので表面処理方法につ
論では通常用因られる方法をそのまま用することができ
、特に限定するものではない。Fillers include inorganic powder fillers such as calcium carbonate, silica, alumina, aluminum hydroxide, clay talc, glass powder, antimony trioxide, and titanium oxide, as well as glass fibers, asbestos fibers, pulp fibers, synthetic fibers, and ceramic fibers. Fibrous fillers can be used alone or in combination, but it is necessary to treat the surface of the filler with an epoxysilane-based force/pulling agent before use. There are no particular restrictions on the type of epoxy silane-based pulling agent, and surface treatment is usually done by diluting a cupping agent with a solvent and then spraying it onto the filler. The method used can be used as is, and is not particularly limited.
充填剤に対するカップリング剤の添加量は充填剤１００
重量部（以下単に部と記す）に対し０．０１〜５部が好
ましい。即ち０．０１ 部未満では濡れが向上し難く
、５部をこえると成形品に対する捺印性が低下する傾向
にあるからである。離型剤、着色剤等の添加剤につ−で
は通常用いられて−るものをそのま＼用いることができ
るので特に限定するものではなり、かくして上記材料を
混合、混線、粉砕し史に必要に応じて造粒して成形材料
を得るものである。更に該成形材料の成形については、
トランスファー成形、射出成形等によるトランジスター
ダイオード、コンデンサー フィルター整流器、抵抗
体、コイル等の電子部品の多数個取り成形に適すること
は勿論、圧縮成形等にも適用できるものである。The amount of coupling agent added to the filler is 100% of the filler.
It is preferably 0.01 to 5 parts by weight (hereinafter simply referred to as parts). That is, if the amount is less than 0.01 part, it is difficult to improve wetting, and if it exceeds 5 parts, the imprintability on molded products tends to deteriorate. Additives such as mold release agents and coloring agents are not particularly limited, as commonly used additives can be used as they are. The molding material is obtained by granulation according to the conditions. Furthermore, regarding the molding of the molding material,
It is suitable for multi-cavity molding of electronic parts such as transistor diodes, capacitors, filter rectifiers, resistors, coils, etc. by transfer molding, injection molding, etc., and can also be applied to compression molding, etc.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例１乃至３と比較例
第１表記合表に従って材料を配合、混合、混練してエポ
キシ樹脂成形材料を得るが、実施例１乃至３については
充填剤を予じめカップ１１ング剤で表面処理しておいて
から用すた。次に該成形材料をトランスファー成形機を
用いて金型温度１７５℃成形圧力ｓ ｏ Ｋｇ／Ｈ、硬
化時間３分間でバイブ１１噌ドＩＣを封止成形した。Examples 1 to 3 and Comparative Example Materials are blended, mixed, and kneaded according to Table 1 to obtain an epoxy resin molding material. In Examples 1 to 3, the filler was previously coated on the surface with a cupping agent. Process it before using. Next, the molding material was sealed into an 11-piece vibrator IC using a transfer molding machine at a mold temperature of 175° C. and a molding pressure of 3 minutes.
実施例１乃至３と比較例の成形品耐湿性は第２表のよう
である。The moisture resistance of the molded products of Examples 1 to 3 and Comparative Example is shown in Table 2.
注
※ 封止品を３００℃で１０秒間半田処理後、ＰＣＴ試
験で１５１’１Ｃ１１００係湿度内でアルミニウム線の
腐食する迄の時間をみた。Note: After soldering the sealed product at 300°C for 10 seconds, the time required for the aluminum wire to corrode in a humidity of 151'1C1100 was measured using a PCT test.
本発明は上述した如く構成されてｂる。特許請求の範囲
第１項に記載した構成を有するエボギシ樹脂成形材料に
おいては耐湿性が向上する効果を有している。The present invention is constructed as described above. The evogishi resin molding material having the structure described in claim 1 has the effect of improving moisture resistance.
Claims (1)
、硬化促進剤、充填剤、離型剤、着色剤等の添加剤を添
加してなるエポキシ樹脂成形材料において、充填剤表面
をエポキシシラン系カップリング剤で表面処理してから
添加したことを特徴とするエポキシ樹脂成形材料。(1) In an epoxy resin molding material made by adding additives such as a crosslinking agent, curing agent, curing accelerator, filler, mold release agent, coloring agent, etc. to an epoxy resin as necessary, the surface of the filler is made of epoxy resin. An epoxy resin molding material that is added after surface treatment with a silane coupling agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27796088A JPH02124925A (en) | 1988-11-02 | 1988-11-02 | Epoxy resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27796088A JPH02124925A (en) | 1988-11-02 | 1988-11-02 | Epoxy resin molding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02124925A true JPH02124925A (en) | 1990-05-14 |
Family
ID=17590674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27796088A Pending JPH02124925A (en) | 1988-11-02 | 1988-11-02 | Epoxy resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02124925A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007269929A (en) * | 2006-03-30 | 2007-10-18 | Nippon Zeon Co Ltd | Curable resin composition and its application |
-
1988
- 1988-11-02 JP JP27796088A patent/JPH02124925A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007269929A (en) * | 2006-03-30 | 2007-10-18 | Nippon Zeon Co Ltd | Curable resin composition and its application |
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