JPH02124924A - Epoxy resin molding material - Google Patents
Epoxy resin molding materialInfo
- Publication number
- JPH02124924A JPH02124924A JP27795988A JP27795988A JPH02124924A JP H02124924 A JPH02124924 A JP H02124924A JP 27795988 A JP27795988 A JP 27795988A JP 27795988 A JP27795988 A JP 27795988A JP H02124924 A JPH02124924 A JP H02124924A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- filler
- molding material
- agent
- resin molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 20
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 20
- 239000012778 molding material Substances 0.000 title claims abstract description 17
- 239000000945 filler Substances 0.000 claims abstract description 17
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 13
- 239000000654 additive Substances 0.000 claims abstract description 6
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 4
- 238000004381 surface treatment Methods 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 239000006082 mold release agent Substances 0.000 claims description 3
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 2
- 239000003086 colorant Substances 0.000 claims description 2
- -1 curing accelerator Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 6
- 229920005989 resin Polymers 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 5
- 238000007789 sealing Methods 0.000 abstract description 3
- 239000000377 silicon dioxide Substances 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 2
- 239000007822 coupling agent Substances 0.000 abstract 2
- RQAGEUFKLGHJPA-UHFFFAOYSA-N prop-2-enoylsilicon Chemical compound [Si]C(=O)C=C RQAGEUFKLGHJPA-UHFFFAOYSA-N 0.000 abstract 2
- 238000004040 coloring Methods 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 4
- 239000000835 fiber Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000012765 fibrous filler Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電気部品や電子部品を封止する樹脂モール部品
に主として用すられるエポキシ樹脂成形材料に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an epoxy resin molding material mainly used for resin molding parts for sealing electrical and electronic parts.
近年、電気、電子機器の高性能化、高信頼性、生産性向
上のため、プラスチックによる封止がなされるようにな
ってきた。これらの封止用成形材料としてはエポキシ樹
脂にシＩＩ力等の粉末状無浸質充填剤を含潰させたもの
が一般に用ηら九てｂる。In recent years, in order to improve the performance, reliability, and productivity of electric and electronic equipment, plastic sealing has been used. The molding material for these sealants is generally an epoxy resin impregnated with a powdery non-permeable filler such as Silica.
最近のデバイスのパッケージ形態は、従来のＤＩＰ型か
ら高密度実装をするためにＳＯＰ、ＱＦＰ等の表面実装
対応パッケージの比高が増加してｂる。表面実装対応で
問題になってくるのは、バリケージ全体が直接に半田等
の高熱に暴露されることで、このような熱シ＠Ｑり後の
耐湿性低下が大きな問題になってくる。更に表面実装対
応バ噌ケージは従来パリケージより肉厚が薄く、リーＦ
間のビンピッチも従来の１００ミルから５０〜７５ミル
と狭くなってきており機械強度が低下しているので、組
立加工時の外力応力により密着性（ベレプウと封止材、
リードと封止材の界面）が低下するため耐湿性が低下す
ると論う問題も発生して偽る。Recent device packaging has changed from the conventional DIP type to surface-mountable packages such as SOP and QFP for high-density mounting. The problem with surface mounting is that the entire barrier cage is directly exposed to the high heat of soldering, etc., and the drop in moisture resistance after such heat shrinkage becomes a major problem. Furthermore, the wall thickness of the surface mount compatible BASO cage is thinner than that of conventional PARIS cages, and
The pitch between the bottles has become narrower, from the conventional 100 mils to 50-75 mils, reducing mechanical strength.
There is also the issue of deteriorating moisture resistance due to the deterioration of the interface between the lead and the encapsulant.
本発明は従来の技術にセける上述の問題点に鑑みてなさ
れたもので、その目的とするところは、後加工時に発生
する外的応力を低減すると共に、密着性を向上し、耐湿
性の優れたエポキシ樹脂成形材を提供することにある。The present invention was made in view of the above-mentioned problems in the conventional technology, and its purpose is to reduce external stress generated during post-processing, improve adhesion, and improve moisture resistance. Our objective is to provide excellent epoxy resin molding materials.
本発明はエポキシ樹脂に対し必要に応じて架橋剤、硬化
剤、硬化促進剤、充填剤、離型剤、雀色剤等の添加剤を
添加してなるエポキシ樹脂成形材料において、充填剤表
面をアクリルシラン系カップリング剤で表面処理してか
ら添加したことを特徴ト−ｔ−るエポキシ樹脂成形材料
のため、成形材料組成の大半を占める充填剤と樹脂分と
の濡れが向上し樹脂分と充填割分との結合が大となり成
形品としての耐湿性を向上させることができたもので、
以下本発明の詳細な説明する。The present invention provides an epoxy resin molding material in which additives such as a crosslinking agent, a curing agent, a curing accelerator, a filler, a mold release agent, and a tinting agent are added to an epoxy resin as necessary. Because it is an epoxy resin molding material that is added after surface treatment with an acrylic silane coupling agent, wetting of the filler, which makes up the majority of the molding material composition, with the resin component is improved, and the resin component is The bond with the filling part is large, and the moisture resistance of the molded product is improved.
The present invention will be explained in detail below.
本発明に用いるエポキシ樹脂としては１分子中に２個以
上のエポキシ基を有する硬化可能なエポキシ樹脂である
ならばビスフェノールＡ型エポキシ樹脂、ノボラック型
エポキシ樹脂、可撓性エポキシ樹脂、ハロゲン化エポキ
シ樹脂、グリシジルエステル型エポキシ樹脂、高分子型
エポキシ樹脂各れでもよく特に限定するものではなＡ０
架橋剤トシてはフェノール樹脂、メラミン樹脂、アクリ
ル樹脂、エリア樹脂、イソシアネート等が用いられ、特
に限定するものではない。硬化剤としては脂肪族ポリア
ミン、ポリアミド樹脂、芳香族ジアミン等のアミン系硬
化剤、酸無水物硬化剤、ルイス酸錯化合物等が用すられ
、特に限定するものではな込。硬化促進剤としては１）
ン系及び又は３級アミン系硬化促進剤を用いることが必
要である。The epoxy resin used in the present invention is a curable epoxy resin having two or more epoxy groups in one molecule, such as bisphenol A epoxy resin, novolak epoxy resin, flexible epoxy resin, and halogenated epoxy resin. , glycidyl ester type epoxy resin, or polymer type epoxy resin may be used without any particular limitation.A0
The crosslinking agent used may be a phenol resin, a melamine resin, an acrylic resin, an area resin, an isocyanate, etc., and is not particularly limited. As the curing agent, aliphatic polyamines, polyamide resins, amine curing agents such as aromatic diamines, acid anhydride curing agents, Lewis acid complex compounds, etc. are used, and there are no particular limitations. As a curing accelerator: 1)
It is necessary to use a amine type and/or tertiary amine type curing accelerator.
充填剤としては炭酸カルシウム、シリカ、アルミナ、水
酸化アルミニウム、クレー タルク、ガラス粉、三酸化
アンチモン、酸化チタン等の無機粉末充填剤やガラス繊
維、アスベスト繊維、バルフ繊維、合成繊維、セラミリ
フファイバー等の繊維質充填剤を単独或は併用するもの
であるが、充填剤表面をアクリルシラン系カー１プリン
グ剤で表面処理し、てから用しすることが必要である。Fillers include inorganic powder fillers such as calcium carbonate, silica, alumina, aluminum hydroxide, clay talc, glass powder, antimony trioxide, and titanium oxide, as well as glass fibers, asbestos fibers, bulk fibers, synthetic fibers, and ceramic rift fibers. These fibrous fillers are used alone or in combination, but it is necessary to treat the surface of the filler with an acrylic silane carp-pulling agent before use.
アクリルシラン系カップ＋１ング剤の種類は特に限定す
るものでなく、表面処理は力・Ｉプ１）ング剤を溶媒で
希釈してから充填剤中にスプレーしたりして用ｌ八るも
ので表面処理方法については通常用層らねる方法をその
まま用することができ、特に限定するものではな−、充
填剤に対するカリプリング剤の添加量は充填剤１００重
１部（以下単に部と記す）に対し０．０１〜５部が好ま
しい。即ち０．０１部未満では濡れが向上し難く、５部
をこえると成形品に対する捺印性が低下する傾向にある
からである。離型剤、着色剤等の添加剤につｂでは通常
用いられて偽るものをそのまま用いることができるので
特に限定するものではな−０かくして上記材料を混合、
混線、粉砕し更に必要に応じて造粒して成形材料を得る
ものである。更に該成形材料の成形にっ−では、トラン
スファー成形、射出成形等によるトランジスター ダイ
オード、コンデンサー フィルター 整流器、抵抗体、
コイル等の電子部品の多数個取り成形に適することは勿
論、圧縮成形等にも適用できるものである。There are no particular restrictions on the type of acrylic silane-based packing agent, and surface treatment can be carried out by diluting the packing agent with a solvent and then spraying it onto the filler. As for the surface treatment method, the usual layering method can be used as is, and there is no particular limitation.The amount of calipling agent added to the filler is 1 part by weight of 100 fillers (hereinafter simply referred to as part). It is preferably 0.01 to 5 parts. That is, if it is less than 0.01 part, it is difficult to improve wetting, and if it exceeds 5 parts, the imprintability on molded products tends to deteriorate. Additives such as mold release agents and coloring agents are not particularly limited as commonly used additives can be used as they are.
A molding material is obtained by mixing, pulverizing, and further granulating if necessary. Furthermore, in the molding of the molding material, transistors, diodes, capacitors, filters, rectifiers, resistors, etc. are manufactured by transfer molding, injection molding, etc.
Not only is it suitable for multi-cavity molding of electronic parts such as coils, but it can also be applied to compression molding and the like.
以下本発明を実施例にもとづ−で説明する。The present invention will be explained below based on examples.
実施例１乃至３と比較例
第１表の配合表に従って材料を配合、混合、混練してエ
ポキシ樹脂成形材料を得るが、実施例１乃至３について
は充填剤を予じめカー１プリング剤で表面処理しておい
てから用いた。次に該成形材料をトランスファー成形機
を用すで金型温度１７５℃、成形圧力５０ Ｋｑ／ｄ
、硬化時間３分間でハイブリッドＩＣを封止成形した。Examples 1 to 3 and Comparative Example Materials are blended, mixed, and kneaded according to the formulation table in Table 1 to obtain an epoxy resin molding material. In Examples 1 to 3, the filler was preliminarily mixed with a Car 1 pulling agent. It was used after surface treatment. Next, the molding material was molded using a transfer molding machine at a mold temperature of 175°C and a molding pressure of 50 Kq/d.
The hybrid IC was sealed and molded with a curing time of 3 minutes.
実施例１乃至３（！：比較例の成形品耐湿性は第２表の
ようである。The moisture resistance of the molded products of Examples 1 to 3 (!: Comparative Examples) is as shown in Table 2.
注
※ 封止品を３００℃でｌΩ秒間半田処理後、ＰＣＴ試
験で１５１℃、１０Ｍ湿度内でアルミニウム線の縞゛食
する迄の時間をみた。Note: After the sealed product was soldered for 1Ω seconds at 300°C, the time until the aluminum wire was corroded by stripes was measured in a PCT test at 151°C and 10M humidity.
本発明は上述した如く構成されている。特許請求の範囲
第１項に記載した構成を有するエポキシ樹脂成形材料に
おいては耐湿性が向上する効果を有してＡる。The present invention is constructed as described above. The epoxy resin molding material having the structure described in claim 1 has the effect of improving moisture resistance.
Claims (1)
、硬化促進剤、充填剤、離型剤、着色剤等の添加剤を添
加してなるエポキシ樹脂成形材料において、充填剤表面
をアクリルシラン系カップリング剤で表面処理してから
添加したことを特徴とするエポキシ樹脂成形材料。(1) In an epoxy resin molding material made by adding additives such as a crosslinking agent, curing agent, curing accelerator, filler, mold release agent, coloring agent, etc. to an epoxy resin as necessary, the surface of the filler is made of acrylic An epoxy resin molding material that is added after surface treatment with a silane coupling agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27795988A JPH02124924A (en) | 1988-11-02 | 1988-11-02 | Epoxy resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27795988A JPH02124924A (en) | 1988-11-02 | 1988-11-02 | Epoxy resin molding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02124924A true JPH02124924A (en) | 1990-05-14 |
Family
ID=17590659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27795988A Pending JPH02124924A (en) | 1988-11-02 | 1988-11-02 | Epoxy resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02124924A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018518563A (en) * | 2016-01-13 | 2018-07-12 | エルジー・ケム・リミテッド | Thermosetting resin composition for semiconductor package and prepreg using the same |
-
1988
- 1988-11-02 JP JP27795988A patent/JPH02124924A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018518563A (en) * | 2016-01-13 | 2018-07-12 | エルジー・ケム・リミテッド | Thermosetting resin composition for semiconductor package and prepreg using the same |
| US10294341B2 (en) | 2016-01-13 | 2019-05-21 | Lg Chem, Ltd. | Thermosetting resin composition for semiconductor package and prepreg using the same |
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