JPS56160054A - Resin sealing type semiconductor device - Google Patents

Resin sealing type semiconductor device

Info

Publication number
JPS56160054A
JPS56160054A JP6335080A JP6335080A JPS56160054A JP S56160054 A JPS56160054 A JP S56160054A JP 6335080 A JP6335080 A JP 6335080A JP 6335080 A JP6335080 A JP 6335080A JP S56160054 A JPS56160054 A JP S56160054A
Authority
JP
Japan
Prior art keywords
softening point
resin
semiconductor device
nonalkaline
aluminum compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6335080A
Other languages
Japanese (ja)
Inventor
Akira Yoshizumi
Kazutaka Matsumoto
Michiya Azuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP6335080A priority Critical patent/JPS56160054A/en
Publication of JPS56160054A publication Critical patent/JPS56160054A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To increase the moisture-proof and corrosion resisting properties for the subject semiconductor device by a method wherein the suitable softening point and the weight ratio for epoxy resin, silicone resin and phenol novolac resin are selected and then an organic aluminum compound and a nonalkaline inorganic substance filler are mixed. CONSTITUTION:The epoxy resin has a suitable heat-resisting property, adequate mechanical strength and an excellent workability in the state when it has equivalent weight of 250 or below and a softening point of 60-110 deg.C at 1-8wt%. The silicon resin has the hydroxyl radical which will be coupled to silicon directly, and has excellent electric and mechanical characteristics with hydroxyl radical equivalent weight of 100-500 and softening point of 60-110 deg.C at 1-8wt%. The phenol novolac resin has a suitable fusion viscosity with the softening point of 60-110 deg.C at 1-8wt%. Besides, 0.012-2wt% of organic aluminum compound, as a reaction accelerator, and 65-82wt% of nonalkaline inorganic substance filler, which will be used to prevent alkalization, are added.
JP6335080A 1980-05-15 1980-05-15 Resin sealing type semiconductor device Pending JPS56160054A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6335080A JPS56160054A (en) 1980-05-15 1980-05-15 Resin sealing type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6335080A JPS56160054A (en) 1980-05-15 1980-05-15 Resin sealing type semiconductor device

Publications (1)

Publication Number Publication Date
JPS56160054A true JPS56160054A (en) 1981-12-09

Family

ID=13226702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6335080A Pending JPS56160054A (en) 1980-05-15 1980-05-15 Resin sealing type semiconductor device

Country Status (1)

Country Link
JP (1) JPS56160054A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5765722A (en) * 1980-10-11 1982-04-21 Matsushita Electric Works Ltd Epoxy resin composition
JPS6166712A (en) * 1984-09-11 1986-04-05 Mitsubishi Electric Corp Epoxy resin composition for sealing semiconductor
JPS6259626A (en) * 1985-09-10 1987-03-16 Shin Etsu Chem Co Ltd Epoxy resin composition
US4701482A (en) * 1985-05-24 1987-10-20 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition for encapsulation of semiconductor devices
JPS62243649A (en) * 1986-04-15 1987-10-24 Nippon Retsuku Kk Resin composition for electrical insulation
JPS6356518A (en) * 1986-08-27 1988-03-11 Rishiyou Kogyo Kk Epoxy resin composition
EP0358238A2 (en) * 1988-09-09 1990-03-14 Kansai Paint Co., Ltd. Resin compositions and a method of curing the same
JPH0379657A (en) * 1989-08-23 1991-04-04 Matsushita Electric Works Ltd Preparation of epoxy resin composition
JPH0381360A (en) * 1989-08-23 1991-04-05 Matsushita Electric Works Ltd Preparation of epoxy resin composition
US5041474A (en) * 1988-02-15 1991-08-20 Lucky Ltd. Epoxy resin compositions for sealing semiconductor devices
JP2007002233A (en) * 2005-05-24 2007-01-11 Shin Etsu Chem Co Ltd Epoxy/silicone resin composition, its cured product and light-emitting semiconductor device encapsulated and protected with the composition
WO2021246213A1 (en) * 2020-06-02 2021-12-09 住友ベークライト株式会社 Phenol resin composition for friction material

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0140046B2 (en) * 1980-10-11 1989-08-24 Matsushita Electric Works Ltd
JPS5765722A (en) * 1980-10-11 1982-04-21 Matsushita Electric Works Ltd Epoxy resin composition
JPS6166712A (en) * 1984-09-11 1986-04-05 Mitsubishi Electric Corp Epoxy resin composition for sealing semiconductor
JPH0564181B2 (en) * 1984-09-11 1993-09-14 Mitsubishi Electric Corp
US4701482A (en) * 1985-05-24 1987-10-20 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition for encapsulation of semiconductor devices
JPS6259626A (en) * 1985-09-10 1987-03-16 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS6325012B2 (en) * 1985-09-10 1988-05-24 Shinetsu Chem Ind Co
JPS62243649A (en) * 1986-04-15 1987-10-24 Nippon Retsuku Kk Resin composition for electrical insulation
JPS6356518A (en) * 1986-08-27 1988-03-11 Rishiyou Kogyo Kk Epoxy resin composition
US5041474A (en) * 1988-02-15 1991-08-20 Lucky Ltd. Epoxy resin compositions for sealing semiconductor devices
EP0358238A2 (en) * 1988-09-09 1990-03-14 Kansai Paint Co., Ltd. Resin compositions and a method of curing the same
US5284919A (en) * 1988-09-09 1994-02-08 Kansai Paint Company, Limited Resin compositions and a method of curing the same
JPH0379657A (en) * 1989-08-23 1991-04-04 Matsushita Electric Works Ltd Preparation of epoxy resin composition
JPH0381360A (en) * 1989-08-23 1991-04-05 Matsushita Electric Works Ltd Preparation of epoxy resin composition
JP2007002233A (en) * 2005-05-24 2007-01-11 Shin Etsu Chem Co Ltd Epoxy/silicone resin composition, its cured product and light-emitting semiconductor device encapsulated and protected with the composition
WO2021246213A1 (en) * 2020-06-02 2021-12-09 住友ベークライト株式会社 Phenol resin composition for friction material
JPWO2021246213A1 (en) * 2020-06-02 2021-12-09

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