JPS5718754A - Epoxy-silicone resin composition - Google Patents
Epoxy-silicone resin compositionInfo
- Publication number
- JPS5718754A JPS5718754A JP9310880A JP9310880A JPS5718754A JP S5718754 A JPS5718754 A JP S5718754A JP 9310880 A JP9310880 A JP 9310880A JP 9310880 A JP9310880 A JP 9310880A JP S5718754 A JPS5718754 A JP S5718754A
- Authority
- JP
- Japan
- Prior art keywords
- formula
- epoxy
- hydrocarbon group
- composition
- substituted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE: To prepare the titled composition capable of sealing a semiconductor device perfectly and preventing the corrosion and breakage of lead wire, and having excellent moisture resistance at high temperature and pressure, by compounding a specific epoxy resin with a specific organic silicon compound.
CONSTITUTION: (A) 70W95wt% of phenolic novolak or cresol epoxy-novolak resin containing ≤2,000ppm of hydrolyzable chlorine atom is compounded with (B) 30W5wt% of an organosilanol of formula I (R1 is substituted or non-substituted monovalent hydrocarbon group; m is 1 or 2; n is 2 or 3; m+n=4), a disilhydrocarbene compound of formula II (R2 is R1; Q is aromatic bivalent hydrocarbon group; p and q are 1 or 2; p+q=3), an organopolysiloxane resin of formula (R3 is R1; Ph is phenyl which together with OH bonds directly to Si atom; R3/Si=1.05W 1.6; Ph/Si=0.2W0.99; OH content=8W10%), or their mixture. The composition is further incorporated with a filler and a curing catalyst to obtain the objective composition.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9310880A JPS5718754A (en) | 1980-07-08 | 1980-07-08 | Epoxy-silicone resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9310880A JPS5718754A (en) | 1980-07-08 | 1980-07-08 | Epoxy-silicone resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5718754A true JPS5718754A (en) | 1982-01-30 |
JPS626573B2 JPS626573B2 (en) | 1987-02-12 |
Family
ID=14073322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9310880A Granted JPS5718754A (en) | 1980-07-08 | 1980-07-08 | Epoxy-silicone resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5718754A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5876455A (en) * | 1981-11-02 | 1983-05-09 | Matsushita Electric Works Ltd | Thermosetting resin molding material for sealing and molded electronic parts using the same |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5150942A (en) * | 1974-10-31 | 1976-05-06 | Nippon Paint Co Ltd | NETSUKOKASEIHIFUKUSOSEIBUTSU |
JPS52107049A (en) * | 1976-02-23 | 1977-09-08 | Dow Corning | Curing compound for molding |
JPS53106754A (en) * | 1977-03-01 | 1978-09-18 | Dow Corning | Process of crack resistance modification of siloxane molding composition |
JPS53147799A (en) * | 1977-05-31 | 1978-12-22 | Shin Etsu Chem Co Ltd | Curable composition |
JPS562319A (en) * | 1979-06-21 | 1981-01-12 | Toshiba Corp | Epoxy resin composition |
JPS5618643A (en) * | 1979-07-25 | 1981-02-21 | Toshiba Corp | Preparation of epoxy resin composition |
JPS56160055A (en) * | 1980-05-15 | 1981-12-09 | Toshiba Corp | Resin sealing type semiconductor device |
-
1980
- 1980-07-08 JP JP9310880A patent/JPS5718754A/en active Granted
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5150942A (en) * | 1974-10-31 | 1976-05-06 | Nippon Paint Co Ltd | NETSUKOKASEIHIFUKUSOSEIBUTSU |
JPS52107049A (en) * | 1976-02-23 | 1977-09-08 | Dow Corning | Curing compound for molding |
JPS53106754A (en) * | 1977-03-01 | 1978-09-18 | Dow Corning | Process of crack resistance modification of siloxane molding composition |
JPS53147799A (en) * | 1977-05-31 | 1978-12-22 | Shin Etsu Chem Co Ltd | Curable composition |
JPS562319A (en) * | 1979-06-21 | 1981-01-12 | Toshiba Corp | Epoxy resin composition |
JPS5618643A (en) * | 1979-07-25 | 1981-02-21 | Toshiba Corp | Preparation of epoxy resin composition |
JPS56160055A (en) * | 1980-05-15 | 1981-12-09 | Toshiba Corp | Resin sealing type semiconductor device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5876455A (en) * | 1981-11-02 | 1983-05-09 | Matsushita Electric Works Ltd | Thermosetting resin molding material for sealing and molded electronic parts using the same |
Also Published As
Publication number | Publication date |
---|---|
JPS626573B2 (en) | 1987-02-12 |
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