JPS5672046A - Epoxy resin molding material - Google Patents

Epoxy resin molding material

Info

Publication number
JPS5672046A
JPS5672046A JP14884579A JP14884579A JPS5672046A JP S5672046 A JPS5672046 A JP S5672046A JP 14884579 A JP14884579 A JP 14884579A JP 14884579 A JP14884579 A JP 14884579A JP S5672046 A JPS5672046 A JP S5672046A
Authority
JP
Japan
Prior art keywords
epoxy resin
acid
salt
molding material
hardener
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14884579A
Other languages
Japanese (ja)
Inventor
Hirotoshi Iketani
Kazutaka Matsumoto
Mitsuo Yaegashi
Akiko Hatanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP14884579A priority Critical patent/JPS5672046A/en
Publication of JPS5672046A publication Critical patent/JPS5672046A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To provide the titled molding material which inhibits the corrosion of metallic electronic parts such as a sealed aluminum electrode, by a method wherein a small amount of phophoric acid (or a salt thereof) is added to an electronic part sealing compsn. consisting of an epoxy resin, a hardener and a filler.
CONSTITUTION: 100pts.wt. of a mixt. (A) consisting of an epoxy resin (i) and a hardener (ii) for the epoxy resin (e.g. a phenolic novolak, an amine or an acid anhydride), 150W400pts.wt. of an inorg. filler (B) ( e.g. crystalline silica powder or silica glass powder) and at least 0.1pt.wt. of phoshporic acid (or a salt thereof) (C) (e.g. phosphoric anhydride, orthophosphoric acid, or a metal salt or an ammonium salt thereof) are mixed together by means of a mixer and then melt-mixed by means of heating rollers, etc. to obtain the titled molding materials.
COPYRIGHT: (C)1981,JPO&Japio
JP14884579A 1979-11-19 1979-11-19 Epoxy resin molding material Pending JPS5672046A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14884579A JPS5672046A (en) 1979-11-19 1979-11-19 Epoxy resin molding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14884579A JPS5672046A (en) 1979-11-19 1979-11-19 Epoxy resin molding material

Publications (1)

Publication Number Publication Date
JPS5672046A true JPS5672046A (en) 1981-06-16

Family

ID=15462016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14884579A Pending JPS5672046A (en) 1979-11-19 1979-11-19 Epoxy resin molding material

Country Status (1)

Country Link
JP (1) JPS5672046A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57122549A (en) * 1980-11-08 1982-07-30 Plessey Overseas Plastic sealed electronic equipment
JPS582322A (en) * 1981-06-30 1983-01-07 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
FR2523141A1 (en) * 1982-03-12 1983-09-16 Nissan Motor THERMOSETTING RESIN COMPOSITION FOR INJECTION MOLDING AND ARTICLE FORMED USING THE COMPOSITION
JPS59170173A (en) * 1983-03-18 1984-09-26 Toagosei Chem Ind Co Ltd Sealing agent
JPS6259626A (en) * 1985-09-10 1987-03-16 Shin Etsu Chem Co Ltd Epoxy resin composition
EP0429180A2 (en) * 1989-10-23 1991-05-29 Courtaulds Aerospace, Inc. Non-toxic corrosion inhibitive compositions and method for inhibiting corrosion

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57122549A (en) * 1980-11-08 1982-07-30 Plessey Overseas Plastic sealed electronic equipment
JPS582322A (en) * 1981-06-30 1983-01-07 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS6217604B2 (en) * 1981-06-30 1987-04-18 Nitto Electric Ind Co
FR2523141A1 (en) * 1982-03-12 1983-09-16 Nissan Motor THERMOSETTING RESIN COMPOSITION FOR INJECTION MOLDING AND ARTICLE FORMED USING THE COMPOSITION
JPS59170173A (en) * 1983-03-18 1984-09-26 Toagosei Chem Ind Co Ltd Sealing agent
JPH0155582B2 (en) * 1983-03-18 1989-11-27 Toa Gosei Chem Ind
JPS6259626A (en) * 1985-09-10 1987-03-16 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS6325012B2 (en) * 1985-09-10 1988-05-24 Shinetsu Chem Ind Co
EP0429180A2 (en) * 1989-10-23 1991-05-29 Courtaulds Aerospace, Inc. Non-toxic corrosion inhibitive compositions and method for inhibiting corrosion
AU641437B2 (en) * 1989-10-23 1993-09-23 Lockheed Corporation Non-toxic corrosion inhibitive compositions and methods therefor
CN1041849C (en) * 1989-10-23 1999-01-27 考陶尔斯航空航天有限公司 Non-toxic corrosion inhibitive compositions and methods therefor
CN1123607C (en) * 1989-10-23 2003-10-08 Prc-德索托国际公司 Non-toxic corrosion inhibitive polymers composition and method therefor

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