KR880002928A - Liquid epoxy resin composition - Google Patents

Liquid epoxy resin composition Download PDF

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Publication number
KR880002928A
KR880002928A KR1019870008900A KR870008900A KR880002928A KR 880002928 A KR880002928 A KR 880002928A KR 1019870008900 A KR1019870008900 A KR 1019870008900A KR 870008900 A KR870008900 A KR 870008900A KR 880002928 A KR880002928 A KR 880002928A
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South Korea
Prior art keywords
epoxy resin
resin composition
liquid
liquid epoxy
composition according
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KR1019870008900A
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Korean (ko)
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KR950004724B1 (en
Inventor
시게오 다까쓰지
노베도미오
마사히꼬 야마나까
쇼오지 다니
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무라이 고오이찌
신니뽕 리까 가부시끼가이샤
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Publication of KR880002928A publication Critical patent/KR880002928A/en
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/12—Hydrides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/66—Substances characterised by their function in the composition
    • C08L2666/78—Stabilisers against oxidation, heat, light or ozone
    • C08L2666/82—Phosphorus-containing stabilizers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/66—Substances characterised by their function in the composition
    • C08L2666/84—Flame-proofing or flame-retarding additives

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

내용 없음No content

Description

액상 에폭시 수지 조성물Liquid epoxy resin composition

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (12)

(A)에폭시수지 (B) 수화알루미나를 함유하는 무기충전제 (C) 액상카르복실산 무수물 및 (D) 유기 포스핀 화합물을 함유하는 경화촉진제를 배합하여서 됨을 특징으로 하는 액상 에폭시수지 조성물.(A) Epoxy resin (B) Inorganic filler containing hydrated alumina (C) Liquid carboxylic anhydride and (D) Curing accelerator containing organic phosphine compound are mix | blended, The liquid epoxy resin composition characterized by the above-mentioned. 제1항에 있어서, 에폭시수지(A)가, 액상에폭시수지로서 그 에폭시 당량이 최대 300임을 특징으로 하는 액상에폭시수지 조성물.The liquid epoxy resin composition according to claim 1, wherein the epoxy resin (A) is a liquid epoxy resin having an epoxy equivalent of at most 300. 제1항에 있어서, 에폭시수지(A) 100중량부에 대하여 무기충전제(B)로서 수화알루미나를 85∼190중량부 배합함을 특징으로 하는 액상 에폭시수지 조성물.The liquid epoxy resin composition according to claim 1, wherein 85 to 190 parts by weight of hydrated alumina is blended as an inorganic filler (B) based on 100 parts by weight of epoxy resin (A). 제1항에 있어서 에폭시수지(A) 100중량부에 대하여, 무기충전제(B)로서 수화알루미나를 85∼190중량부, 탄산칼슘을, 75∼150중량부 및/또는 2산화규소를 0∼90중량부를 배합하고, 무기 충전제의 총량이 160∼300중량부임을 특징으로 하는 액상 에폭시 수지 조성물.The inorganic filler (B) is 85 to 190 parts by weight of hydrated alumina, 75 to 150 parts by weight of calcium carbonate, and / or 0 to 90 parts of silicon dioxide according to claim 1 with respect to 100 parts by weight of epoxy resin (A). A liquid epoxy resin composition comprising a weight part and a total amount of the inorganic filler is 160 to 300 parts by weight. 제1항에 있어서, 액상 카르복실산 무수물(C)가 25℃에서 액상임을 특징으로 하는 액상 에폭시 수지 조성물.The liquid epoxy resin composition according to claim 1, wherein the liquid carboxylic anhydride (C) is a liquid at 25 ° C. 제1항에 있어서, 액상 카르복실산 무수물(C)가 메틸레트라히드로 무수프탈산 임을 특징으로 하는 액상 에폭시 수지 조성물.The liquid epoxy resin composition according to claim 1, wherein the liquid carboxylic acid anhydride (C) is methylenetrahydrophthalic anhydride. 제1항에 있어서 액상 카르복실산 무수물(C)가 3-메틸테트라히드로 무수프탈산을 50중량% 이상 함유함을 특징으로 하는 액상 에폭시수지 조성물.The liquid epoxy resin composition according to claim 1, wherein the liquid carboxylic anhydride (C) contains 50% by weight or more of 3-methyltetrahydrophthalic anhydride. 제1항에 있어서, 경화촉진제(D)로서의 유기포스핀 화합물이 트리페닐 포스핀 임을 특징으로 하는 액상 에폭시수지 조성물.The liquid epoxy resin composition according to claim 1, wherein the organophosphine compound as the curing accelerator (D) is triphenyl phosphine. 제1항에 있어서 경화촉진제(D)가 유기 포스핀 화합물과 아민게 화합물로써 됨을 특징으로 하는 액상 에폭시수지 조성물.The liquid epoxy resin composition according to claim 1, wherein the curing accelerator (D) comprises an organic phosphine compound and an amine compound. 제1 또는 9항에 있어서, 경화촉진제(D)로서의 아민게 화합물이 이미다졸류 및 제3급 아민으로써된 군으로부터 선택된 1종 이상의 화화물 임을 특징으로 하는 액상 에폭시수지 조성물.The liquid epoxy resin composition according to claim 1 or 9, wherein the amine crab compound as the curing accelerator (D) is at least one sulfide selected from the group consisting of imidazoles and tertiary amines. 제1항에 있어서, 난연제를 다시 배합하는 액상 에폭시수지 조성물.The liquid epoxy resin composition according to claim 1, wherein the flame retardant is blended again. 제11항에 있어서, 난연제가 인계화합물, 안티몬계 화합물 및 할로겐 화합물로써된 군으로부터 선택된 1종 이상의 화합물 임을 특징으로 하는 액상 에폭시수지 조성물.12. The liquid epoxy resin composition according to claim 11, wherein the flame retardant is at least one compound selected from the group consisting of phosphorus compounds, antimony compounds and halogen compounds. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019870008900A 1986-08-13 1987-08-13 Compositions of epoxy-resin KR950004724B1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP61-190749 1986-08-13
JP19074986 1986-08-13
JP190749 1986-08-13
JP135398 1987-05-30
JP62135398A JPH066622B2 (en) 1986-08-13 1987-05-30 Liquid epoxy resin composition
JP62-135398 1987-05-30

Publications (2)

Publication Number Publication Date
KR880002928A true KR880002928A (en) 1988-05-12
KR950004724B1 KR950004724B1 (en) 1995-05-06

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ID=16263104

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Application Number Title Priority Date Filing Date
KR1019870008900A KR950004724B1 (en) 1986-08-13 1987-08-13 Compositions of epoxy-resin

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JP (1) JPH066622B2 (en)
KR (1) KR950004724B1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2712425B2 (en) * 1988-11-22 1998-02-10 大日本インキ化学工業株式会社 Curable resin composition
GB9224854D0 (en) * 1992-11-27 1993-01-13 Ciba Geigy Ag Moulding process
FR2723334A1 (en) * 1994-08-05 1996-02-09 Volpi Marie Rose Cast resin body parts for heating appliances
JP4875581B2 (en) * 2007-09-28 2012-02-15 関西ペイント株式会社 Multi-layer coating formation method
JP5556133B2 (en) * 2009-03-31 2014-07-23 日立化成株式会社 Liquid resin composition for electronic components and electronic component device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5723626A (en) * 1980-07-17 1982-02-06 Toshiba Corp Epoxy resin composition
JPS6050371B2 (en) * 1981-10-30 1985-11-08 株式会社東芝 epoxy resin composition
JPS5884820A (en) * 1981-11-13 1983-05-21 Mitsubishi Chem Ind Ltd Epoxy resin composition

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JPH066622B2 (en) 1994-01-26
KR950004724B1 (en) 1995-05-06
JPS63152615A (en) 1988-06-25

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