JPS5776024A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS5776024A JPS5776024A JP15334180A JP15334180A JPS5776024A JP S5776024 A JPS5776024 A JP S5776024A JP 15334180 A JP15334180 A JP 15334180A JP 15334180 A JP15334180 A JP 15334180A JP S5776024 A JPS5776024 A JP S5776024A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- curing agent
- resin composition
- curing
- vinylphenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: An epoxy resin composition, prepared by incorporatig epoxy resin with poly-p-vinylphenol, etc. as a curing agent and a specific silane compound having an alkoxyl group as a curing assistant, having a long gelling time, and capable of giving a cured article rich in heat resistance.
CONSTITUTION: An epoxy resin composition prepared by incorporating an epoxy resin with poly-p-vinylphenol or a halogen compound thereof or both as a curing agent and a silane compound having an alkoxyl group of the formula (R' is alkyl or aryl; R is alkyl; n is 0 or an integer 1W4), e.g. tetraethoxysilane. The amount of the curing agent is preferably as follows: The molar ratio between the epoxy groups in the epoxy resin and the active hydrogen atoms in the curing agent is 0.5W20, and the amount of the curing agent is 0.05W5.0pts.wt. based on 100pts.wt. epoxy resin.
EFFECT: The storage stability will not be deteriorated even by the addition of another curing assistant.
USE: For a prepreg used in a printed-wiring base board.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15334180A JPS5776024A (en) | 1980-10-30 | 1980-10-30 | Epoxy resin composition |
DE19813117960 DE3117960A1 (en) | 1980-05-10 | 1981-05-07 | EPOXY RESIN COMPOSITION |
US06/261,908 US4399257A (en) | 1980-05-10 | 1981-05-08 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15334180A JPS5776024A (en) | 1980-10-30 | 1980-10-30 | Epoxy resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5776024A true JPS5776024A (en) | 1982-05-12 |
JPS6155523B2 JPS6155523B2 (en) | 1986-11-28 |
Family
ID=15560349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15334180A Granted JPS5776024A (en) | 1980-05-10 | 1980-10-30 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5776024A (en) |
-
1980
- 1980-10-30 JP JP15334180A patent/JPS5776024A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6155523B2 (en) | 1986-11-28 |
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