JPS5776024A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS5776024A
JPS5776024A JP15334180A JP15334180A JPS5776024A JP S5776024 A JPS5776024 A JP S5776024A JP 15334180 A JP15334180 A JP 15334180A JP 15334180 A JP15334180 A JP 15334180A JP S5776024 A JPS5776024 A JP S5776024A
Authority
JP
Japan
Prior art keywords
epoxy resin
curing agent
resin composition
curing
vinylphenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15334180A
Other languages
Japanese (ja)
Other versions
JPS6155523B2 (en
Inventor
Masaaki Otsu
Masahiro Matsumura
Yoshihiro Kitsuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP15334180A priority Critical patent/JPS5776024A/en
Priority to DE19813117960 priority patent/DE3117960A1/en
Priority to US06/261,908 priority patent/US4399257A/en
Publication of JPS5776024A publication Critical patent/JPS5776024A/en
Publication of JPS6155523B2 publication Critical patent/JPS6155523B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: An epoxy resin composition, prepared by incorporatig epoxy resin with poly-p-vinylphenol, etc. as a curing agent and a specific silane compound having an alkoxyl group as a curing assistant, having a long gelling time, and capable of giving a cured article rich in heat resistance.
CONSTITUTION: An epoxy resin composition prepared by incorporating an epoxy resin with poly-p-vinylphenol or a halogen compound thereof or both as a curing agent and a silane compound having an alkoxyl group of the formula (R' is alkyl or aryl; R is alkyl; n is 0 or an integer 1W4), e.g. tetraethoxysilane. The amount of the curing agent is preferably as follows: The molar ratio between the epoxy groups in the epoxy resin and the active hydrogen atoms in the curing agent is 0.5W20, and the amount of the curing agent is 0.05W5.0pts.wt. based on 100pts.wt. epoxy resin.
EFFECT: The storage stability will not be deteriorated even by the addition of another curing assistant.
USE: For a prepreg used in a printed-wiring base board.
COPYRIGHT: (C)1982,JPO&Japio
JP15334180A 1980-05-10 1980-10-30 Epoxy resin composition Granted JPS5776024A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP15334180A JPS5776024A (en) 1980-10-30 1980-10-30 Epoxy resin composition
DE19813117960 DE3117960A1 (en) 1980-05-10 1981-05-07 EPOXY RESIN COMPOSITION
US06/261,908 US4399257A (en) 1980-05-10 1981-05-08 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15334180A JPS5776024A (en) 1980-10-30 1980-10-30 Epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS5776024A true JPS5776024A (en) 1982-05-12
JPS6155523B2 JPS6155523B2 (en) 1986-11-28

Family

ID=15560349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15334180A Granted JPS5776024A (en) 1980-05-10 1980-10-30 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5776024A (en)

Also Published As

Publication number Publication date
JPS6155523B2 (en) 1986-11-28

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