JPS5776025A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS5776025A
JPS5776025A JP15334280A JP15334280A JPS5776025A JP S5776025 A JPS5776025 A JP S5776025A JP 15334280 A JP15334280 A JP 15334280A JP 15334280 A JP15334280 A JP 15334280A JP S5776025 A JPS5776025 A JP S5776025A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
vinylphenol
incorporating
poly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15334280A
Other languages
Japanese (ja)
Inventor
Masaaki Otsu
Masahiro Matsumura
Yoshihiro Kitsuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP15334280A priority Critical patent/JPS5776025A/en
Priority to DE19813117960 priority patent/DE3117960A1/en
Priority to US06/261,908 priority patent/US4399257A/en
Publication of JPS5776025A publication Critical patent/JPS5776025A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: An epoxy resin composition, prepared by incorporating poly-p-vinylphenol, etc. with an aluminic ester, having a long gelling time, rich in heat resistance, and most suitable to a prepreg for a printed-wiring base board, etc.
CONSTITUTION: An epoxy resin composition prepared by incorporating an epoxy resin with poly-p-vinylphenol and a halide thereof as a curing agent at a molar ratio between the epoxy groups in the epoxy resin and the active hydrogen atoms in the curing agent of 0.5W20 and then a aluminic ester, preferably aluminum ethoxide or aluminum tert-butoxide, of the frmula (n is an integer 1W5; R is alkyl or aryl) in an amount of 0.05W5.0pts.wt. based on 100pts.wt. epoxy resin.
EFFECT: The storage stability will not be deteriorated even by the addition of another curing assistant.
COPYRIGHT: (C)1982,JPO&Japio
JP15334280A 1980-05-10 1980-10-30 Epoxy resin composition Pending JPS5776025A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP15334280A JPS5776025A (en) 1980-10-30 1980-10-30 Epoxy resin composition
DE19813117960 DE3117960A1 (en) 1980-05-10 1981-05-07 EPOXY RESIN COMPOSITION
US06/261,908 US4399257A (en) 1980-05-10 1981-05-08 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15334280A JPS5776025A (en) 1980-10-30 1980-10-30 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS5776025A true JPS5776025A (en) 1982-05-12

Family

ID=15560369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15334280A Pending JPS5776025A (en) 1980-05-10 1980-10-30 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5776025A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57123A (en) * 1980-05-31 1982-01-05 Matsushita Electric Works Ltd Epoxy resin composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57123A (en) * 1980-05-31 1982-01-05 Matsushita Electric Works Ltd Epoxy resin composition

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