JPS5626926A - Epoxy resin molding material for sealing electronic part - Google Patents
Epoxy resin molding material for sealing electronic partInfo
- Publication number
- JPS5626926A JPS5626926A JP10135679A JP10135679A JPS5626926A JP S5626926 A JPS5626926 A JP S5626926A JP 10135679 A JP10135679 A JP 10135679A JP 10135679 A JP10135679 A JP 10135679A JP S5626926 A JPS5626926 A JP S5626926A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- molding material
- resin molding
- ion content
- blended
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE: To provide titled epoxy resin molding material in which the corrosion in metal electrodes of electronic parts is improved, by a method wherein a novolak resin having a chlorine ion content of not more than a specified value as a hardener is blended with an epoxy resin having a hydrolyzable chlorine content and a chlorine ion content of not more than a specified value.
CONSTITUTION: A novolak resin having a chlorine ion content of not more than 10ppm as a hardener is blended with an epoxy resin having a hydrolyzable chlorine content of not more than 0.1wt% and a chlorine ion content of not more than 10ppm. When part of the epoxy resin in the above blend is replaced by a brominated epoxy resin and further antimony trioxide is blended, there can be obtd. a flame- retarded epoxy resin molding material in which corrosive properties are remarkably reduced.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10135679A JPS5626926A (en) | 1979-08-10 | 1979-08-10 | Epoxy resin molding material for sealing electronic part |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10135679A JPS5626926A (en) | 1979-08-10 | 1979-08-10 | Epoxy resin molding material for sealing electronic part |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5626926A true JPS5626926A (en) | 1981-03-16 |
Family
ID=14298547
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10135679A Pending JPS5626926A (en) | 1979-08-10 | 1979-08-10 | Epoxy resin molding material for sealing electronic part |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5626926A (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57212224A (en) * | 1981-06-24 | 1982-12-27 | Nitto Electric Ind Co Ltd | Epoxy resin composition for encapsulation of semiconductor |
JPS582322A (en) * | 1981-06-30 | 1983-01-07 | Nitto Electric Ind Co Ltd | Epoxy resin composition for encapsulation of semiconductor |
JPS58112352A (en) * | 1981-12-26 | 1983-07-04 | Nitto Electric Ind Co Ltd | Epoxy resin composition for semiconductor memory element sealing |
JPS6018519A (en) * | 1983-07-09 | 1985-01-30 | Matsushita Electric Works Ltd | Epoxy resin composition |
JPS6067558A (en) * | 1983-09-22 | 1985-04-17 | Denki Kagaku Kogyo Kk | Semiconductor-sealing epoxy resin composition |
JPS61113641A (en) * | 1984-11-09 | 1986-05-31 | Sumitomo Bakelite Co Ltd | Phenolic resin composition for electrolytic corrosion resistance use |
JPS61181816A (en) * | 1985-02-06 | 1986-08-14 | Sumitomo Bakelite Co Ltd | Production of modified epoxy resin |
JPS61181820A (en) * | 1985-02-06 | 1986-08-14 | Sumitomo Bakelite Co Ltd | Thermosetting resin composition |
JPS61247725A (en) * | 1985-04-26 | 1986-11-05 | Sumitomo Bakelite Co Ltd | Epoxy resin molding material for sealing semiconductor |
JPS6259626A (en) * | 1985-09-10 | 1987-03-16 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
JPS62290720A (en) * | 1986-06-11 | 1987-12-17 | Hitachi Chem Co Ltd | Epoxy resin molding material for sealing electronic component |
JPH03165413A (en) * | 1989-11-24 | 1991-07-17 | Toshiba Corp | Puffer type gas breaker |
JPH08100049A (en) * | 1994-09-30 | 1996-04-16 | Dainippon Ink & Chem Inc | Epoxy resin composition for semiconductor-sealing material |
-
1979
- 1979-08-10 JP JP10135679A patent/JPS5626926A/en active Pending
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS627212B2 (en) * | 1981-06-24 | 1987-02-16 | Nitto Electric Ind Co | |
JPS57212224A (en) * | 1981-06-24 | 1982-12-27 | Nitto Electric Ind Co Ltd | Epoxy resin composition for encapsulation of semiconductor |
JPS582322A (en) * | 1981-06-30 | 1983-01-07 | Nitto Electric Ind Co Ltd | Epoxy resin composition for encapsulation of semiconductor |
JPS6217604B2 (en) * | 1981-06-30 | 1987-04-18 | Nitto Electric Ind Co | |
JPS58112352A (en) * | 1981-12-26 | 1983-07-04 | Nitto Electric Ind Co Ltd | Epoxy resin composition for semiconductor memory element sealing |
JPS6018519A (en) * | 1983-07-09 | 1985-01-30 | Matsushita Electric Works Ltd | Epoxy resin composition |
JPS6244013B2 (en) * | 1983-07-09 | 1987-09-17 | Matsushita Electric Works Ltd | |
JPS6067558A (en) * | 1983-09-22 | 1985-04-17 | Denki Kagaku Kogyo Kk | Semiconductor-sealing epoxy resin composition |
JPH0223576B2 (en) * | 1984-11-09 | 1990-05-24 | Sumitomo Bakelite Co | |
JPS61113641A (en) * | 1984-11-09 | 1986-05-31 | Sumitomo Bakelite Co Ltd | Phenolic resin composition for electrolytic corrosion resistance use |
JPS61181820A (en) * | 1985-02-06 | 1986-08-14 | Sumitomo Bakelite Co Ltd | Thermosetting resin composition |
JPS61181816A (en) * | 1985-02-06 | 1986-08-14 | Sumitomo Bakelite Co Ltd | Production of modified epoxy resin |
JPH058729B2 (en) * | 1985-02-06 | 1993-02-03 | Sumitomo Bakelite Co | |
JPH0521133B2 (en) * | 1985-02-06 | 1993-03-23 | Sumitomo Bakelite Co | |
JPS61247725A (en) * | 1985-04-26 | 1986-11-05 | Sumitomo Bakelite Co Ltd | Epoxy resin molding material for sealing semiconductor |
JPS6259626A (en) * | 1985-09-10 | 1987-03-16 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
JPS6325012B2 (en) * | 1985-09-10 | 1988-05-24 | Shinetsu Chem Ind Co | |
JPS62290720A (en) * | 1986-06-11 | 1987-12-17 | Hitachi Chem Co Ltd | Epoxy resin molding material for sealing electronic component |
JPH03165413A (en) * | 1989-11-24 | 1991-07-17 | Toshiba Corp | Puffer type gas breaker |
JPH08100049A (en) * | 1994-09-30 | 1996-04-16 | Dainippon Ink & Chem Inc | Epoxy resin composition for semiconductor-sealing material |
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