JPS5626926A - Epoxy resin molding material for sealing electronic part - Google Patents

Epoxy resin molding material for sealing electronic part

Info

Publication number
JPS5626926A
JPS5626926A JP10135679A JP10135679A JPS5626926A JP S5626926 A JPS5626926 A JP S5626926A JP 10135679 A JP10135679 A JP 10135679A JP 10135679 A JP10135679 A JP 10135679A JP S5626926 A JPS5626926 A JP S5626926A
Authority
JP
Japan
Prior art keywords
epoxy resin
molding material
resin molding
ion content
blended
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10135679A
Other languages
Japanese (ja)
Inventor
Hirotoshi Iketani
Mitsuo Yaegashi
Kazutaka Matsumoto
Akiko Hatanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP10135679A priority Critical patent/JPS5626926A/en
Publication of JPS5626926A publication Critical patent/JPS5626926A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To provide titled epoxy resin molding material in which the corrosion in metal electrodes of electronic parts is improved, by a method wherein a novolak resin having a chlorine ion content of not more than a specified value as a hardener is blended with an epoxy resin having a hydrolyzable chlorine content and a chlorine ion content of not more than a specified value.
CONSTITUTION: A novolak resin having a chlorine ion content of not more than 10ppm as a hardener is blended with an epoxy resin having a hydrolyzable chlorine content of not more than 0.1wt% and a chlorine ion content of not more than 10ppm. When part of the epoxy resin in the above blend is replaced by a brominated epoxy resin and further antimony trioxide is blended, there can be obtd. a flame- retarded epoxy resin molding material in which corrosive properties are remarkably reduced.
COPYRIGHT: (C)1981,JPO&Japio
JP10135679A 1979-08-10 1979-08-10 Epoxy resin molding material for sealing electronic part Pending JPS5626926A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10135679A JPS5626926A (en) 1979-08-10 1979-08-10 Epoxy resin molding material for sealing electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10135679A JPS5626926A (en) 1979-08-10 1979-08-10 Epoxy resin molding material for sealing electronic part

Publications (1)

Publication Number Publication Date
JPS5626926A true JPS5626926A (en) 1981-03-16

Family

ID=14298547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10135679A Pending JPS5626926A (en) 1979-08-10 1979-08-10 Epoxy resin molding material for sealing electronic part

Country Status (1)

Country Link
JP (1) JPS5626926A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57212224A (en) * 1981-06-24 1982-12-27 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS582322A (en) * 1981-06-30 1983-01-07 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS58112352A (en) * 1981-12-26 1983-07-04 Nitto Electric Ind Co Ltd Epoxy resin composition for semiconductor memory element sealing
JPS6018519A (en) * 1983-07-09 1985-01-30 Matsushita Electric Works Ltd Epoxy resin composition
JPS6067558A (en) * 1983-09-22 1985-04-17 Denki Kagaku Kogyo Kk Semiconductor-sealing epoxy resin composition
JPS61113641A (en) * 1984-11-09 1986-05-31 Sumitomo Bakelite Co Ltd Phenolic resin composition for electrolytic corrosion resistance use
JPS61181816A (en) * 1985-02-06 1986-08-14 Sumitomo Bakelite Co Ltd Production of modified epoxy resin
JPS61181820A (en) * 1985-02-06 1986-08-14 Sumitomo Bakelite Co Ltd Thermosetting resin composition
JPS61247725A (en) * 1985-04-26 1986-11-05 Sumitomo Bakelite Co Ltd Epoxy resin molding material for sealing semiconductor
JPS6259626A (en) * 1985-09-10 1987-03-16 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS62290720A (en) * 1986-06-11 1987-12-17 Hitachi Chem Co Ltd Epoxy resin molding material for sealing electronic component
JPH03165413A (en) * 1989-11-24 1991-07-17 Toshiba Corp Puffer type gas breaker
JPH08100049A (en) * 1994-09-30 1996-04-16 Dainippon Ink & Chem Inc Epoxy resin composition for semiconductor-sealing material

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS627212B2 (en) * 1981-06-24 1987-02-16 Nitto Electric Ind Co
JPS57212224A (en) * 1981-06-24 1982-12-27 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS582322A (en) * 1981-06-30 1983-01-07 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS6217604B2 (en) * 1981-06-30 1987-04-18 Nitto Electric Ind Co
JPS58112352A (en) * 1981-12-26 1983-07-04 Nitto Electric Ind Co Ltd Epoxy resin composition for semiconductor memory element sealing
JPS6018519A (en) * 1983-07-09 1985-01-30 Matsushita Electric Works Ltd Epoxy resin composition
JPS6244013B2 (en) * 1983-07-09 1987-09-17 Matsushita Electric Works Ltd
JPS6067558A (en) * 1983-09-22 1985-04-17 Denki Kagaku Kogyo Kk Semiconductor-sealing epoxy resin composition
JPH0223576B2 (en) * 1984-11-09 1990-05-24 Sumitomo Bakelite Co
JPS61113641A (en) * 1984-11-09 1986-05-31 Sumitomo Bakelite Co Ltd Phenolic resin composition for electrolytic corrosion resistance use
JPS61181820A (en) * 1985-02-06 1986-08-14 Sumitomo Bakelite Co Ltd Thermosetting resin composition
JPS61181816A (en) * 1985-02-06 1986-08-14 Sumitomo Bakelite Co Ltd Production of modified epoxy resin
JPH058729B2 (en) * 1985-02-06 1993-02-03 Sumitomo Bakelite Co
JPH0521133B2 (en) * 1985-02-06 1993-03-23 Sumitomo Bakelite Co
JPS61247725A (en) * 1985-04-26 1986-11-05 Sumitomo Bakelite Co Ltd Epoxy resin molding material for sealing semiconductor
JPS6259626A (en) * 1985-09-10 1987-03-16 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS6325012B2 (en) * 1985-09-10 1988-05-24 Shinetsu Chem Ind Co
JPS62290720A (en) * 1986-06-11 1987-12-17 Hitachi Chem Co Ltd Epoxy resin molding material for sealing electronic component
JPH03165413A (en) * 1989-11-24 1991-07-17 Toshiba Corp Puffer type gas breaker
JPH08100049A (en) * 1994-09-30 1996-04-16 Dainippon Ink & Chem Inc Epoxy resin composition for semiconductor-sealing material

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