JPS57153455A - Resin molded type semiconductor device - Google Patents

Resin molded type semiconductor device

Info

Publication number
JPS57153455A
JPS57153455A JP56037832A JP3783281A JPS57153455A JP S57153455 A JPS57153455 A JP S57153455A JP 56037832 A JP56037832 A JP 56037832A JP 3783281 A JP3783281 A JP 3783281A JP S57153455 A JPS57153455 A JP S57153455A
Authority
JP
Japan
Prior art keywords
added
resin
novolak
epoxy
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56037832A
Other languages
Japanese (ja)
Other versions
JPS6012786B2 (en
Inventor
Hirotoshi Iketani
Akiko Hatanaka
Shiyuichi Suzuki
Moriyasu Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56037832A priority Critical patent/JPS6012786B2/en
Publication of JPS57153455A publication Critical patent/JPS57153455A/en
Publication of JPS6012786B2 publication Critical patent/JPS6012786B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To obtain a plastic molded device of high reliability with the composition wherein novolak phenol resin hardening agent is added to novolak type epoxy resin of 170-300 in epoxy equivalent and further a predetermined amount of organic phosphine, oxide crystalline wax and inorganic charging agent are added. CONSTITUTION:Phenol novolak resin as hardening agent is mixed with phenol novolak epoxy resin of 170-300 in epoxy equivalent and a ratio of a number of hydroxyl groups to epoxy group is maintained at 0.5-1.5. Further, triphenyl phosphine is added within the range of 0.01-10wt% of resin component and oxide cystalline wax is added within the range of 0.01-10wt% to the resin component and a quartz glass powder is added as the charging agent and mix- processed to form a plastic material. When a plastic molded semiconductor device is formed by using the foregoing plastic material, it has a high wet-proof property, a disconnection or a leakage is not occurred even under the high temperature and high humidity condition, and a high reliability can be maintained over a long period of time.
JP56037832A 1981-03-18 1981-03-18 Resin-encapsulated semiconductor device Expired JPS6012786B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56037832A JPS6012786B2 (en) 1981-03-18 1981-03-18 Resin-encapsulated semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56037832A JPS6012786B2 (en) 1981-03-18 1981-03-18 Resin-encapsulated semiconductor device

Publications (2)

Publication Number Publication Date
JPS57153455A true JPS57153455A (en) 1982-09-22
JPS6012786B2 JPS6012786B2 (en) 1985-04-03

Family

ID=12508495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56037832A Expired JPS6012786B2 (en) 1981-03-18 1981-03-18 Resin-encapsulated semiconductor device

Country Status (1)

Country Link
JP (1) JPS6012786B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002249549A (en) * 2001-02-26 2002-09-06 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP4538972B2 (en) * 2001-02-26 2010-09-08 住友ベークライト株式会社 Epoxy resin composition and semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002249549A (en) * 2001-02-26 2002-09-06 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP4538972B2 (en) * 2001-02-26 2010-09-08 住友ベークライト株式会社 Epoxy resin composition and semiconductor device
JP4538971B2 (en) * 2001-02-26 2010-09-08 住友ベークライト株式会社 Epoxy resin composition and semiconductor device

Also Published As

Publication number Publication date
JPS6012786B2 (en) 1985-04-03

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